公开(公告)号：US09560771B2

公开(公告)日：2017-01-31

申请号：US13686552

申请日：2012-11-27

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Ying-Tang Su ,  Wei-Feng Lin ,  Kah-Ong Tan

IPC: H05K1/11 ,  H05K1/18 ,  H05K13/04 ,  H05K3/34 ,  H04N5/225 ,  H01L27/146 ,  H01L23/498

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/10121 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/0001

Abstract: An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere.

Abstract translation: 一种装置包括具有表面的基板和布置在表面上的多个焊球以形成球栅阵列。 多个焊球的一部分被布置成在相邻的焊球之间具有间距。 具有间距的相邻焊球具有截顶球的形状。 多个焊球中的至少一个焊球被包括在具有与截头球形状不同的形状的表面上的焊锡岛中。

公开(公告)号：US20140146505A1

公开(公告)日：2014-05-29

申请号：US13686552

申请日：2012-11-27

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Ying-Tang Su ,  Wei-Feng Lin ,  Kah-Ong Tan

IPC: H05K1/18 ,  H05K13/04 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/10121 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/0001

Abstract: An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere.

Abstract translation: 一种装置包括具有表面的基板和布置在表面上的多个焊球以形成球栅阵列。 多个焊球的一部分被布置成在相邻的焊球之间具有间距。 具有间距的相邻焊球具有截顶球的形状。 多个焊球中的至少一个焊球被包括在具有与截头球形状不同的形状的表面上的焊锡岛中。