Invention Grant
US09570457B2 Method to control the common drain of a pair of control gates and to improve inter-layer dielectric (ILD) filling between the control gates
有权
控制一对控制栅极的共同漏极并改善控制栅之间的层间电介质(ILD)填充的方法
- Patent Title: Method to control the common drain of a pair of control gates and to improve inter-layer dielectric (ILD) filling between the control gates
- Patent Title (中): 控制一对控制栅极的共同漏极并改善控制栅之间的层间电介质(ILD)填充的方法
-
Application No.: US14468410Application Date: 2014-08-26
-
Publication No.: US09570457B2Publication Date: 2017-02-14
- Inventor: Chung-Chiang Min , Tsung-Hsueh Yang , Chang-Ming Wu , Shih-Chang Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/792 ; H01L29/66 ; H01L21/28 ; H01L21/033 ; H01L21/311 ; H01L21/3105 ; H01L29/423

Abstract:
A semiconductor structure for a split gate flash memory cell device with a hard mask having an asymmetric profile is provided. A semiconductor substrate of the semiconductor structure includes a first source/drain region and a second source/drain region. A control gate and a memory gate, of the semiconductor structure, are spaced over the semiconductor substrate between the first and second source/drain regions. A charge trapping dielectric structure of the semiconductor structure is arranged between neighboring sidewalls of the memory gate and the control gate, and arranged under the memory gate. A hard mask of the semiconductor structure is arranged over the control gate and includes an asymmetric profile. The asymmetric profile tapers in height away from the memory gate. A method for manufacturing a pair of split gate flash memory cell devices with hard masks having an asymmetric profile is also provided.
Public/Granted literature
Information query
IPC分类: