Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
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Application No.: US15404703Application Date: 2017-01-12
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Publication No.: US09899487B2Publication Date: 2018-02-20
- Inventor: Myeong-Dong Lee , Hye-Young Kang , Young-Sin Kim , Yong-Kwan Kim , Byoung-Wook Jang , Augustin Jinwoo Hong , Dong-Sik Kong , Chang-Hyun Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0027435 20160308
- Main IPC: H01L27/148
- IPC: H01L27/148 ; H01L29/80 ; H01L29/76 ; H01L29/94 ; H01L21/336 ; H01L29/423 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device may include a linear gate trench that crosses an active region of a substrate of the semiconductor device. The active region may include a plurality of gate areas at a bottom of the gate trench and junction areas at a surface of the substrate in a central portion and opposite end portions of the active region. A conductive line may be in a lower portion of the gate trench. The conductive line may include a gate line and a capping layer that at least partially isolates the gate line from an upper surface of the conductive line. A sealing line may be in an upper portion of the gate trench. The sealing line may cover the conductive line and a surface of the sealing line may be coplanar with the junction areas.
Public/Granted literature
- US20170263723A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2017-09-14
Information query
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