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公开(公告)号：EP2462634A1
公开(公告)日：2012-06-13
申请号：EP10740008.7
申请日：2010-07-07
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/507 , H01L33/44 , H01L33/486 , H01L33/54 , H01L2224/16 , H01L2933/0041
摘要： A method for fabricating a light emitting device is described where an array of flip- chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.
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2.发明公开SILICONE BASED REFLECTIVE UNDERFILL AND THERMAL COUPLER FOR FLIP CHIP LED 有权后梁在填补硅基和热耦合器FLIP-CHIP-LED
公开(公告)号：EP2497126A2
公开(公告)日：2012-09-12
申请号：EP10779582.5
申请日：2010-10-11
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/382 , H01L33/60 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
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3.发明公开LED WITH PARTICLES IN ENCAPSULANT FOR INCREASED LIGHT EXTRACTION AND NON-YELLOW OFF-STATE COLOR 有权LED在一个密封剂放大光提取粒子和不发黄AUSZUSTANDSFARBE
公开(公告)号：EP2342763A1
公开(公告)日：2011-07-13
申请号：EP08875819.8
申请日：2008-10-01
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/56 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/16225 , H01L2924/00014 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In one embodiment, sub-micron size granules (34) of TiO 2, ZrO 2, or other white colored non-phosphor inert granules are mixed with a silicone encapsulant (32) and applied over an LED (10). In one experiment, the granules increased the light output of a GaN LED more than 5% when the inert material was between about 2.5-5% by weight of the encapsulant. Generally, a percentage of the inert material greater than 5% begins to reduce the light output. If the LED has a yellowish YAG phosphor coating, the white granules in the encapsulant make the LED appear whiter when the LED is in an off state, which is a more pleasing color when the LED is used as a white light flash (42) in small cameras (40). The addition of the granules also reduces the variation of color temperature over the view angle and position over the LED, which is important for a camera flash and projection applications.
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公开(公告)号：EP1922767A2
公开(公告)日：2008-05-21
申请号：EP06795708.4
申请日：2006-08-21
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L24/97 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01063 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2933/0041 , H01L2224/81
摘要： A technique for forming a white light LED is disclosed. In one embodiment, the LED emits blue light. A first phosphor for producing red, yellow, yellow-green, or green light is formed to conformably coat the LED die. One suitable deposition technique is electrophoretic deposition (EPD). Over the resulting LED structure is deposited another phosphor (to add the remaining color component) in a binder (e.g., silicone) for encapsulating the die. The blue LED light combines with the two phosphor colors to create white light. Since the two different deposition techniques are independent and easily controllable, the resulting white light temperature is highly controllable and the color emission is substantially uniform.
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公开(公告)号：EP2454764A1
公开(公告)日：2012-05-23
申请号：EP10732750.4
申请日：2010-06-22
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/60 , H01L33/507 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.
摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分割。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。
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公开(公告)号：EP2537190A1
公开(公告)日：2012-12-26
申请号：EP11707915.2
申请日：2011-02-03
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/504 , B29C43/18 , H01L25/0753 , H01L33/005 , H01L33/0075 , H01L33/50 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
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公开(公告)号：EP2504870A1
公开(公告)日：2012-10-03
申请号：EP10779854.8
申请日：2010-10-22
发明人： SIMONIAN, Dmitri , BASIN, Grigoriy
CPC分类号： H01L33/504 , H01L25/167 , H01L33/56 , H01L33/641 , H01L33/644 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.
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公开(公告)号：EP2266149A1
公开(公告)日：2010-12-29
申请号：EP09722834.0
申请日：2009-03-13
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L33/0079 , H01L33/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： An underfill technique for LEDs (10, 12) uses compression molding (50) to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer (22). The molding process causes liquid or softened underfill material (41) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material (54) over the top and sides of the LED dies is removed using microbead blasting (58). The exposed growth substrate (12) is then removed from all the LED dies by laser lift-off (60), and the underfill supports the brittle epitaxial layers (10) of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从裸露的生长衬底去除所有的LED管芯，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分割。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。
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公开(公告)号：EP2168178A1
公开(公告)日：2010-03-31
申请号：EP08776562.4
申请日：2008-07-03
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/54 , H01L33/56 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/16225 , H01L2224/73204 , H01L2224/81001 , H01L2224/92125 , H01L2924/00014 , H01L2924/12041 , H01L2924/00 , H01L2224/05599
摘要： A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.
摘要翻译： 在将LED安装到底座之前，使用底部填充层制造发光二极管（LED），其沉积在LED或者底座上。 在将LED安装到底座之前，底部填充层的沉积提供了更均匀和无空隙的支撑，并且增加了底部填充材料选项以允许改进的热特性。 在将LED安装到底座之前，底部填充层可以在移除生长衬底期间用作薄的和脆的LED层的支撑。 此外，底部填充层可以被图案化和/或抛光，使得只有LED和/或底座的接触区域被暴露。 底部填充物中的图案也可以用作辅助单元的设备的指导。
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公开(公告)号：EP2115789A2
公开(公告)日：2009-11-11
申请号：EP08719476.7
申请日：2008-02-26
发明人： MUELLER, Gerd , MUELLER-MACH, Regina , BASIN, Grigoriy , WEST, Robert Scott , MARTIN, Paul S. , LIM, Tze-Sen , EBERLE, Stefan
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , B29C41/14 , B29C41/20 , B29C41/22 , B29K2995/0031 , B29L2011/00 , H01L24/97 , H01L25/167 , H01L33/504 , H01L33/54 , H01L33/56 , H01L2224/16225 , H01L2224/45139 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2933/0041 , H01L2924/00014 , H01L2224/81 , H01L2924/00 , H01L2924/01049 , H01L2924/00012
摘要： Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single molding process. The LEDs are then separated from the wafer. The molded lens may include red phosphor to generate a warmer white light. In another embodiment, the phosphor plates are first temporarily mounted on a backplate, and a lens containing a red phosphor is molded over the phosphor plates. The plates with overmolded lenses are removed from the backplate and affixed to the top of an energizing LED. A clear lens is then molded over each LED structure. The shape of the molded phosphor-loaded lenses may be designed to improve the color vs. angle uniformity. Multiple dies may be encapsulated by a single lens. In another embodiment, a prefabricated collimating lens is glued to the flat top of an overmolded lens.
摘要翻译： LED结构描述了包覆成型的透镜和某些制造技术。 在一个实施例中，薄的YAG磷光体板被形成并固定在安装在底座晶片上的蓝色LED上。 然后在单个模制过程中在每个LED结构上模制透明透镜。 然后将LED从晶片分离。 模制的透镜可以包括红色磷光体以产生较暖的白光。 在另一个实施例中，荧光板首先临时安装在背板上，并且在荧光体板上模制含有红色荧光体的透镜。 具有包覆成型透镜的板从背板上移除并固定在通电LED的顶部。 然后在每个LED结构上模制透明透镜。 模制的含磷光体的透镜的形状可以设计成改善颜色与角度均匀性。 多个管芯可以由单个透镜封装。 在另一个实施例中，将预制准直透镜胶合到包覆成型透镜的平坦顶部。
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