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公开(公告)号：EP3805707A1
公开(公告)日：2021-04-14
申请号：EP20197607.3
申请日：2020-09-22
发明人： LAVILLE, Arnaud , LAHAYE, Eric , CHEN, Jian
IPC分类号： G01D5/14 , G01R33/07 , H01L23/495 , H01L23/00 , H01L25/065
摘要： A sensor device (1) comprising: a lead frame (9); a first/second semiconductor die (2a) having a first/second sensor structure (4a, 14a) at a first/second sensor location (L1, L2), and a plurality of first/second bond pads (7a, 7b) electrically connected to the lead frame (9); the semiconductor dies having a square or rectangular shape with a geometric center (6a); the sensor locations (L1, L2) are offset from the geometrical centers; the second die (2b) is stacked on top of the first die (2a), and is rotated by a non-zero angle and optionally also offset or shifted (DX, DY) with respect to the first die (2a), such that a perpendicular projection of the first and second sensor location (L1, L2) coincide.
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公开(公告)号：EP3514559A1
公开(公告)日：2019-07-24
申请号：EP18152828.2
申请日：2018-01-22
发明人： HILIGSMANN, Vincent , KLUGE, Wolfram , IHLE, David , CHEN, Jian , RÜDIGER, Jörg , BEYER, Sascha
摘要： A sensor package (100) is described, the comprising a non-conductive substrate (105); at least two electrically conductive coils (110a-c) located at a first side (115) of the non-conductive substrate (105), an evaluation circuit (120) located at a second side (125) of the non-conductive substrate (105) opposing the first side (115) of the non-conductive substrate (105) and conductive connections between the at least two electrically conductive coils (110a-c) and the evaluation circuit (120).
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公开(公告)号：EP3331007A1
公开(公告)日：2018-06-06
申请号：EP16202286.7
申请日：2016-12-05
IPC分类号： H01L23/495 , G01R33/00
CPC分类号： H01L23/49582 , G01R33/00 , H01L21/4828 , H01L23/49548 , H01L23/49861 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L2224/131 , H01L2224/16245 , H01L2224/17517 , H01L2224/48247 , H01L2924/14 , H01L2924/014 , H01L2924/00014
摘要： The present invention relates to an integrated circuit package (10) comprising a lead frame (1) comprising a plurality of leads and a current conductor forming an electrically conductive path that connects at least two leads (13,14) of the plurality of leads. The package also comprises a semiconductor die (2) comprising an integrated circuit and having first and second opposing surfaces, the first surface being proximate to the current conductor. Each of the at least two leads comprises a groove (4) to locally space the lead away from the semiconductor die in a direction perpendicular to the first surface, in which the groove (4) comprises at least that part of the lead that overlaps the edge of the semiconductor die.
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公开(公告)号：EP3972396A1
公开(公告)日：2022-03-23
申请号：EP21206104.8
申请日：2019-03-15
IPC分类号： H05K3/30 , H05K3/34 , H01L23/495 , G01R33/00
摘要： A sensor (10) comprises a housing (12); and a lead frame comprising at least three elongated leads (14) having an exterior portion extending from the housing; and a magnetic sensor circuit (18) disposed in the housing, and connected to the lead frame. The housing comprises two recesses (13) arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The recesses may comprise a bottom portion substantially parallel to the lead frame. The recesses may overlap (11) a broadened or widened inner portion (14D) of the elongated leads (14A). A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.
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公开(公告)号：EP3743689A1
公开(公告)日：2020-12-02
申请号：EP19700753.7
申请日：2019-01-22
发明人： HILIGSMANN, Vincent , KLUGE, Wolfram , IHLE, David , CHEN, Jian , RÜDIGER, Jörg , BEYER, Sascha
IPC分类号： G01D5/20
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公开(公告)号：EP3048653B1
公开(公告)日：2019-09-11
申请号：EP16150995.5
申请日：2016-01-13
发明人： RACZ, Robert , CHEN, Jian
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公开(公告)号：EP3333580A1
公开(公告)日：2018-06-13
申请号：EP17205080.9
申请日：2017-12-04
发明人： RACZ, Robert , CHEN, Jian , BOURY, Bruno , CACCIATO, Antonino , DUPONT, Guido
IPC分类号： G01R15/20
CPC分类号： H01L22/32 , G01R15/207 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/49503 , H01L23/4952 , H01L23/49541 , H01L23/552 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A current sensor (1) comprises a current conductor (3) having a first portion (8), a measuring portion (9) and a second portion (10), the first portion (8) including one or more first electrical terminals (5) and the second portion (10) including one or more second electrical terminals (6). The current sensor (1) further comprises third electrical terminals (7) and a semiconductor chip (4). The semiconductor chip (4) has one or more magnetic field sensors disposed in an active surface, is mounted on the current conductor (3) with the active surface facing the current conductor (3). The active surface comprises first contacts (14). The semiconductor chip (4) comprises electrical through connections disposed over and electrically connected to the first contacts (14). A backside of the semiconductor chip (4) comprises second contacts (17), each of the second contacts (17) electrically connected to one of the electrical through connections. Wire bonds (19) electrically connect the second contacts (17) with the third electrical terminals (7).
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