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716 条记录 (耗时 0.014 秒)

    Display device and method of manufacturing the same
    95.
    发明公开
    Display device and method of manufacturing the same 有权
    Anzeigevorrichtung und Herstellungsverfahren

    公开(公告)号：EP1253643A3

    公开(公告)日：2006-05-17

    申请号：EP02008325.9

    申请日：2002-04-11

    申请人： SEL SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    发明人： Satake, Rumo

    IPC分类号： H01L27/15

    CPC分类号： H01L27/3246 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/322 ,  H01L27/3276 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/525 ,  H01L51/5253 ,  H01L51/56 ,  H01L2251/5315

    摘要： A display device using an organic light emitting element is provided which is structured so as to ensure excellent display performance by avoiding dot defect and improve long-term reliability. The distance between an organic light emitting element and a sealing substrate is controlled using the top of a bank that is placed in a pixel portion and the top of an insulating film that is placed in a driving circuit portion. As a result, a gap is provided between the organic light emitting element and the sealing substrate and a damage to the organic light emitting element can be avoided. Furthermore, the sealing substrate can be as close to an element substrate as possible, thereby keeping the amount of moisture that enters the display device from its sides small.

    摘要翻译： 提供了使用有机发光元件的显示装置，其构造为通过避免点缺陷并提高长期可靠性来确保优异的显示性能。 有机发光元件和密封基板之间的距离使用放置在像素部分中的堤的顶部和放置在驱动电路部分中的绝缘膜的顶部来控制。 结果，在有机发光元件和密封基板之间提供间隙，并且可以避免对有机发光元件的损坏。 此外，密封基板可以尽可能靠近元件基板，从而保持从其侧面进入显示装置的水分量较小。

    Organic light emitting element and producing method thereof
    96.
    发明公开
    Organic light emitting element and producing method thereof 失效
    Organisches lichtemittierendes Bauelement sowie dessen Herstellung

    公开(公告)号：EP0847094A3

    公开(公告)日：2006-04-26

    申请号：EP97121325.1

    申请日：1997-12-04

    申请人： Hitachi, Ltd.

    发明人： Nakayama, Takahiro ,  Kobayashi, Shinya ,  Shimada, Akira

    IPC分类号： H01L51/20

    CPC分类号： H01L51/5012 ,  H01L51/0059 ,  H01L51/0081 ,  H01L51/524 ,  H01L51/5262 ,  H01L51/5265 ,  H01L51/5271

    摘要： An organic light emitting element having a metal thin film (106;404) on an upper surface of an organic thin film (105;403A,403B), is produced by mechanically cutting the metal thin film, using the cut metal thin film as a mask, and applying dry etching processing to the whole of the organic thin film (104,105;403A,403B), and to a part of the thin films on upper and lower surfaces of the organic thin film.

    摘要翻译： 在有机薄膜（105; 403A，403B）的上表面上具有金属薄膜（106; 404）的有机发光元件通过机械切割金属薄膜来制造，使用切割金属薄膜作为 掩模，并且对整个有机薄膜（104,105; 403A，403B）施加干蚀刻处理，以及在有机薄膜的上表面和下表面上的一部分薄膜。

    Liquid crystal display and fabricating method thereof
    98.
    发明公开
    Liquid crystal display and fabricating method thereof 有权
    Flüssigkristallanzeigeund Methode zu ihrer Herstellung

    公开(公告)号：EP1619544A1

    公开(公告)日：2006-01-25

    申请号：EP05015538.1

    申请日：2005-07-18

    申请人： LG Electronics, Inc.

    发明人： Kim, Chang Nam

    IPC分类号： G02F1/13357 ,  H05B33/04

    CPC分类号： G02F1/133603 ,  H01L51/524 ,  H01L51/5259

    摘要： A liquid crystal display and fabricating method thereof are disclosed, by which a backlight having a simple configuration, a reduced thickness and a low cost can be provided. The present invention includes a liquid crystal display panel (300) having an upper substrate, a lower substrate and liquid crystals between the upper and lower substrates, an organic EL device (31) provided under the lower substrate of the liquid crystal display panel to provide light to the liquid crystal display panel, and a cap (32) boned to at least one of the lower substrate of the liquid crystal display panel (300) and a substrate of the organic EL device (31) to protect the organic EL device.

    摘要翻译： 公开了一种液晶显示器及其制造方法，通过该液晶显示器及其制造方法，可以提供具有简单结构，厚度降低和低成本的背光。 本发明包括具有上基板，下基板和上基板和下基板之间的液晶的液晶显示面板（300），设置在液晶显示面板的下基板下方的有机EL器件（31），以提供 和液晶显示面板（300）的下基板中的至少一方的基板和有机EL元件（31）的基板上的盖（32），以保护有机EL元件。

    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION
    99.
    发明公开
    HERMETICALLY SEALED GLASS PACKAGE AND METHOD OF FABRICATION 审中-公开
    期密闭密封的玻璃封装和制造工艺

    公开(公告)号：EP1615858A2

    公开(公告)日：2006-01-18

    申请号：EP04720375.7

    申请日：2004-03-12

    申请人： Corning Incorporated

    发明人： REDDY, Kamjula P ,  SCHROEDER, Joseph F ,  STRELTSOV, Alexander ,  POWLEY, Mark L ,  MORENA, Robert M

    IPC分类号： C03C27/12

    CPC分类号： C03C8/24 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

    摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, and/or neodymium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

    Glass lid, and package provided with a such a lid, for the encapsulation of electronic components
    100.
    发明公开
    Glass lid, and package provided with a such a lid, for the encapsulation of electronic components 有权
    玻璃盖和包装包括这样的盖用于电子部件的封装

    公开(公告)号：EP1605530A2

    公开(公告)日：2005-12-14

    申请号：EP05104596.1

    申请日：2005-05-30

    申请人： Thomson Licensing

    发明人： BETTINELLI, ARMAND

    IPC分类号： H01L51/10

    CPC分类号： H05B33/04 ,  H01L51/524

    摘要： The encapsulation lid (1) comprises at least two glass layers of different compositions, a first layer (2) called the bottom layer, which is continuous, and at least a second layer (3, 6), which is discontinuous and designed so as to define cavities (4, 5) or anfractuosities in this lid.
    Preferably, the glass layers other than the first layer are preferably formed from low-melting-point frits, thereby allowing such lids to be manufactured economically, without recourse to glass machining.

    摘要翻译： 封装盖（1）包括不同的组合物的至少两个玻璃层，第一层（2）被称为底层，其全部是连续的，以及至少一个第二层（3,6），所有这些是不连续的并且设计成 以限定在该盖的空腔（4,5）或anfractuosities。 优选地，比第一层以外的玻璃层最好由低融点玻璃料形成，从而允许寻求盖被经济地制造，而不依靠玻璃加工。