-
公开(公告)号:EP2986892B1
公开(公告)日:2017-06-28
申请号:EP14731419.9
申请日:2014-04-17
申请人: Quarkstar LLC
CPC分类号: F21V19/02 , F21K9/23 , F21K9/61 , F21S6/002 , F21S6/007 , F21S6/008 , F21S8/026 , F21V7/0008 , F21V7/0016 , F21V13/04 , F21V14/02 , F21V14/04 , F21V23/06 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10 , G02B5/0278 , G02B5/0284 , G02B6/0023 , G02B6/0028 , G02B6/003 , G02B6/0045 , G02B6/0051 , G02B6/0055 , G02B6/0096 , G02B27/30
-
公开(公告)号:EP2831498B1
公开(公告)日:2017-05-31
申请号:EP13769434.5
申请日:2013-03-14
发明人: DEVORE, Charles N. , MCGRATH, Kayla A. , RAIDER, Wesley A. , SCHLEIF, Larry A. , FELDMAN, Steven , NEU, Steven A.
IPC分类号: F21V29/00 , H01R12/51 , F21V23/06 , F21K9/61 , F21K9/232 , F21V23/00 , F21Y115/10 , F21Y103/33
CPC分类号: F21K9/238 , F21K9/23 , F21K9/61 , F21V3/02 , F21V23/006 , F21V23/06 , F21V29/506 , F21V29/773 , F21V29/83 , F21Y2103/33 , F21Y2115/10 , H01J5/54 , H01R3/00
-
公开(公告)号:EP4411206A3
公开(公告)日:2024-11-06
申请号:EP24183776.4
申请日:2020-04-21
申请人: Nichia Corporation
IPC分类号: H05K3/12 , H05K3/34 , H05K3/00 , H05K3/40 , H05K3/32 , H05K1/11 , F21K9/90 , F21K9/61 , F21K9/64 , F21Y105/16 , F21Y115/10 , F21V8/00 , H01L25/075 , H05K3/46 , H05K3/28
摘要: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
-
公开(公告)号:EP3751969B1
公开(公告)日:2024-07-24
申请号:EP20170558.9
申请日:2020-04-21
IPC分类号: H05K3/28 , H05K3/46 , F21K9/61 , F21K9/64 , F21Y105/16 , F21Y115/10 , F21V8/00 , H01L25/075 , H05K3/12 , H05K3/00 , H05K1/11 , H05K3/32 , H05K3/40 , F21K9/90
CPC分类号: F21K9/90 , H05K1/116 , H05K3/005 , H05K3/1225 , H05K3/1233 , H05K3/281 , H05K3/321 , H05K3/4069 , H05K3/4626 , H05K2201/0942720130101 , H05K2201/0947220130101 , H05K2201/0962720130101 , H05K2201/0966320130101 , H05K2201/097920130101 , H05K2201/09920130101 , H05K2201/1010620130101 , H05K2203/022120130101 , H05K2203/027820130101 , H05K2203/110520130101 , F21K9/61 , F21Y2105/1620160801 , F21Y2115/1020160801 , F21K9/64 , G02B6/0023 , G02B6/0036 , H01L25/0753
-
公开(公告)号:EP4004677B1
公开(公告)日:2024-04-24
申请号:EP20906889.9
申请日:2020-12-18
IPC分类号: G06F1/16 , F21K9/61 , F16M11/04 , F21Y115/10 , F16M11/22 , F16M13/02 , G09F13/14 , G09F13/22 , F21V8/00 , G09F13/12 , G09F9/30
CPC分类号: G09F13/12 , G09F9/30 , G09F13/14 , G09F2013/22220130101 , G02B6/0045 , G02B6/0075 , G06F1/1601 , F16M11/04 , F16M13/022 , F16M2200/0820130101 , F16M11/22 , F16M11/048
-
公开(公告)号:EP4182603B1
公开(公告)日:2024-04-17
申请号:EP21740550.5
申请日:2021-07-12
CPC分类号: F21K9/61 , F21K9/23 , F21Y2115/3020160801 , F21Y2115/1020160801 , F21Y2113/2020160801 , F21S10/005 , G02B6/4298 , G02B6/0001
-
公开(公告)号:EP4348100A1
公开(公告)日:2024-04-10
申请号:EP22728944.4
申请日:2022-05-17
申请人: Signify Holding B.V.
IPC分类号: F21K9/61 , F21S8/02 , F21S8/04 , F21V17/16 , F21V21/04 , F21V8/00 , F21V3/00 , F21V15/01 , F21Y115/10 , F21Y103/10
-
公开(公告)号:EP4176198B1
公开(公告)日:2024-03-06
申请号:EP20785490.2
申请日:2020-09-30
发明人: VERLINDEN, Wouter
IPC分类号: F21K9/61 , F21S4/28 , F21V5/00 , F21V21/005 , F21V21/008 , F21V11/02
-
公开(公告)号:EP4328530A1
公开(公告)日:2024-02-28
申请号:EP22792075.8
申请日:2022-04-22
申请人: LG Electronics Inc.
发明人: KIM, Junghun
摘要: Disclosed is a refrigerator including a cabinet forming a storage space and a door for opening and closing the storage space, the door including a door body with an insulator filled therein, and a door panel mounted in front of the door body, wherein the door panel includes a lighting device configured to emit light, a front plate forming a front surface of the door panel and configured to transmit light therethrough, a back cover forming a rear surface of the door panel, and a bracket disposed between the front plate and the back cover and including the lighting device mounted on the bracket, wherein the door body includes a body plate forming a front surface of the door body, and wherein the back cover faces the body plate when the door panel is mounted.
-
-
-
-
-
-
-
-
-