摘要:
A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).
摘要:
A method of providing such an intercoupling component (10) includes positioning terminals (50) within holes (64) of an insulative support member (62) and attaching a solder ball (52) to each of the terminals. Attaching the solder balls to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contact a corresponding solder ball soldering the solder ball to the end of the terminal while maintaining the generally spherical of the solder ball.
摘要:
An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets or posts mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets or posts. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. In the circuit board socket arrangement, each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.
摘要:
This invention features lead frames, molded lead frames and adapters (10) and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements (12). The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin (26) through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
摘要:
An improved method and construction for positioning a plurality of socket terminals (34) on an electrical circuit board (22) in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material (30, 30a) is provided with a plurality of holes (32, 32a) in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head (50) including an intermediate groove (68) such that the heads extend into the holes (32, 32a) and are adapted for frictional snap engagement with the sheet (30, 30a). The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the boards. Thereafter, the sheet may be removed. The enlarged head (50) of the circuit terminal is provided with leading edge sheet contacting surface (66) to enable the terminals to be push positioned into the holes without injuring the sheet.
摘要:
Construction et procédé améliorés de positionnement d'une pluralité de bornes femelles (34) sur une plaque de circuit électrique (22) selon une configuration prédéterminée avant le soudage. Une feuille de matériau plastique résineux flexible électriquement isolante (30, 30a) est pourvue d'une pluralité de trous (32, 32a) selon une matrice conforme au positionnement désiré des bornes sur les circuits imprimés. Les bornes femelles sont pourvues d'une tête élargie généralement cylindrique (50) comprenant une rainure intermédiaire (68) permettant à la tête de s'étendre dans les trous (32, 32a) et sont conçues pour s'engager par déclic à friction dans la feuille (30, 30a). La feuille avec le réseau de bornes qu'elle contient temporairement est positionnée sur la plaque de circuit qui est alors soudée de manière conventionnelle afin de fixer électriquement et mécaniquement les bornes sur les plaques. La feuille peut ensuite être enlevée. La tête élargie (50) de la borne de circuit est pourvue d'une surface de contact de feuille de bord d'attaque (66) permettant aux bornes femelles d'être positionnées par pression dans les trous sans abîmer la feuille.
摘要:
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
摘要:
A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).
摘要:
A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).