公开(公告)号：EP2937628A1

公开(公告)日：2015-10-28

申请号：EP13865211.0

申请日：2013-12-16

Applicant: Leeleds Lighting (Xiamen) Co., Ltd.

Inventor： WANG, Linhua ,  ZHU, Xiaolei ,  ZHOU, Lin ,  ZHAO, Han

IPC: F21V23/00 ,  F21Y101/02

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.

Abstract translation: 提供了电连接件（30）和使用电连接件（30）的LED灯。 电连接件（30）用于LED灯（100）的光源基板（20）和驱动板（40）之间的电连接，并包括输入端子（32）和输出端子（34） ）。 LED灯（100）包括驱动板（40）和光源基板（20）。 输出端子34设置在LED灯100的驱动板40上，光源基板20设置有与输入端子32对应的固定孔22。 输入端子（32）固定在光源基板（20）的固定孔（22）中并与光源基板（20）电连接。 输出端子（34）包括两个触点（342），两个触点（342）中的每一个的一端分别与驱动板（40）电连接。 输入端子（32）包括分别对应于两个触点（342）设置的两个连接头。 两个连接头中的每一个的一端分别与光源基板（20）电连接。 在组装时，输出端子（34）的两个触点（342）分别插入到输入端子（32）的两个对应的连接头中，并且两个连接头分别弹性地抵靠两个触点（342）。 电连接件（30）具有便于自动组装的优点。

公开(公告)号：EP1486105A1

公开(公告)日：2004-12-15

申请号：EP03723786.4

申请日：2003-03-20

Applicant: ANDREW CORPORATION

Inventor： BUONDELMONTE, Charles, J. ,  MENDELSOHN, Joseph, Patrick ,  BROWN, Richard, William ,  LI, Min ,  SCHWARTZ, Richard, Franklin ,  UPASANI, Sanjay, Sudhakar

IPC: H05K3/36

CPC classification number: H05K3/368 ,  B23K2201/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

公开(公告)号：EP0268890A1

公开(公告)日：1988-06-01

申请号：EP87116267.3

申请日：1987-11-05

Applicant: Inotec Electronics GmbH

Inventor： Schmitt, Fred R.

IPC: H01R9/09

CPC classification number: H05K3/222 ,  H01R12/58 ,  H01R12/718 ,  H05K2201/10333

Abstract: Ein Steckkontakt (10) zum Durchkontaktieren von Lochraster­platten (26) eignet sich dadurch auch zum Herstellen einer elektrischen Leitungsverbindung auf der Oberseite dieser Platte (26), daß eine Öse (16) mit kreisförmiger Aussparung (18) an dem oberen Ende des Steckkontaktes (10) mit einem derartigen Abstand zu demselben befestigt ist, daß der Abstand des Kreismittelpunktes der Aussparung (18) zu dem Kreismittelpunkt des in einem Loch (28) der Platte (26) ein­gesteckten zylindrischen Körpers (22) dem Rastermaß (A) der Löcher (28) der Lochrasterplatte (26) entspricht, und daß der Innendurchmesser (D) der Aussparung (18) gleich dem Durchmesser (D) der Löcher (28) der Lochrasterplatte (26) ist.

Abstract translation: 用于与栅格孔板（26）进行通孔接触的插入式触点（10）也适用于在该板（26）的上侧上产生电导体连接，因为具有 圆形凹部（18）以与从凹部（18）的圆的中心到中心的距离相等的间隔安装在插入式触头（10）的上端 插入板（26）中的孔（28）中的圆柱体（22）对应于格孔板（26）中孔（28）的格栅尺寸（A），内径（D） （18）的孔（28）的直径（D）等于孔眼板（26）中的孔（28）的直径（D）。

公开(公告)号：EP0086961A3

公开(公告)日：1986-03-19

申请号：EP83100521

申请日：1983-01-21

Applicant: MUPAC CORPORATION

Inventor： Leary, Burton ,  Silverio, Shaun

IPC: H05K03/46 ,  H01R23/72

CPC classification number: H05K3/4641 ,  H05K1/0231 ,  H05K1/0287 ,  H05K1/162 ,  H05K3/222 ,  H05K2201/0191 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10333

Abstract: A panel board has a first voltage layer sandwiched between two ground layers at a close spacing to produce a large distributed capacitance; the two ground layers are connected by plated-through conductive holes spaced regularly across the board; a second (exposed) voltage layer is connected by regularly spaced plated-through holes to the first voltage layer, increasing the current carrying capacity of, and reducing the resistance across, the board; the plated-through holes are arranged in rows and columns in a pattern permitting the mounting of decoupling capacitors, at any point on the board, in a position parallel to the rows or parallel to the columns; and a socket terminal can be electrically connected directly to the exposed voltage layer or to the exposed ground layer using a ring connector.

公开(公告)号：EP2688374A4

公开(公告)日：2015-09-02

申请号：EP12866400

申请日：2012-05-30

Applicant: SANYO ELECTRIC CO

Inventor： SAITO TAKAO ,  OHSHIMA MAKOTO

IPC: H05K1/18 ,  H01R4/02 ,  H01R4/38 ,  H01R12/51 ,  H01R12/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01R12/515 ,  H01R12/58 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/10333

Abstract: [Problem] To provide a printed circuit board in which it is possible to decrease generation of heat in a terminal block mounted on the printed circuit board. [Solution] A printed circuit board (10) comprising: a printed wiring (11); a terminal block (13) configured by folding a solderable plate member having a foot (31); a soldered part (14) for connecting the printed wiring (11) and the terminal block (13) arranged on the printed wiring; and a through-hole (12) provided to the soldered part (14), for insertion of the foot (31); the foot (31) being inserted into the through-hole (12) and connected by soldering; the printed circuit board comprising a solderable metal wire (17) arranged on the soldered part (14) along the terminal block (13); the soldered part (14), the terminal block (13), and the metal wire (17) being integrally soldered during soldering by solder fed through the through-hole (12).

公开(公告)号：EP1393604B1

公开(公告)日：2011-01-12

申请号：EP02769472.8

申请日：2002-05-08

Applicant: Endress + Hauser GmbH + Co. KG

Inventor： BIRGEL, Dietmar ,  HAUPTVOGEL, Karl-Peter ,  BRUTSCHIN, Wolfgang ,  MÜLLER, Alexander

IPC: H05K3/34 ,  H01R9/16

CPC classification number: H01R12/57 ,  H01R9/16 ,  H01R43/0256 ,  H05K1/183 ,  H05K3/3405 ,  H05K2201/09036 ,  H05K2201/10333

Abstract: The invention relates to a printed circuit board (15) comprising a contact sleeve (17) that is mounted thereon, whereby the contact sleeve (17) can be electrically connected to the PCB in the manner of an SMD component. The upper face of said circuit board (15) is provided with a recess (23), a metallised section (25, 26), which adjoins said recess (23) and is connected to a strip conductor (27) that runs across the printed circuit board (15), and a contact sleeve (17) that is inlaid in the recess (23), mechanically fixed by a solder joint (29) and electrically connected to the metallised section (25).

公开(公告)号：EP0936847A1

公开(公告)日：1999-08-18

申请号：EP98500253.4

申请日：1998-11-24

Applicant: MECANISMOS AUXILIARES INDUSTRIALES S.A. M.A.I.S.A.

Inventor： Arragones Carreta, Alberto

IPC: H05K1/02 ,  H05K1/14 ,  B60R16/02

CPC classification number: B60R16/0239 ,  H01H50/048 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/0352 ,  H05K2201/098 ,  H05K2201/10053 ,  H05K2201/10333

Abstract: The improvements made on the main Invention Patent no. 9501610 consists, firstly, of manufacturing power circuits such as (23) of between 200 and 800 microns, see figure 4, whereby, and practically with the same voltage, the amperage or intensity which runs through the conducting tracks of the printed circuit broad (23) is doubled, it also being possible to fit relays (26) using the corresponding females (24), so that the services integrated on the box (10) can support a greater load, thereby expanding the possibilities of integration of services, with no type of modification made to configuration and structure.

Abstract translation: 主要发明专利No. 9501610首先包括制造200至800微米之间的（23）的电源电路，参见图4，由此实际上具有相同的电压，穿过印刷电路的导电轨迹的电流强度或强度变宽（ 23）是双倍的，还可以使用相应的女性（24）来适配继电器（26），使得集成在盒（10）上的服务可以支持更大的负载，从而扩大服务集成的可能性，与 没有对配置和结构进行任何修改。

公开(公告)号：EP0162474A3

公开(公告)日：1987-06-03

申请号：EP85106413

申请日：1985-05-24

Applicant: FUJITSU LIMITED

Inventor： Tanibe, Norio

IPC: H05K09/00 ,  H05K03/30

CPC classification number: H04M1/0277 ,  H01R12/58 ,  H01R12/718 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/308 ,  H05K3/368 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A printed circuit board (10) comprises a baseboard (15), having conductor patterns (15c,15d,15e) therein and ground layers (15a,15b) on both surfaces thereof, and terminal pins (16) mounted on the baseboard (15). The terminal pins (16) have a root portion which does not project from the baseboard (15) and a contact portion which projects from the baseboard (15). A circuit assembly comprises a mother printed circuit board (10), such as the above-mentioned printed circuit board, on which circuit modules (11) are mounted. The circuit module (11) has terminal jacks (14), which are enclosed within a shielded package (13) and into which the terminal pins (16) of the mother printed circuit board (10) are connected by insertion.

公开(公告)号：EP0160387A1

公开(公告)日：1985-11-06

申请号：EP85302067.5

申请日：1985-03-26

Applicant: THOMAS & BETTS CORPORATION

Inventor： Holzmann, Hubert A.

IPC: H01R9/09

CPC classification number: H01R43/205 ,  H01R13/436 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/10333 ,  H05K2201/10424 ,  Y10S269/903 ,  Y10T428/1397

Abstract: The contacts (4) have a body (4a) intended to pass through an opening in a card (5) and to be brazed on one side (5a) thereof, and a head (4b) of larger width than the body (4a), intended to be positioned on the other side (5b) of the card, this head (4b) being intended to receive a complementary contact.
The strip is formed of a band (1) of plastic material resisting the heat released during brazing and having cells (2) opening on one side, these cells being adapted to receive sealingly, by elastic deformation, the heads (4b) of the contacts (4) and being spaced apart according to a given pitch.
With this type of strip, a large number of contacts (4) can be positioned in a single operation on a printed circuit card (5), the heads (4b) of the contacts being protected during the brazing and washing operations from contaminants.

公开(公告)号：EP0037749A1

公开(公告)日：1981-10-14

申请号：EP81400315.8

申请日：1981-02-27

Applicant: THOMSON-CSF

Inventor： Legrand, Pierre ,  Desperques-Volmier, Serge ,  Baylard, Marcel

IPC: H05K3/36

CPC classification number: H05K1/141 ,  G01R1/04 ,  H05K3/3447 ,  H05K3/366 ,  H05K7/12 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10689

Abstract: L'invention a pour but de fournir un moyen de raccorder de façon simple, rapide et sans erreur de branchement, des composants enfichés sur une carte de câblage, avec des équipements de test et/ou de mesure.
Le support est constitué, à cet effet, par une plaque (9) en matériau isolant, du type utilisé pour réaliser les circuits imprimés, et présente des trous métallisés (91, 92) munis de douilles élastiques (90). Le composant (4) est enfiché dans des douilles (31) prolongées par des appendices de connexion (32) traversant la carte de câblage. Les douilles (90) destinées aux fiches des équipements de test et/ou de mesure sont reliées aux douilles (31 ) par des métallisations (93) tapissant les bords des trous métallisés.
Application aux cartes de circuits intégrés.

Abstract translation: 本发明包括用于将插入到印刷布线电路中的组件与测试和/或测量设备连接的简单的快速和无错误的装置。 为此，支撑体由用于制造印刷电路板的类型的绝缘材料制成的板（9）形成，并且具有装有弹簧加载插座（90,92）的电镀通孔（91,92） ）。 组件（4）插入通过印刷布线电路的连接附件（32）延伸的插座（31）中。 用于测试和/或测量设备的插头触点的插座（90）通过覆盖电镀通孔的边缘的金属（93）连接到插座（31）。 集成电路板应用。