公开(公告)号：EP2817134A4

公开(公告)日：2015-10-28

申请号：EP12869418

申请日：2012-07-18

Applicant: SHENZHEN BYD AUTO R & D CO LTD ,  BYD CO LTD

Inventor： GONG QING ,  ZHANG XIONG ,  ZHANG YIHU ,  ZHOU WEI

IPC: B29C45/14 ,  B32B15/08 ,  C23F1/16

CPC classification number: B29C45/14795 ,  B29C45/14311 ,  B29C45/14778 ,  B29C2045/14803 ,  B29C2045/14868 ,  B29K2069/00 ,  B29K2105/0005 ,  B29K2105/0088 ,  B29K2705/02 ,  B29K2715/003 ,  B29K2995/0097 ,  B29L2009/003 ,  B32B15/08 ,  B32B27/32 ,  B32B27/365 ,  B32B2270/00 ,  B32B2311/24 ,  B32B2311/30 ,  B32B2369/00 ,  B32B2509/00 ,  B32B2605/08 ,  C25D11/08 ,  C25D11/16 ,  C25D11/24 ,  C25D11/30 ,  C25D11/34 ,  Y10T428/24545 ,  Y10T428/31507

Abstract: A method for integrally molding a metal and a resin and a metal-resin composite structure obtainable by the same are provided. The method comprises forming a nanopore in a surface of a metal sheet; melting a thermoplastic resin on the surface of the metal sheet formed with the nanopore; and injection molding the thermoplastic resin onto the surface of the metal sheet. The thermoplastic resin includes a mixture of a main resin and a polyolefin resin, the main resin is a polycarbonate, and the polyolefin resin has a melting point of about 65° C. to about 105° C.

Abstract translation: 提供了一种用于一体成形的金属和树脂的金属树脂复合结构可获得的相同的方法。 所述方法包括形成在金属薄片的一个表面上的纳米孔; 熔化与纳米孔形成在所述金属片材的表面上的热塑性树脂; 和注射成型热塑性树脂到金属片的表面上。 所述热塑性树脂包括主树脂和聚烯烃树脂的混合物，主要的树脂为聚碳酸酯，和聚烯烃树脂具有约65℃的熔点约105℃

公开(公告)号：EP3188908A4

公开(公告)日：2018-04-18

申请号：EP15838426

申请日：2015-06-05

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MAO BIFENG

IPC: B32B27/06 ,  B32B15/08 ,  B32B27/16 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：EP2951134A4

公开(公告)日：2016-10-26

申请号：EP14746818

申请日：2014-01-24

Applicant: BYD CO LTD

Inventor： ZHAO YANSHUAI ,  ZHOU WEI

IPC: C04B35/468 ,  C01G23/00 ,  C04B35/462 ,  C04B35/622 ,  C04B35/626 ,  C04B35/634 ,  C04B35/64 ,  C04B35/653 ,  H01C7/00 ,  H01C7/02 ,  H01C17/065

CPC classification number: H01C7/023 ,  C01G23/006 ,  C04B35/462 ,  C04B35/4682 ,  C04B35/6261 ,  C04B35/62685 ,  C04B35/62695 ,  C04B35/63416 ,  C04B35/64 ,  C04B35/653 ,  C04B2235/32 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/34 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/449 ,  C04B2235/5427 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/785 ,  H01C7/008 ,  H01C7/025 ,  H01C17/06533

Abstract: A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO3, B2O3, SiO2, Li2O, P2O5, Cs2O, Nd2O3, Al2O3 and TiO2.

Abstract translation: 提供一种热敏电阻材料和一种制备热敏电阻材料的方法。 通过混合和加热含有BaTiO3，B2O3，SiO2，Li2O，P2O5，Cs2O，Nd2O3，Al2O3和TiO2的混合物制备热敏电阻材料。

公开(公告)号：EP3189097A4

公开(公告)日：2018-04-18

申请号：EP15837858

申请日：2015-06-05

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MAO BIFENG

IPC: C08K3/22 ,  C08L67/02 ,  C08L69/00 ,  C08L77/06 ,  C23C18/06 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：EP3108035A4

公开(公告)日：2017-12-20

申请号：EP15740215

申请日：2015-01-27

Applicant: BYD CO LTD

Inventor： GONG QING ,  ZHOU WEI ,  SUN YONGLIANG

IPC: C23C18/38 ,  C08K3/32 ,  C23C18/16 ,  C23C18/20 ,  C23C18/31

CPC classification number: C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

公开(公告)号：EP3108034A4

公开(公告)日：2017-12-20

申请号：EP15740539

申请日：2015-01-27

Applicant: BYD CO LTD

Inventor： GONG QING ,  ZHOU WEI ,  SUN YONGLIANG

IPC: C23C18/30 ,  C08K3/20 ,  C23C18/16 ,  C23C18/31 ,  C23C18/38

CPC classification number: C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

公开(公告)号：EP2817148A4

公开(公告)日：2015-11-04

申请号：EP12869137

申请日：2012-09-26

Applicant: SHENZHEN BYD AUTO R & D CO LTD ,  BYD CO LTD

Inventor： GONG QING ,  ZHANG XIONG ,  ZHANG YIHU ,  ZHOU WEI

IPC: B29C45/14 ,  B32B15/085

CPC classification number: B32B5/18 ,  B29C45/14311 ,  B29C45/14778 ,  B29C45/14811 ,  B29C2045/14803 ,  B32B9/005 ,  B32B15/04 ,  B32B15/085 ,  B32B27/286 ,  B32B27/32 ,  B32B2250/03 ,  B32B2270/00 ,  Y10T428/249956