公开(公告)号：EP3188908A4

公开(公告)日：2018-04-18

申请号：EP15838426

申请日：2015-06-05

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MAO BIFENG

IPC: B32B27/06 ,  B32B15/08 ,  B32B27/16 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：EP3189097A4

公开(公告)日：2018-04-18

申请号：EP15837858

申请日：2015-06-05

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MAO BIFENG

IPC: C08K3/22 ,  C08L67/02 ,  C08L69/00 ,  C08L77/06 ,  C23C18/06 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

公开(公告)号：EP3196338A4

公开(公告)日：2017-12-13

申请号：EP15849159

申请日：2015-08-28

Applicant: BYD CO LTD

Inventor： ZHOU WEI ,  MIAO WEIFENG ,  MAO BIFENG ,  ZHOU FANGXIANG

IPC: C23C18/20 ,  B32B15/00 ,  B32B27/06 ,  C23C18/16 ,  C23C18/28 ,  H05K3/18

CPC classification number: C23C18/206 ,  B32B15/00 ,  B32B27/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/20 ,  C23C18/204 ,  C23C18/285 ,  H05K3/185 ,  H05K2201/09118

Abstract: A metalized plastic article and a method for selectively metallizing a surface of a plastic substrate are provide. The metalized plastic article includes a plastic substrate and a metal plating layer formed on the surface of the plastic substrate. At least a surface layer of the plastic substrate covered by the metal plating layer is formed by a plastic composition. The plastic composition includes a base resin and a doped tin oxide. A doping element of the doped tin oxide is at least one selected from a group consisting of cerium, lanthanum, fluorine and tantalum. The metalized plastic article of the present disclosure has a good light absorption performance and a high chemical plating activity.

公开(公告)号：EP2981507A4

公开(公告)日：2017-04-26

申请号：EP14778389

申请日：2014-04-02

Applicant: BYD CO LTD

Inventor： GONG QING ,  ZHOU WEI ,  MAO BIFENG ,  MIAO WEIFENG

IPC: C09D11/02 ,  B01J23/00 ,  B01J23/825 ,  B01J23/86 ,  B01J23/887 ,  B01J35/02 ,  B01J37/00 ,  B01J37/04 ,  B01J37/08 ,  B01J37/34 ,  C01G15/00 ,  C01G37/00 ,  C01G39/00 ,  C01G49/00 ,  C09D11/10 ,  C09D11/322 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  H01B5/14 ,  H05K3/18

CPC classification number: C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-&bgr; (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

Abstract translation: 本发明提供的金属化合物。 Cu2AαB2-αO4-的β：所述金属化合物是由式（I）表示 （I）。 A包含选自组6和周期表的第8选择的至少一种元素。 B含有选自周期表的第13，0 <α<2，且0 <测试<1.5中选出的至少一种元素。 因此，提供的聚合物制品包含用于制备聚合物制品以及所述聚合物制品的表面的选择金属化的金属化合物和方法。 另外，本发明提供墨水组合物，以及使用该油墨组合物的绝缘基板的一个表面上的选择性金属。