公开(公告)号：EP1422208A4

公开(公告)日：2007-01-24

申请号：EP02745848

申请日：2002-07-04

申请人： OHSATO HITOSHI ,  DAIKEN CHEMICAL CO LTD

发明人： OHSATO HITOSHI ,  HARADA AKIO ,  OKAWA TAKASHI ,  OKABE HIROKI

IPC分类号： C01G23/00 ,  C01G25/00 ,  C04B35/462 ,  C04B35/638 ,  H05K1/03 ,  C04B35/46 ,  C04B35/50 ,  H01B3/12

CPC分类号： C04B35/462 ,  C01P2002/34 ,  C01P2002/50 ,  C01P2002/77 ,  C01P2004/61 ,  C01P2004/62 ,  C04B35/6262 ,  C04B35/62695 ,  C04B35/638 ,  C04B2235/3206 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3244 ,  C04B2235/3293 ,  C04B2235/3418 ,  C04B2235/604 ,  C04B2235/768 ,  H05K1/0306

摘要： Various high quality microwave dielectric composite compositions prepared by replacing a part of Ba, La or Ti with another element in a dielectric material represented by BanLa4Ti3+nO12+3n. A first embodiment thereof comprises a ceramic composition represented by (Ba1-xAx)nLa4Ti3+nO12+3n, wherein A is an alkaline earth metal element except Ba, and 0.5

公开(公告)号：EP1427266A4

公开(公告)日：2006-10-04

申请号：EP02751626

申请日：2002-07-18

申请人： DAIKEN CHEMICAL CO LTD

发明人： KATO MASATOSHI ,  HARADA AKIO

IPC分类号： H05K1/09 ,  H05K3/02 ,  H05K3/46

CPC分类号： H05K3/02 ,  H05K1/092 ,  H05K3/4611 ,  H05K2203/0514 ,  H05K2203/107 ,  Y10S430/146

摘要： By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure accuracy of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer (4). This photosensitive paste layer (4) is plotted by a laser beam (8) so as to form a plotted area (7). The photosensitive paste layer (4) is developed and an exposed area (4a) or an unexposed area (4b) is removed so as to form a circuit pattern (17). This circuit pattern (17) is sintered to form a circuit pattern (20) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a green sheet (2) is used as the substrate, it is possible to form a ceramic substrate (18) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.

公开(公告)号：EP0976848A4

公开(公告)日：2005-02-23

申请号：EP98953055

申请日：1998-11-13

申请人： DAIKEN CHEMICAL CO LTD

发明人： HARADA AKIO ,  OKAMOTO YOSHIKI

IPC分类号： H05K1/09 ,  C07F1/10 ,  C07F1/12 ,  C08K5/56 ,  C08L101/00 ,  C09D1/00 ,  C23C18/08 ,  H01B1/16 ,  H05K3/12 ,  C07F15/00 ,  C07F19/00

CPC分类号： C23C18/08

摘要： A metal composition such as metallic fluid or metallic paste is prepared by compounding a metal acetilide represented by the general formula M(-CC-R)n (wherein M is a metallic atom, n is the valency of the atom M, and R is a hydrocarbon group optionally bearing oxygen) as an organometallic source with a resin and an organic solvent and kneading the mixture. When the composition is applied in a desired pattern to a required portion of a decorative article, such as porcelain or glass, or an electronic part and at least the required portion is dried and heated, the organic substances except for the metal are decomposed and released and only the metal is sintered in the required pattern.