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    Assembly for liquid cooling electronics by direct submersion into circulated engine coolant.
    12.
    发明公开
    Assembly for liquid cooling electronics by direct submersion into circulated engine coolant. 审中-公开
    安排在循环的发动机冷却剂通过直接浸没液冷式电子

    公开(公告)号：EP2582217A2

    公开(公告)日：2013-04-17

    申请号：EP12186296.5

    申请日：2012-09-27

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Lashbrook, Joseph M.

    IPC: H05K7/20 ,  H01L23/34

    CPC classification number: H05K7/20927 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20872 ,  H01L2924/00

    Abstract: An assembly (10) for liquid cooling electronics by direct submersion into circulated engine coolant that includes an epoxy material (48) dispensed around leads (42,44) of electronics devices (combination of 34, 36, 38) in a manner effective to mechanically secure the electronics devices to the assembly (10) and prevent engine coolant leakage around the leads, and a Parylene™ coating layer (50) deposited in a manner effective to protect the electronic device (34) from electrically conductive engine coolant such as ethylene glycol. Such an assembly (10) is useful in hybrid electric vehicles that have engine coolant available from the vehicle's internal combustion engine.

    Abstract translation: 用于液体冷却的电子组件（10）通过浸没入循环到直接做发动机冷却剂包括以一种方式的电子设备的环氧树脂材料（48），配发的周围引线（42,44）（34组合，36，38）有效地机械 确保电子设备的组件（10），并防止所述引线围绕发动机冷却剂泄漏，和帕利灵“¢涂料层（50）沉积在有效地保护该电子装置（34）由导电的发动机冷却剂的方式：如乙烯 乙二醇。 上组件（10）的搜索是在混合电动车辆有用thathave可从车辆的内燃机的发动机冷却剂。

    Automatic fault detection and laser shut-down method for a laser-generated windshield display
    13.
    发明公开
    Automatic fault detection and laser shut-down method for a laser-generated windshield display 有权
    自动错误检测和Laserausschaltverfahren用于激光产生的挡风玻璃显示

    公开(公告)号：EP2233962A3

    公开(公告)日：2011-07-20

    申请号：EP10156104.1

    申请日：2010-03-10

    Applicant: Delphi Technologies, Inc.

    Inventor： Newman, Timothy J. ,  Parker, Richard D.

    IPC: G02B27/01

    CPC classification number: G02B27/01

    Abstract: The laser (20) of a laser-generated windshield display (10) is controlled (22, 46) to initially deflect the laser beam in the direction of a reflective target (26) disposed outside a display region (24) of the windshield (12), and a sensor (28) disposed in a reflection path of the target (26) is sampled (22, 48) to detect the presence of a feedback signal that occurs when the laser beam impinges on the sensor (28). If the feedback signal is detected, the laser beam is deflected onto the display region (24) to generate a driver display (22, 48-52); but if the feedback signal is not detected, the laser (20) is automatically turned-off (22, 48, 58). Once the laser (22) is turned off for lack of a feedback signal, the control is repeated following a specified delay interval (22, 60, 62) so that the driver display will automatically resume the when the condition that prevented generation of the feedback signal is cured.

    EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT
    14.
    发明公开
    EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT 审中-公开
    用于电子器件组件的边缘密封，其适合用于暴露于导电的冷却剂

    公开(公告)号：EP2814310A2

    公开(公告)日：2014-12-17

    申请号：EP14171564.9

    申请日：2014-06-06

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

    IPC: H05K7/20

    CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

    Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

    Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的外周的金属套筒密封，以形成一个装置组件（10），电介质板。 构造允许所述电子装置和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

    Volumetric display using electrowetting mirror arrays
    15.
    发明公开
    Volumetric display using electrowetting mirror arrays 审中-公开
    Volumetrisches Display Unter Verwendung von Elektrowetting-Spiegelarrays

    公开(公告)号：EP2667240A1

    公开(公告)日：2013-11-27

    申请号：EP13167824.5

    申请日：2013-05-15

    Applicant: Delphi Technologies, Inc.

    Inventor： Kuhlman, Frederick F. ,  Loong, Daniel Leong Woon ,  Parker, Richard D.

    IPC: G02B27/22 ,  G09G3/00 ,  H04N13/04

    CPC classification number: G06T15/08 ,  G02B27/2271 ,  G09G3/003 ,  G09G3/348 ,  H04N13/363 ,  H04N13/388

    Abstract: A volumetric display (10) that includes a dispersion block (12) defining a plurality of voxels (18) that are characterized as being visibly apparent when illuminated by impinging light, a projector (20) configured to project one or more light rays (16) for illuminating one or more of the plurality of voxels (18), and a plurality of arrays (22) of electrowetting mirrors (24) arranged about the dispersion block (12), wherein each electrowetting mirror is operable to reflect a light ray (16a) from the projector (20) toward a selected voxel (26). The arrays (22) of electrowetting mirrors (24a1) provide for a volumetric display (10) that is readily focused.

    Abstract translation: 一种体积显示器（10），包括限定多个体素（18）的分散块（12），所述体素（18）被特征在通过照射光而被明显地识别;投影仪（20），被配置为投影一个或多个光线 ），用于照射所述多个体素（18）中的一个或多个，以及围绕所述分散块（12）布置的多个电润湿反射镜（24）阵列（22），其中每个电润湿反射镜可操作以反射光线 16a）从投影仪（20）朝向选定的体素（26）。 电润湿反射镜（24a1）的阵列（22）提供容易聚焦的体积显示器（10）。

    Electronic assembly with controlled metal particle-containing solder joint thickness
    17.
    发明公开
    Electronic assembly with controlled metal particle-containing solder joint thickness 审中-公开
    与金属颗粒含有焊料接头的受控厚度的电子设备

    公开(公告)号：EP1725087A1

    公开(公告)日：2006-11-22

    申请号：EP06075962.8

    申请日：2006-04-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Kuhlman, Frederick F. ,  Carter, Bradley H. ,  Parker, Richard D. ,  Yeh, Shing

    IPC: H05K3/34 ,  B23K35/02

    CPC classification number: H05K3/3484 ,  H01L24/32 ,  H01L2224/29 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0215 ,  H05K2201/0266 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

    Abstract: An electronic assembly (200,400,400A) includes a bare IC die or a leadless electronic component (406A) having at least one electrically conductive contact formed on a surface of the die (106,406) or the component (406A) and a leadframe (102) or a substrate (402,402A) having at least one electrically conductive trace. The conductive contact of the component (406A) is electrically and mechanically coupled to the conductive trace with a solder joint (108,408). The solder joint (108,408) includes a plurality of solid electrically conductive metal particles (110,410) having a substantially spherical shape and a diameter ranging from about one mil to about ten mils.

    Abstract translation: 电子组件的裸（200,400,400A）包括IC，或无引线电子元件具有形成在模具（106.406）或组分（406A）的一个表面上的至少一个导电接触，并且在引线框架（102）（406A），或 衬底（402,402A），其具有至少一个导电迹线。 组分（406A）的导电性触头的电和机械地耦合到与一个焊接接头（108.408）的导电迹线。 焊点（108.408）包括具有基本上球形的形状，并且直径范围从约1密耳至约10密耳固体导电金属颗粒（110.410）的复数。

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