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    Filtered electrical connector assembly for an overmolded electronic package
    2.
    发明公开
    Filtered electrical connector assembly for an overmolded electronic package 审中-公开
    用于过滤的电子结构为一个副电气连接的排列注入

    公开(公告)号：EP1437930A2

    公开(公告)日：2004-07-14

    申请号：EP03078888.9

    申请日：2003-12-08

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A. ,  Laudick, David A.

    IPC: H05K5/06 ,  H05K9/00

    CPC classification number: H05K1/0233 ,  H01R13/719 ,  H01R43/24 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/2036

    Abstract: An electronic package (50) and filtered electrical connector assembly (64) includes number of connector pins (80 1 - 80 N ) extending away from a main circuit board (58) having a first ground plane (56), and an auxiliary circuit board (90) having a second ground plane (92) is positioned over board (58) with the connector pins (80 1 - 80 N ) extending therethrough and electrically connected to a corresponding number of capacitors (94 1 - 94 N ) mounted to board (90). An inductive block (82) and surrounding conductive spacer block (86) are positioned between boards (58) and (90) with the connector pins (80 1 - 80 N ) extending through block (82) with block (86) electrically contacting the ground planes (56) and (92). A connector shroud (104) surrounds the connector pins (80 1 - 80 N ) extending through board (90), and all components are bonded together via an overmolding process to form the electronic package (50).

    Abstract translation: 甲滤波的电连接器组件包括校正器销从主电路板延伸远，具有在辅助电路板的主电路板和辅助电路板，连接器护罩（104）之间定位的感应块上连接器插针副电路基板（90） 和围绕所述第一和第二接地平面之间的连接器引脚，和电元件（60）。 甲滤波的电连接器组件包括校正器销从所述主电路板（58），延伸远离具有在所述辅助电路板和包围所述主电路板和辅助电路板，连接器罩之间定位感应块上连接器插针辅助电路板 连接器销，以及在第一和第二接地层之间的电组件。 连接器引脚电耦合到经由多个电容器CORRESPONDING中的一个在辅助电路板限定的第二接地层。 因此独立claimsoft被包括在包覆成型的电子封装形成滤波的电连接器组件，其用于，在安装包括多个连接器引脚并通过辅助电路板的方法; 安装电容器的相应数量的所述辅助电路板的第一表面与每个电连接的相应连接器插脚和形成在所述第一表面，并且因此在辅助电路板的相对的第二表面上的第二公共接地平面之间的电容的 ; 感应块走上的连接器插脚从与连接器管脚过感应块扩展数目的辅助电路板的所述第二表面延伸的数目的定位; 关于感应块导电构件的定位; 安装的连接器插脚从感应块延伸到并通过与所述导电构件电接触所述第一和第二接地层的主电路板的数量; 所述主电路板定位到一背板; 定位连接器罩到用周围芯片的电容器的数目和连接器引脚从辅助电路板的所述第一表面延伸的数目的连接器护罩中的辅助电路板的所述第一表面上; 和键合在一起的辅助电路板，连接器罩，感应块，导电构件，所述主电路板，并通过可成型模塑料（120）背板以形成电子封装。

    Method of overmolding an electronic assembly having an insert-moled vertical mount connector header
    7.
    发明公开
    Method of overmolding an electronic assembly having an insert-moled vertical mount connector header 审中-公开
    围绕电子组件铸造用的插入件的方法模制的垂直支撑连接头部

    公开(公告)号：EP2043413A2

    公开(公告)日：2009-04-01

    申请号：EP08164258.9

    申请日：2008-09-12

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Laudick, David A.

    IPC: H05K5/00

    CPC classification number: H05K5/0034 ,  H05K3/284 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/1316 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T29/4922

    Abstract: An electronic assembly (10) including a vertical mount connector header (16) is overmolded to form an encapsulated module. Conductor pins (16c) retained in the connector header (16) are coupled to a circuit board (14) to support the connector header (16) with respect to the circuit board (14), leaving an open space between the connector header (16) and the circuit board (14). The electronic assembly (10) is then placed in a mold (30) for plastic encapsulation. The floor of the mold (30) has a well (36) sized to accommodate the conductor pins (16c) and shroud (16a) of the connector header (16), and the connector header (16) has a peripheral flange (16f) that seats against the floor of the mold (30) to keep encapsulant (20) out of the well (36). Encapsulant (20) fills open spaces inboard of the connector header (16), and a connector insert (40) disposed between the connector header (16) and the floor of the well (36) prevents distention of the connector header (16) and circuit board (14) due to the packing pressure of the encapsulant (20).

    Abstract translation: 一种电子组件（10）包括垂直安装的连接器头（16）被包覆模制，以形成包封的模块。 导电销（16C）保持在所述连接器插头（16）被耦合到一个电路板（14）相对于所述电路板（14），以支持在连接器头（16），在离开连接器插头之间的开放空间（16 ）和电路板（14）。 所述的电子组件（10）然后，在用于塑料封装的模具（30）放置。 所述模具（30）的底板有一个孔（36）尺寸设计成容纳所述连接器头（16）和所述连接器插头（16）的导电销（16C）和护罩（16A）具有周边凸缘（16F） 并针对模具（30）的地板席位，以保持密封件（20）出井（36）。 密封剂（20）填充所述连接器插头（16）和所述井的底板（36）之间设置开放空间内侧的连接器插头（16），和一个连接器插头（40）的防止连接器插头的腹胀（16）和 电路板（14）由于所述密封剂（20）的填充压力。

    Method of making an electronic assembly
    8.
    发明公开
    Method of making an electronic assembly 审中-公开
    韦尔法罕zur Herstellung einer elekronischen Baugruppe

    公开(公告)号：EP1748479A2

    公开(公告)日：2007-01-31

    申请号：EP06076288.7

    申请日：2006-06-23

    Applicant: Delphi Technologies, Inc.

    Inventor： Lawlyes, Daniel A. ,  Laudick, David A.

    IPC: H01L21/56

    CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L21/565 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00

    Abstract: A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed. An encapsulating material, preferably an epoxy material, is transferred or injected into the mold cavity to fill space between the respective surfaces of the electronic component and the circuit board and then cured to encapsulate the solder bumps that have been reflowed. An optional integrated heat sink for the electronic component may be used when practicing the method of the invention to make an electronic assembly.

    Abstract translation: 一种制造电子组件的方法，其包括通过电子部件的突出的焊料凸块附接到电路板的电子部件将电子部件放置在电路板的表面上，使得电子部件的底部上的焊料凸块接触 电路板顶部的焊盘。 焊料凸块然后被回流以将电子部件附接到电路板，之后通过提供具有模具腔的模具，通向模具腔的门和从模具腔引出的通风孔来对电子部件进行未填充。 将模具放置在电子部件上并且放置在电路板的表面上，使得电子部件在模腔内部并且模腔被密封。 将封装材料（优选环氧树脂材料）转移或注入模腔中以填充电子部件和电路板的相应表面之间的空间，然后固化以封装已经回流的焊料凸块。 在实施本发明的方法来制造电子组件时，可以使用用于电子部件的可选的集成散热器。

    Technique for manufacturing an overmolded electronic assembly
    9.
    发明公开
    Technique for manufacturing an overmolded electronic assembly 有权
    技术人士Herstellen von einer umgossenen elektronischen Baugruppe

    公开(公告)号：EP1734800A2

    公开(公告)日：2006-12-20

    申请号：EP06076163.2

    申请日：2006-06-02

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Laudick, David A.

    IPC: H05K3/28 ,  H05K3/00 ,  H05K5/00

    CPC classification number: H01L23/3121 ,  H01L23/4334 ,  H01L25/0652 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K5/0034 ,  H05K7/20854 ,  H05K2201/09063 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: A technique for manufacturing an electronic assembly (300) includes a number of steps. Initially, a backplate (302) with a cavity (319) formed into a first side of the backplate (302) is provided. Next, a substrate (304) with a first side of an integrated circuit (IC) die (306A) mounted to a first side of the substrate (304) is provided. The IC die (306A) is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate (304). The substrate (304) includes a hole (320) approximate an outer edge of the IC die (306A). The first side of the substrate (304) is then positioned in contact with at least a portion of the first side of the backplate (302). The IC die (306A) is positioned within the cavity (319) with a second side of the IC die (306A) in thermal contact with the backplate (302). The substrate (304) and at least a portion of the backplate (302) are overmolded with an overmold material (350), which enters the cavity (319) through the hole to substantially underfill the IC die (306A) and substantially fill an unoccupied portion of the cavity (319).

    Abstract translation: 一种用于制造电子组件（300）的技术包括多个步骤。 首先，设置有形成在背板（302）的第一侧上的空腔（319）的背板（302）。 接下来，提供安装在基板（304）的第一侧的具有集成电路（IC）管芯（306A）的第一侧的基板（304）。 IC管芯（306A）电连接到形成在衬底（304）的第一侧上的多个导电迹线中的一个或多个。 基板（304）包括近似于IC管芯（306A）的外边缘的孔（320）。 然后将衬底（304）的第一侧定位成与背板（302）的第一侧的至少一部分接触。 IC模具（306A）位于空腔（319）内，IC芯片（306A）的第二面与背板（302）热接触。 衬底（304）和背板（302）的至少一部分用包覆成型材料（350）包覆成型，该二次模制材料通过孔进入空腔（319），以基本上填充IC管芯（306A）并基本上填充未占用 空腔（319）的一部分。

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