公开(公告)号：EP2410376A1

公开(公告)日：2012-01-25

申请号：EP11172687.3

申请日：2011-07-05

Applicant: Delphi Technologies, Inc.

Inventor： Kuhlman, Frederick F. ,  Harbach, Andrew P. ,  Parker, Richard D. ,  Sarma, Dwadasi H. R.

IPC: G02F1/1347 ,  G02F1/133 ,  G09G3/36

CPC classification number: G02F1/1347 ,  G02F1/13306 ,  G02F1/13338 ,  G02F2001/133342 ,  G09G3/003 ,  G09G3/348 ,  G09G3/36 ,  G09G3/38 ,  G09G2300/023

Abstract: A dual view display system (10) to display two different images in substantially opposite directions (A,B) using a single transparent display (20) to time-multiplex the images and shutter devices (32,34) to alternately block each side (A,B) from being viewed according to the image being displayed.

Abstract translation: 一种双视图显示系统（10），用于使用单个透明显示器（20）以基本上相反的方向（A，B）显示两个不同的图像，以对图像和快门设备（32,34）进行时间复用以交替地阻挡每一侧 A，B）根据正在显示的图像进行观看。

公开(公告)号：EP2040296A2

公开(公告)日：2009-03-25

申请号：EP08164294.4

申请日：2008-09-12

Applicant: Delphi Technologies, Inc.

Inventor： Webster, Mark E. ,  Parker, Richard D.

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19104 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming a Ball Grid Array (BGA) package having an increased standoff height after solder reflow is described. A substrate containing a plurality of first solder bond pads and a component containing a plurality of second solder bond pads are arranged in parallel spaced relationship to form an arrangement, each first and second bond pad being in contact with a solder ball therebetween. Solder balls are formed of a core, which remains solid at solder reflow temperatures, encapsulated with a reflowable solder layer. First standoff height of the arrangement is largely determined by the diameter of the solder ball. Upon heating to solder reflow temperatures, the solder coalesces between the core and the bond pads. Upon cooling of the arrangement, the second standoff height of the BGA package is greater than the first standoff height of the arrangement.

Abstract translation: 描述了在焊料回流之后形成具有增加的间隔高度的球栅阵列（BGA）封装的方法。 包含多个第一焊料接合焊盘的衬底和包含多个第二焊料接合焊盘的部件以平行间隔的关系布置以形成布置，每个第一和第二接合焊盘与它们之间的焊球接触。 焊球由芯体形成，芯体在焊料回流温度下保持固体，用可回流焊料层封装。 该布置的第一间隔高度在很大程度上取决于焊球的直径。 当加热到回流焊温度时，焊料在芯和焊盘之间聚结。 在布置冷却时，BGA封装的第二间隔高度大于布置的第一间隔高度。

公开(公告)号：EP2645839A3

公开(公告)日：2017-04-26

申请号：EP13160107.2

申请日：2013-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 一种液冷功率电子组件（10），其被配置为使用导电冷却剂（16）来冷却功率电子设备，该功率电子设备使用围绕介电板的周边用金属密封件密封的介电板以形成设备组件（10），然后 在装置组件（10）和壳体（18）之间形成另一金属密封。 该配置允许电子设备（12）和冷却剂（16）之间更直接的接触，同时保护电子设备（12）不与潜在导电的冷却剂（16）接触。 选择用于形成电介质板和壳体（18）的材料以具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

公开(公告)号：EP2233962B1

公开(公告)日：2016-01-06

申请号：EP10156104.1

申请日：2010-03-10

Applicant: Delphi Technologies, Inc.

Inventor： Newman, Timothy J. ,  Parker, Richard D.

IPC: G02B27/01

CPC classification number: G02B27/01

公开(公告)号：EP2410756A2

公开(公告)日：2012-01-25

申请号：EP11173580.9

申请日：2011-07-12

Applicant: Delphi Technologies, Inc.

Inventor： Kuhlman, Frederick F. ,  Harbach, Andrew P. ,  Parker, Richard D. ,  Sarma, Dwadasi H. R. ,  Hargis, Marian C. ,  Skiver, Steven G.

IPC: H04N13/04

CPC classification number: H04N9/3147 ,  B60K35/00 ,  B60K37/00 ,  B60K2350/1068 ,  B60K2350/2052 ,  B60K2350/2056 ,  G02B27/0101 ,  G02B2027/0165 ,  G03B21/26 ,  G03B21/28 ,  H04N2013/403

Abstract: A system and method to display a plurality of different images at multiple distinct locations using a single image projector and an image propagation control means to control a propagation pathway from the projector to a display at each location.

Abstract translation: 一种系统和方法，使用单个图像投影仪和图像传播控制装置，以控制来自投影仪的传播途径在每个位置处的显示，以显示在多个不同的位置处的不同的图像的多元性。

公开(公告)号：EP2814310A3

公开(公告)日：2015-04-08

申请号：EP14171564.9

申请日：2014-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

公开(公告)号：EP2645839A2

公开(公告)日：2013-10-02

申请号：EP13160107.2

申请日：2013-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的周边的金属密封件，以形成一个装置组件（10）密封的电介质板，然后 形成器件组件（10）和壳体（18）之间的另一个金属密封件。 该配置允许电子设备（12）和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备（12）从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

公开(公告)号：EP2233962A2

公开(公告)日：2010-09-29

申请号：EP10156104.1

申请日：2010-03-10

Applicant: Delphi Technologies, Inc.

Inventor： Newman, Timothy J. ,  Parker, Richard D.

IPC: G02B27/01

CPC classification number: G02B27/01

Abstract: The laser (20) of a laser-generated windshield display (10) is controlled (22, 46) to initially deflect the laser beam in the direction of a reflective target (26) disposed outside a display region (24) of the windshield (12), and a sensor (28) disposed in a reflection path of the target (26) is sampled (22, 48) to detect the presence of a feedback signal that occurs when the laser beam impinges on the sensor (28). If the feedback signal is detected, the laser beam is deflected onto the display region (24) to generate a driver display (22, 48-52); but if the feedback signal is not detected, the laser (20) is automatically turned-off (22, 48, 58). Once the laser (22) is turned off for lack of a feedback signal, the control is repeated following a specified delay interval (22, 60, 62) so that the driver display will automatically resume the when the condition that prevented generation of the feedback signal is cured.

Abstract translation: 激光产生的挡风玻璃显示器（10）的激光器（20）被控制（22,46），以使激光束沿设置在挡风玻璃的显示区域（24）外侧的反射目标（26）的方向偏转 12），并且设置在目标（26）的反射路径中的传感器（28）被采样（22,48）以检测当激光束照射在传感器（28）上时发生的反馈信号的存在。 如果检测到反馈信号，则激光束被偏转到显示区域（24）上以产生驱动器显示（22,48-52）; 但如果没有检测到反馈信号，则激光器（20）自动关闭（22,48,58）。 一旦激光器（22）由于缺乏反馈信号而被关闭，则在指定的延迟间隔（22,60,62）之后重复控制，使得当阻止产生反馈的条件时，驾驶员显示将自动恢复 信号被治愈。

公开(公告)号：EP1566992A3

公开(公告)日：2007-01-24

申请号：EP05075327.6

申请日：2005-02-10

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Degenkolb, Thomas A. ,  Mandel, Larry M. ,  Parker, Richard D.

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0271 ,  H05K2201/10189 ,  H05K2203/1316

Abstract: An electronic assembly (100) having an associated connector and/or a mold (120/122) is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board (102) of the electronic assembly (100) when the electronic assembly (100) is overmolded.

公开(公告)号：EP2645839B1

公开(公告)日：2018-09-12

申请号：EP13160107.2

申请日：2013-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.