公开(公告)号：EP2567400A4

公开(公告)日：2017-12-27

申请号：EP11777742

申请日：2011-03-21

Applicant: IBM

Inventor： HORAK DAVID V ,  NOGAMI TAKESHI ,  PONOTH SHOM ,  YANG CHIH-CHAO

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/53238 ,  H01L21/76805 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Interconnect structures having self-aligned dielectric caps are provided. At least one metallization level is formed on a substrate. A dielectric cap is selectively deposited on the metallization level.

公开(公告)号：EP2084738A4

公开(公告)日：2011-10-12

申请号：EP07844133

申请日：2007-10-11

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  YANG HAINING S ,  WONG KEITH KWONG HON ,  FAROOQ MUKTA G

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L23/53238 ,  H01L21/76834 ,  H01L21/76843 ,  H01L21/76883 ,  H01L21/76885 ,  H01L23/53223 ,  H01L23/53266 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2047505A4

公开(公告)日：2011-10-05

申请号：EP07840384

申请日：2007-07-10

Applicant: IBM

Inventor： YANG CHIH-CHAO

IPC: H01L21/768 ,  H01L23/52

CPC classification number: H01L21/7682 ,  H01L21/76835

公开(公告)号：EP1920493A4

公开(公告)日：2011-05-04

申请号：EP06802645

申请日：2006-08-30

Applicant: IBM

Inventor： HSU LOUIS C ,  CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  RADENS CARL J ,  WONG KEITH KWONG HON ,  YANG CHIH-CHAO

IPC: H01H50/00 ,  H01P1/10

CPC classification number: H01H50/005 ,  H01H2050/007 ,  Y10T29/4902 ,  Y10T29/49105 ,  Y10T29/49147

公开(公告)号：EP1941545A4

公开(公告)日：2011-03-30

申请号：EP06825349

申请日：2006-10-03

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  GAUDET SIMON ,  LAVOIE CHRISTIAN ,  PONOTH SHOM ,  SPOONER TERRY A

IPC: H01L23/58 ,  H01L23/532

CPC classification number: H01L21/76843 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76873 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1869700A4

公开(公告)日：2010-12-15

申请号：EP06740771

申请日：2006-04-07

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  CLEVENGER LAWRENCE A ,  COWLEY ANDREW P ,  DALTON TIMOTHY J ,  YOON MEEYOUNG H

IPC: H01L21/4763 ,  H01L21/768

CPC classification number: H01L21/76849 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76831 ,  H01L21/76843 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1836726A4

公开(公告)日：2010-07-28

申请号：EP05852629

申请日：2005-12-02

Applicant: IBM

Inventor： CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  HSU LOUIS C ,  RADENS CARL J ,  STANDAERT THEODORUS E ,  WONG KEITH KWONG HON ,  YANG CHIH-CHAO

IPC: H01L21/4763

CPC classification number: H01L21/76852 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/76885 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2084711A4

公开(公告)日：2009-11-25

申请号：EP07843111

申请日：2007-09-25

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  YANG HAINING

IPC: G11C17/14 ,  H01L23/525

CPC classification number: H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00