公开(公告)号：EP1547133A4

公开(公告)日：2008-11-26

申请号：EP03754842

申请日：2003-09-23

Applicant: IBM ,  INFINEON TECHNOLOGIES CORP

Inventor： NING XIAN J ,  WONG KEITH KWONG HON

IPC: H01L21/02 ,  H01L21/316 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L23/5223 ,  H01L21/31604 ,  H01L21/76807 ,  H01L28/55 ,  H01L28/60 ,  H01L28/86 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A metal-insulator-metal (MIM) capacitor (242/252) structure and method of forming the same. A dielectric layer (214) of a semiconductor device (200) is patterned with a dual damascene pattern having a first pattern (216) and a second pattern (218). The second pattern (218) has a greater depth than the first pattern (216). A conductive layer (226) is formed over the dielectric layer (214) in the first pattern, and a conductive layer is formed over the conductive layer in the first pattern (216). A dielectric layer (232), conductive layer (234), dielectric layer (236) and conductive layer (238) are disposed over the conductive layer (226) of the second pattern (218). Conductive layer (234), dielectric layer (232) and conductive layer (226) form a first MIM capacitor (252). Conductive layer (238), dielectric layer (236) and conductive layer (234) form a second MIM capacitor (242) parallel to the first MIM capacitor (242).

公开(公告)号：EP2377148A4

公开(公告)日：2016-03-16

申请号：EP09836605

申请日：2009-11-19

Applicant: IBM ,  FREESCALE SEMICONDUCTOR INC

Inventor： RAMACHANDRAN RAVIKUMAR ,  YAN HONGWEN ,  MOUMEN NAIM ,  SCHAEFFER JAMES KENYON ,  KRISHNAN SIDDARTH A ,  WONG KEITH KWONG HON ,  KWON UNOH ,  BELYANSKY MICHAEL P ,  WISE RICHARD

IPC: H01L21/3205 ,  H01L21/8238

CPC classification number: H01L21/823842 ,  H01L21/823857

公开(公告)号：EP1946361A4

公开(公告)日：2011-03-09

申请号：EP06773615

申请日：2006-06-20

Applicant: IBM

Inventor： WONG KEITH KWONG HON ,  PURTELL ROBERT JOSEPH

IPC: H01L21/4763 ,  C23C14/34 ,  H01L21/285

CPC classification number: H01L21/28518 ,  C23C14/16 ,  C23C14/32 ,  C23C14/345 ,  H01L21/28052 ,  H01L21/2855 ,  H01L29/66507 ,  H01L29/78

公开(公告)号：EP1911096A4

公开(公告)日：2008-10-22

申请号：EP06788341

申请日：2006-07-24

Applicant: IBM

Inventor： DALTON TIMOTHY J ,  HSU LOUIS L C ,  WONG KEITH KWONG HON ,  YANG CHIH-CHAO ,  GAIDIS MICHAEL C ,  RADENS CARL ,  CLEVENGER LAWRENCE A

IPC: H01L27/22 ,  H01L21/768 ,  H01L21/8247 ,  H01L23/528 ,  H01L43/12

CPC classification number: B82Y10/00 ,  H01L27/222 ,  H01L43/12

Abstract: A magnetic random access memory (MRAM) device includes a magnetic tunnel junction (MTJ) stack formed over a lower wiring level, a hardmask formed on the MTJ stack, and an upper wiring level formed over the hardmask. The upper wiring level includes a slot via bitline formed therein, the slot via bitline in contact with the hardmask and in contact with an etch stop layer partially surrounding sidewalls of the hardmask.

公开(公告)号：EP2084738A4

公开(公告)日：2011-10-12

申请号：EP07844133

申请日：2007-10-11

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  YANG HAINING S ,  WONG KEITH KWONG HON ,  FAROOQ MUKTA G

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L23/53238 ,  H01L21/76834 ,  H01L21/76843 ,  H01L21/76883 ,  H01L21/76885 ,  H01L23/53223 ,  H01L23/53266 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1872407A4

公开(公告)日：2011-09-14

申请号：EP06750529

申请日：2006-04-18

Applicant: IBM

Inventor： CARTIER EDUARD A ,  COPEL MATTHEW W ,  DORIS BRUCE B ,  JAMMY RAJARAO ,  KIM YOUNG-HEE ,  LINDER BARRY P ,  NARAYANAN VIJAY ,  PARUCHURI VAMSI K ,  WONG KEITH KWONG HON

IPC: H01L21/84 ,  H01L21/8238 ,  H01L27/092

CPC classification number: H01L21/823842

公开(公告)号：EP1920493A4

公开(公告)日：2011-05-04

申请号：EP06802645

申请日：2006-08-30

Applicant: IBM

Inventor： HSU LOUIS C ,  CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  RADENS CARL J ,  WONG KEITH KWONG HON ,  YANG CHIH-CHAO

IPC: H01H50/00 ,  H01P1/10

CPC classification number: H01H50/005 ,  H01H2050/007 ,  Y10T29/4902 ,  Y10T29/49105 ,  Y10T29/49147

公开(公告)号：EP1836726A4

公开(公告)日：2010-07-28

申请号：EP05852629

申请日：2005-12-02

Applicant: IBM

Inventor： CLEVENGER LAWRENCE A ,  DALTON TIMOTHY J ,  HSU LOUIS C ,  RADENS CARL J ,  STANDAERT THEODORUS E ,  WONG KEITH KWONG HON ,  YANG CHIH-CHAO

IPC: H01L21/4763

CPC classification number: H01L21/76852 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/76885 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00