摘要:
The MEMS actuator (10) is formed by a main body (15) that has a central portion (29A), couplable to a substrate (11), and a peripheral portion (29B), which is suspended over the substrate when the central portion is coupled to the substrate and has a deformable structure (35*), which at rest has a spiral planar shape, extends around the central portion (29A), and forms a plurality of membranes (35) arranged in succession. The MEMS actuator has a plurality of bearing structures (38, 39) and, for each bearing structure, a corresponding piezoelectric actuator (40). The bearing structures are fixed at the top to the deformable structure (35*) and laterally delimit corresponding cavities (37), each having a lateral opening (AP) facing the central portion (29A) of the main body (15) and closed at the top by a corresponding membrane (35), of which a fixed part is fixed to the underlying bearing structure and a suspended part is laterally offset with respect to the underlying bearing structure. The piezoelectric actuators are controllable so as to cause a deformation of the corresponding membrane and a rotation of the bearing structures around the central portion of the main body.
摘要:
The micro-electro-mechanical device is formed by a fixed structure (64) having a cavity (63); a tiltable structure (62) elastically suspended over the cavity (63), having a main extension in a tiltable plane (AB), and rotatable about a rotation axis (B) parallel to the tiltable plane (AB); and a piezoelectric actuation structure (70) including at least a first and a second driving arm (72A, 72B), the first and the second driving arms carrying respective piezoelectric material regions (73) and extending on opposite sides of the rotation axis (B). The first and the second driving arms (72A, 72B) are rigidly coupled to the fixed structure (64) and are elastically coupled to the tiltable structure (62). A stop structure (83A-83D) limits movements of the tiltable structure (62) with respect to the actuation structure (70) along a planar direction (A) perpendicular to the rotation axis (B). The stop structure has a first planar stop element (83A) formed between the first driving arm (72A) and the tiltable structure (62) and a second planar stop element (83B) formed between the second driving arm (72B) and the tiltable structure.
摘要:
A MEMS device (40) has a platform (45) carried by a frame (48) via elastic connection elements (46) configured to enable rotation of the platform about a first axis (A). A bearing structure (41) supports the frame (48) through first and second elastic suspension arms configured to enable rotation of the frame (48) about a second axis (B), transverse to the first axis (A). The elastic suspension arms (49) are anchored to the bearing structure (41) through respective anchorage portions (50) arranged offset with respect to the second axis (B). A stress sensor (51, 52) is formed by a first and a second sensor element (51, 52), respectively arranged on the first and second suspension arms (49), in proximity of the anchorage portions, on a same side of the second axis (B), in a symmetrical position with respect to the first axis (A).
摘要:
A microelectromechanical mirror device (3) has a first mirror tiltable structure (3a, 10) provided in a first die (11) of semiconductor material having a main extension in a horizontal plane (xy) defined by a first (x) and by a second (y) horizontal axes. The first mirror tiltable structure (3a, 10) has: a fixed structure (14) defining a frame (14') which delimits a cavity (13); a tiltable element (12) carrying a reflecting region (12'), elastically suspended above the cavity (13) and having a first (A) and a second (B) median axes of symmetry, elastically coupled to the frame (14') by a first (15a) and a second (15b) coupling structures, on opposite sides of the second axis (B); and a driving structure (20), coupled to the tiltable element (12) to cause it to rotate around the first axis (A) with a resonance movement. The first mirror tiltable structure (3a, 10) is asymmetrical with respect to the second axis (B) and has, along the first horizontal axis (x): a first extension dimension (d1), on a first side of the second axis (B); and a second extension dimension (d2), greater than the first extension dimension (d1), on a second side of the second axis (B), opposite to the first side.
摘要:
A microelectromechanical mirror device (1) has a fixed structure (4) defining an external frame (4') which delimits a cavity (3); an internal frame (7), arranged above the cavity and defining a window (8); a tiltable structure (2) with a reflective surface (2'), arranged in the window and elastically coupled to the internal frame by a first and a second coupling elastic elements (9a, 9b); an actuation structure (10), coupled to the internal frame to cause the rotation, in a decoupled manner, of the tiltable structure around a first and a second rotation axis (SA, FA). The actuation structure has a first pair of driving arms (12a, 12b), elastically coupled to the internal frame and carrying piezoelectric material regions to cause a rotation of the tiltable structure around the first rotation axis; and a further pair of driving arms (12e, 12f), carrying piezoelectric material regions to cause a rotation of the tiltable structure around the second rotation axis and interposed between the fixed structure and the internal frame, to which they are elastically coupled by a first and a second suspension elastic elements (14e, 14f), yielding to torsion around the first rotation axis.
摘要:
A microelectromechanical mirror device (1; 100) has, in a die (1') of semiconductor material: a fixed structure (4) defining a cavity (3); a tiltable structure (2) carrying a reflecting region (2'), elastically suspended above the cavity; at least a first pair of driving arms (12a, 12b), coupled to the tiltable structure and carrying respective piezoelectric material regions (13) which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements (6a, 6b), which couple the tiltable structure elastically to the fixed structure, being stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor (20), configured to provide a detection signal (S r ) indicative of the rotation of the tiltable structure. At least one test structure (30, 30') is integrated in the die to provide a calibration signal (S c ) indicative of a sensitivity variation of the piezoresistive sensor (20), in order to calibrate the detection signal (S r ).
摘要:
A process for manufacturing a microelectromechanical mirror device includes: in a semiconductor wafer (50), defining a support frame (2), a plate (5) connected to the support frame (2) so as to be orientable around at least one rotation axis (X) and cantilever structures (9) extending from the support frame (2) and coupled to the plate (5) so that bending of the cantilever structures (9) causes rotations of the plate (5) around the at least one rotation axis (X); forming piezoelectric actuators (10) on the cantilever structures (9); forming pads (12) on the support frame (2); and forming spacer structures (25) protruding from the support frame (2) more than both the pads (12) and the stacks of layers (15, 16, 17, 20, 21, 22) forming the piezoelectric actuators (10).
摘要:
The MEMS device (1) is formed by a body (5) of semiconductor material, which defines a support structure (10); by a pass-through cavity (15) in the body, which is surrounded by the support structure; by a movable structure (20) suspended in the pass-through cavity; by an elastic structure (25), which extends in the pass-through cavity between the support structure (10) and the movable structure (20). The elastic structure has a first portion (25A) and a second portion (25B) and is subject, in use, to mechanical stress. The MEMS device is further formed by a metal region (45), which extends on the first portion (25A) of the elastic structure (25), and by a buried cavity (30) in the elastic structure, wherein the buried cavity extends between the first and the second portions of the elastic structure.
摘要:
A method of processing a wafer (100) for manufacturing an oscillating structure (30), comprising the steps of: forming torsional elastic elements (56, 58); forming a mobile element (54, 60) connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure (112); and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.
摘要:
A microelectromechanical mirror device (200) has: a fixed structure (24) defining a cavity (23); a tiltable structure (22) carrying a reflecting surface (22'), elastically suspended above the cavity (23) and having a main extension in a horizontal plane (xy); elastic elements (26a-26b, 34a-34d) coupled to the tiltable structure (22); at least one first pair of driving arms (32a, 32b), which carry respective regions of piezoelectric material (33), that can be biased to cause rotation of the tiltable structure (22) about at least one first axis of rotation (X) parallel to a first horizontal axis (x) of the horizontal plane (xy), are elastically coupled to the tiltable structure on opposite sides of the first axis of rotation (X) and are interposed between the tiltable structure (22) and the fixed structure (24). The driving arms (32a, 32b) have, along an orthogonal axis (z) transverse to the horizontal plane (xy), a thickness smaller than that of at least some of the elastic elements (26a-26b, 34a-34d) coupled to the tiltable structure (22).