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公开(公告)号：EP4108462A1
公开(公告)日：2022-12-28
申请号：EP22179954.7
申请日：2022-06-20
摘要： A microfluidic device (1) has a chamber (17); a fluidic access channel (20) in fluidic connection with the chamber; a plurality of nozzle apertures (34) in fluidic connection with the chamber; and an actuator (18), operatively coupled to the fluid containment chamber and configured to cause ejection of drops of fluid through the nozzle apertures in an operating condition of the microfluidic device. The chamber (17) has an elongated shape, with a length and a maximum width, wherein an aspect ratio between the length and the maximum width of the chamber is at least 3:1. The nozzle apertures (34) are configured to generate, in use, a plurality of drops having a total drop volume, wherein a ratio total drop volume to a chamber volume is at least 15%.
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2.发明公开
公开(公告)号：EP3838315A1
公开(公告)日：2021-06-23
申请号：EP20212023.4
申请日：2020-12-04
发明人： GIUSTI, Domenico , MARTINI, Irene
摘要： The microfluidic dispensing device (50) has a plurality of chambers (52) arranged in sequence, each having an inlet receiving a liquid to be dispensed and a nozzle for emitting a drop of liquid; a plurality of actuators (59), one per chamber, receiving an actuation quantity and causing a drop of liquid to be emitted by the nozzle of the respective chamber; a plurality of drop emission detection elements (51), one for each chamber (52), generating an actuation command upon detecting the emission of a drop of liquid; and a sequential activation electric circuit including a plurality of sequential activation elements (60B, 60C, 60D), one for each chamber (52), each coupled to the drop emission detection element (51) of the respective chamber and to an actuator (59) associated with a subsequent chamber in the sequence of chambers. Each sequential activation element receives the actuation command from the drop emission detection element (51) associated with the respective chamber and, in response thereto, activates the actuator associated with the subsequent chamber in the sequence of chambers.
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3.发明公开
公开(公告)号：EP3725531A1
公开(公告)日：2020-10-21
申请号：EP20169708.3
申请日：2020-04-15
摘要： An ejection device (1) for a fluid (6), comprising: a first semiconductor wafer (2), housing, on a first side thereof, a piezoelectric actuator (3) and an outlet channel (33) for the fluid (6) alongside the piezoelectric actuator (3); a second semiconductor wafer (4) having, on a first side thereof, a recess (10) and, on a second side thereof opposite to the first side, at least one inlet channel (9) for said fluid (6) fluidically coupled to the recess (10); and a dry-film (8) coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess (10) that forms a reservoir for the fluid (6). The dry-film has an ejection nozzle (13).
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公开(公告)号：EP3173235B1
公开(公告)日：2019-04-03
申请号：EP16175467.6
申请日：2016-06-21
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公开(公告)号：EP3173843B1
公开(公告)日：2018-10-17
申请号：EP16175290.2
申请日：2016-06-20
CPC分类号： H04N9/3135 , B81B3/0045 , G02B7/1821 , G02B26/0858 , G02B26/101 , G02B26/105 , H04N9/3173
摘要： A MEMS device including: a fixed structure (10); a mobile structure (12), which comprises a reflecting element (90); a first deformable structure (22) and a second deformable structure (24), which are arranged between the fixed structure and the mobile structure. Each one of the first and second deformable structures comprises a respective number of main piezoelectric elements (40). The main piezoelectric elements (40', 40") of the first and second deformable structures can be electrically controlled for causing oscillations of the mobile structure about a first axis (A 1 ) and a second axis (A 2 ), respectively. The first deformable structure further comprises a respective number of secondary piezoelectric elements (42'), which can be electrically controlled so as to vary a first resonance frequency of the mobile structure about the first axis.
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6.发明公开
公开(公告)号：EP3326964A1
公开(公告)日：2018-05-30
申请号：EP17172106.1
申请日：2017-05-20
发明人： DUQI, Enri , BALDO, Lorenzo , GIUSTI, Domenico
IPC分类号： B81C1/00
CPC分类号： B81C1/00238 , B81B7/0051 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81C2201/0133 , B81C2203/032 , B81C2203/035 , B81C2203/0792
摘要： Described herein is an integrated device (1), having: a first die (2); a second die (6) coupled in a stacked way on the first die (2) along a vertical axis (z); a coupling region (16) arranged between facing surfaces (2a, 6a) of the first die (2) and of the second die (6), which face one another along the vertical axis (z) and lie in a horizontal plane (xy) orthogonal to the vertical axis (z), for mechanical coupling of the first and second dies; electrical-contact elements (17) carried by the facing surfaces (2a, 6a) of the first and second dies, aligned in pairs along the vertical axis (z); and conductive regions (18) arranged between the pairs of electrical-contact elements (17) carried by the facing surfaces (2a, 6a) of the first and second dies, for their electrical coupling. Supporting elements (20) are arranged at the facing surface (2a; 6a) of at least one between the first and second dies and elastically support respective electrical-contact elements.
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7.发明授权
公开(公告)号：EP3178783B1
公开(公告)日：2019-01-23
申请号：EP16175301.7
申请日：2016-06-20
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公开(公告)号：EP3343653A1
公开(公告)日：2018-07-04
申请号：EP17177446.6
申请日：2017-06-22
发明人： GIUSTI, Domenico , ALESSANDRI, Anna
摘要： A MEMS actuator device (100) of a piezoelectric type formed on a substrate (28), with a base unit (22A) including a base beam element (20) having a main extension in a extension plane and a thickness in a thickness direction perpendicular to the extension plane, smaller than the main extension. A piezoelectric region (29) extends over the beam element. An anchor region (23) is rigid to the base beam element and to the substrate (28). A base constraint structure (21) is connected to one end of the base beam element (20) and is configured to allow a deformation of the base beam element in the extension plane and substantially reduce a deformation of the base beam element in the thickness direction.
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9.发明公开
公开(公告)号：EP3173843A1
公开(公告)日：2017-05-31
申请号：EP16175290.2
申请日：2016-06-20
CPC分类号： H04N9/3135 , B81B3/0045 , G02B7/1821 , G02B26/0858 , G02B26/101 , G02B26/105 , H04N9/3173
摘要： A MEMS device including: a fixed structure (10); a mobile structure (12), which comprises a reflecting element (90); a first deformable structure (22) and a second deformable structure (24), which are arranged between the fixed structure and the mobile structure. Each one of the first and second deformable structures comprises a respective number of main piezoelectric elements (40). The main piezoelectric elements (40', 40") of the first and second deformable structures can be electrically controlled for causing oscillations of the mobile structure about a first axis (A 1 ) and a second axis (A 2 ), respectively. The first deformable structure further comprises a respective number of secondary piezoelectric elements (42'), which can be electrically controlled so as to vary a first resonance frequency of the mobile structure about the first axis.
摘要翻译： 一种MEMS装置，包括：固定结构（10）; 移动结构（12），其包括反射元件（90）; 布置在固定结构和移动结构之间的第一可变形结构（22）和第二可变形结构（24）。 第一和第二可变形结构中的每一个包括相应数量的主压电元件（40）。 可以电控制第一和第二可变形结构的主要压电元件（40'，40“），以便使移动结构围绕第一轴线（A 1）和第二轴线（A 2）产生振荡，第一 可变形结构还包括相应数量的次级压电元件（42'），其可被电控制，以便改变移动结构围绕第一轴线的第一共振频率。
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公开(公告)号：EP4378883A1
公开(公告)日：2024-06-05
申请号：EP23207483.1
申请日：2023-11-02
发明人： GIUSTI, Domenico , QUAGLIA, Fabio , FERRERA, Marco , PRELINI, Carlo Luigi , SAVOIA, Alessandro Stuart
IPC分类号： B81C1/00
CPC分类号： B81C1/00238 , B81C2203/079220130101
摘要： MEMS device (1) comprising: a signal processing assembly (120); a transduction module (38; 40, 41, 56) comprising a plurality of transducer devices (56); a stiffening structure (113) at least partially surrounding each transducer device (56); one or more coupling pillars (36) for each transducer device (56), extending on the stiffening structure (113) and configured to physically and electrically couple the transduction module (38; 40, 41, 56) to the signal processing assembly (120), to carry control signals of the transducer devices (56). Each conductive coupling element (36) has a section having a shape such as to maximize the overlapping surface with the stiffening structure (113) around the respective transducer device (56). This shape includes hypocycloid with a number of cusps equal to or greater than three; triangular; quadrangular.
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