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    MICROBRIDGE STRUCTURES FOR ULTRA-HIGH FREQUENCY MEM RESONATOR
    11.
    发明公开
    MICROBRIDGE STRUCTURES FOR ULTRA-HIGH FREQUENCY MEM RESONATOR 审中-公开
    超高频率下工作的MEM谐振器微电子结构桥

    公开(公告)号：EP1430599A2

    公开(公告)日：2004-06-23

    申请号：EP02768929.8

    申请日：2002-09-27

    Applicant: INTEL CORPORATION

    Inventor： CHENG, Peng ,  MA, Qing

    IPC: H03H9/24

    CPC classification number: B81B3/0078 ,  B81B2201/016 ,  B81B2203/019 ,  H03H3/0077 ,  H03H9/2463

    Abstract: A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of the beam. The microbridge beam structure includes support sections and a beam formed between the support sections. The center region of the beam has a mass that is less than the mass of regions of the beam adjacent to the support sections.

    A method of manufacturing an electronic device and electronic device
    16.
    发明公开
    A method of manufacturing an electronic device and electronic device 审中-公开
    一种用于生产电子器件和电子器件的工艺

    公开(公告)号：EP2444368A2

    公开(公告)日：2012-04-25

    申请号：EP12151592.8

    申请日：2004-10-26

    Applicant: Epcos AG

    Inventor： Van Beek, Jozef T. M. ,  Ulenaers, Mathieu J. E.

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: H01G5/18 ,  B81B3/0078 ,  B81B2201/016 ,  B81B2201/038 ,  B81B2203/04 ,  B81B2203/053 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2239/01

    Abstract: A method of manufacturing a micro-electromechanical systems (MEMS) device, comprising providing a base layer (10) and a mechanical layer (12) on a substrate (14), providing a sacrificial layer (16) between the base layer (10) and the mechanical layer (12), providing an etch stop layer (18) between the sacrificial layer (16) and the substrate (14), and removing the sacrificial layer (16) by means of dry chemical etching, wherein the dry chemical etching is performed using a fluorine-containing plasma, and the etch stop layer (18) comprises a substantially non-conducting, fluorine chemistry inert material, such as Hf02, ZrO2, Al203 or TiO2

    Abstract translation: 一种制造微机电系统（MEMS）设备，包括：提供在衬底的基座层（10）和一个机械层（12）（14），提供所述基底层之间的牺牲层（16）的方法（10） 与机械层（12）提供在所述牺牲层（16）和基板（14），并去除由干式化学蚀刻的方式在牺牲层（16）之间的蚀刻停止层（18），所述worin干式化学蚀刻 使用含氟等离子体被执行，并且蚀刻停止层（18）包括基本上不导电，氟化学惰性材料，颜色：如的HfO 2，氧化锆，AL203或TiO

    MICROSYSTEME COMPORTANT UN PONT DEFORMABLE
    17.
    发明授权
    MICROSYSTEME COMPORTANT UN PONT DEFORMABLE 有权
    可变形桥MICROSYSTEMS

    公开(公告)号：EP1805100B1

    公开(公告)日：2011-10-05

    申请号：EP05857762.8

    申请日：2005-10-11

    Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Inventor： CHARVET, Pierre-Louis

    IPC: B81B3/00

    CPC classification number: B81B3/0086 ,  B81B2201/016 ,  H01H59/0009

    Abstract: The invention relates to a microsystem comprising a deformable bridge (1), the ends (2) of which are connected to a substrate (3). According to the invention, at least one actuation electrode (6), which is solidly connected to the bridge (1), is disposed between the centre (C) of the bridge and one of the ends (2) next to a counter electrode (7) which is solidly connected to the substrate (3). The electrodes (6) are intended to deform the deformable bridge (1) such that a lower face of the bridge (1) comes into contact with a contact element (4) formed on the substrate (3). The actuation electrode (6) comprises, transversely to the bridge (1), a central zone (8) which is disposed on the bridge (1) and at least one projecting, flexible lateral flange (9). The lateral flange (9) can be connected to the central zone (8) by means of a narrower linking zone (10) which is disposed on the side of the flange (9) closest to the centre (C) of the bridge. Moreover, each actuation electrode (6) can comprise a pair of lateral flanges (9) which are disposed respectively on either side of the corresponding central zone (8).

    MEMS DEVICE WITH CONTROLLED ELECTRODE OFF-STATE POSITION
    18.
    发明公开
    MEMS DEVICE WITH CONTROLLED ELECTRODE OFF-STATE POSITION 有权
    与铅搁受控管理MEMS器件

    公开(公告)号：EP2121510A2

    公开(公告)日：2009-11-25

    申请号：EP07859371.2

    申请日：2007-12-10

    Applicant: NXP B.V.

    Inventor： STEENEKEN, Peter G.

    IPC: B81B3/00 ,  H01H59/00

    CPC classification number: H01H59/0009 ,  B81B3/0056 ,  B81B2201/016 ,  B81C2201/017 ,  Y10T29/49105

    Abstract: The present invention relates to MEMS device that comprises a first electrode, and a second electrode suspended with a distance to the first electrode with the aid of a suspension structure. The MEMS device further comprises at least one deformation electrode. The second electrode or the suspension structure or both are plastically deformable upon application of an electrostatic deformation force via the deformation electrode. This way, variations in the off- state position of the second electrode that occur during fabrication of different devices or during operation of a single device can be eliminated.

    DISPOSITIF MICROMECANIQUE COMPORTANT UNE POUTRE MOBILE
    20.
    发明公开
    DISPOSITIF MICROMECANIQUE COMPORTANT UNE POUTRE MOBILE 有权
    与移动BAR微机械装置

    公开(公告)号：EP1846320A1

    公开(公告)日：2007-10-24

    申请号：EP06709238.7

    申请日：2006-02-02

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

    Inventor： FLEURY, Gatien ,  CHARVET, Pierre-Louis

    IPC: B81B3/00 ,  H01H50/00

    CPC classification number: B81C1/00666 ,  B81B2201/016 ,  B81C2201/0167

    Abstract: The invention relates to a micromechanical device comprising a mobile beam (1), said beam being attached by the two ends (2) thereof to a rigid frame (3) provided with two arms (4) each having two ends (5). The ends (5) of an arm (4) are respectively fixed to the two ends (2) of the mobile beam (1). Each arm (4) has a central part (6) arranged between the two ends (5) of the corresponding arm (4). A rear face of the central part (6) of each arm (4) is attached to a base support (10). The frame (3) comprises at least one stressed element (11) for adjusting the stressed state of the beam. The stressed element (11) can be centred between the front face and the rear face of the corresponding arm (4). The frame (3) can comprise pairs of front and rear stressed elements (11) which are respectively arranged on the front face and the rear face of the arms (4) in such a way that they face each other.

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