ELEKTRONISCHES GERÄT
    11.
    发明公开
    ELEKTRONISCHES GERÄT 有权
    电子设备

    公开(公告)号:EP1393532A2

    公开(公告)日:2004-03-03

    申请号:EP02729891.8

    申请日:2002-05-15

    发明人: PRANGE, Stefan

    IPC分类号: H04M1/02 H05K7/20 H05K5/02

    摘要: The invention relates to an electronic device comprising an inner housing shell, which at least partially encompasses the electronic elements and an outer housing shell, which at least partially surrounds the inner housing shell. The material that constitutes the inner housing shell and the outer housing shell is impermeable to liquid. The inner and outer housing shells are arranged and configured to form a hollow chamber, impermeable to liquid, which is at least partially filled with a liquid.

    SENSOR ABNORMALITY DETERMINING APPARATUS

    公开(公告)号:EP3041126B1

    公开(公告)日:2018-09-19

    申请号:EP14839086.7

    申请日:2014-07-31

    发明人: MORINAGA, Hatsuki

    IPC分类号: H05K7/20 G01K15/00 G01K17/08

    摘要: To provide a sensor abnormality determining apparatus that detects an abnormality of a temperature sensor for detecting a power element temperature, even when the difference between the power element temperature and the temperature of the cooling water for cooling the power element is low. This sensor abnormality determining apparatus is applied to an inverter (3) that is provided with: a power element (3a); a cooling water circulation path (42) having cooling water (41) for cooling the power element (3a) circulating therein; a temperature sensor (51) that detects a temperature of the power element (3a); and a water temperature sensor (52) that detects a temperature of the cooling water (41) circulating in the cooling water circulation path (42). The sensor abnormality determining apparatus is configured such that the apparatus is provided with: an abnormality determining section (5a), which determines that the temperature sensor (51) is abnormal when a temperature difference (AT) between the temperature detected by means of the temperature sensor (51) and the water temperature detected by means of the water temperature sensor (52) is larger than a previously set determination temperature difference; and a determination temperature setting section (5b) whereby the determination temperature difference for the time when the temperature detected by means of the temperature sensor (51 ) is lower than the water temperature detected by means of the water temperature sensor (52) is set at a lower value than the determination temperature difference for the time when the temperature detected by means of the temperature sensor (51) is higher than the water temperature detected by means of the water temperature sensor (52).

    ROHRLEITUNGSDURCHFÜHRUNG IN EINEM SCHRANK FÜR ELEKTRONISCHE KOMPONENTEN
    16.
    发明公开
    ROHRLEITUNGSDURCHFÜHRUNG IN EINEM SCHRANK FÜR ELEKTRONISCHE KOMPONENTEN 审中-公开
    管道过程中的一个柜子电子元器件

    公开(公告)号:EP3131378A1

    公开(公告)日:2017-02-15

    申请号:EP16184137.4

    申请日:2016-08-15

    IPC分类号: H05K7/20 G06F1/20

    摘要: Vorrichtung (1) mit einem Gehäuse (10), einer oder mehreren darin aufgenommenen elektronischen Komponenten (20) und einer Kühlung (30), die eine Zuleitung (31) zum Einbringen eines Kältemittels in das Gehäuse (10) und eine Ableitung (32) zum Abführen des Kältemittels aus dem Gehäuse (10) aufweist, dadurch gekennzeichnet, dass die Zuleitung (31) an einer Leitungsdurchführung (11) in das Gehäuse (10) eintritt, die Ableitung (32) an der Leitungsdurchführung (11) aus dem Gehäuse (10) austritt und im Bereich der Leitungsdurchführung (11) die Zuleitung (31) in der Ableitung (32) oder die Ableitung (32) in der Zuleitung (31) vorgesehen ist.

    摘要翻译: 设备(1),包括用于将制冷剂引导到壳体(10)和出口的壳体(10),一个或多个容纳在其中的电子元件(20)和一个冷却(30)的供给管路(31),(32) 出壳体用于排出制冷剂(10)的,其特征在于,在壳体中的进料管线(31)的电缆套管(11)(10)发生时,在从所述壳体的电缆套管(11)的排出管线(32)( 10)排出,并(在电缆套管11)的区域中,设置在排出管路(32)或在所述电源线(31)中的导数(32)的进料管线(31)。

    Cooling fluid flow passage matrix for electronics cooling
    20.
    发明公开
    Cooling fluid flow passage matrix for electronics cooling 审中-公开
    用于电子冷却的冷却流体流动通道矩阵

    公开(公告)号:EP2830088A2

    公开(公告)日:2015-01-28

    申请号:EP14177118.8

    申请日:2014-07-15

    IPC分类号: H01L23/473

    摘要: A cooling supply package for an electronic component 22 has a supply port 17 communicating with a plurality of outer supply channels, and a return port 19 communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer 34 supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.

    摘要翻译: 用于电子元件22的冷却供应包装具有与多个外部供应通道连通的供应口17和与多个外部返回通道连通的返回口19。 外部供应通道和外部返回通道分别与槽层中不同的开口连通,并分别与返回槽和供应槽连通。 节流层34从供给槽向电子部件供给流体,并在冷却了电子部件之后将回流流体接收到返回槽中。 还公开了冷却供应和电子组合。