摘要:
The invention relates to an electronic device comprising an inner housing shell, which at least partially encompasses the electronic elements and an outer housing shell, which at least partially surrounds the inner housing shell. The material that constitutes the inner housing shell and the outer housing shell is impermeable to liquid. The inner and outer housing shells are arranged and configured to form a hollow chamber, impermeable to liquid, which is at least partially filled with a liquid.
摘要:
To provide a sensor abnormality determining apparatus that detects an abnormality of a temperature sensor for detecting a power element temperature, even when the difference between the power element temperature and the temperature of the cooling water for cooling the power element is low. This sensor abnormality determining apparatus is applied to an inverter (3) that is provided with: a power element (3a); a cooling water circulation path (42) having cooling water (41) for cooling the power element (3a) circulating therein; a temperature sensor (51) that detects a temperature of the power element (3a); and a water temperature sensor (52) that detects a temperature of the cooling water (41) circulating in the cooling water circulation path (42). The sensor abnormality determining apparatus is configured such that the apparatus is provided with: an abnormality determining section (5a), which determines that the temperature sensor (51) is abnormal when a temperature difference (AT) between the temperature detected by means of the temperature sensor (51) and the water temperature detected by means of the water temperature sensor (52) is larger than a previously set determination temperature difference; and a determination temperature setting section (5b) whereby the determination temperature difference for the time when the temperature detected by means of the temperature sensor (51 ) is lower than the water temperature detected by means of the water temperature sensor (52) is set at a lower value than the determination temperature difference for the time when the temperature detected by means of the temperature sensor (51) is higher than the water temperature detected by means of the water temperature sensor (52).
摘要:
Vorrichtung (1) mit einem Gehäuse (10), einer oder mehreren darin aufgenommenen elektronischen Komponenten (20) und einer Kühlung (30), die eine Zuleitung (31) zum Einbringen eines Kältemittels in das Gehäuse (10) und eine Ableitung (32) zum Abführen des Kältemittels aus dem Gehäuse (10) aufweist, dadurch gekennzeichnet, dass die Zuleitung (31) an einer Leitungsdurchführung (11) in das Gehäuse (10) eintritt, die Ableitung (32) an der Leitungsdurchführung (11) aus dem Gehäuse (10) austritt und im Bereich der Leitungsdurchführung (11) die Zuleitung (31) in der Ableitung (32) oder die Ableitung (32) in der Zuleitung (31) vorgesehen ist.
摘要:
Cooling apparatus cooling for an electrical or electronic device, comprising an at least partially hollow body containing a refrigerant and having a plurality of electrically conductive sections Each electrically conductive section has a respective coupling portion suitable to be operatively associated with a corresponding electrically conductive part of the electrical or electronic device, wherein the at least partially hollow body further comprises one or more electrically insulating sections. Each electrically insulating section is positioned between and electrically insulates from each other two adjacent electrically conductive sections.
摘要:
The invention relates to a power conversion apparatus, comprising: a power semiconductor module 300 that has a power semiconductor element to convert a direct current into an alternating current; a flow channel formation body 12 that forms a flow channel through which a cooling medium flows, wherein the power semiconductor module 300 has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion with the power semiconductor element therebetween, the flow channel formation body 12 has a top surface that faces the first heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween and a bottom surface that faces the second heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween, at the opposite side of the top surface with the power semiconductor module 300 therebetween, the flow channel formation body 12 is manufactured by a manufacturing method to cast a predetermined material in a mold, a surface of the side is a tapered surface 914 to facilitate separations with the mold, and surfaces of the top surface and the bottom surface having respectively an regular clearance 916 with respect to the first heat dissipation portion and the second heat dissipation portion.
摘要:
A cooling supply package for an electronic component 22 has a supply port 17 communicating with a plurality of outer supply channels, and a return port 19 communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer 34 supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.