摘要:
Position-sensitive radiation detector provided with a semiconductor structure comprising a wafer of semiconductor material of a first conductivity type having two principal-surfaces situated at relatively short distances from each other, the dimensions of which are sufficient to enclose the desired radiation detection surface. An electrode structure is formed on the wafer surfaces such that when suitable voltages are applied to said electrodes two drift fields are generated in the depleted body of the wafer. Detector/amplifier circuits are connected to selected electrodes of the electrode structure to emit, during operation, a start signal at the instant at which charge carriers are generted in the depleted part of the structure as a consequence of incident radiation or elementary particles, and a to emit a stop signal at the instant when charge carriers reach a detection electrode of the structure after propagation through both drift fields.
摘要:
The present embodiment relates to a radiation detector having a structure enabling suppression of polarization in a thallium bromide crystalline body and suppression of corrosion of an electrode in the air. The radiation detector comprises a first electrode, a second electrode, and a thallium bromide crystalline body provided between the first and second electrodes. At least one of the first electrode and the second electrode includes an alloy layer 12. The alloy layer is comprised of an alloy of metallic thallium and another metal different from the metallic thallium.
摘要:
A radiation detector of this invention includes a Cl-doped CdTe or Cl-doped CdZnTe polycrystalline semiconductor film in which defect levels in crystal grains are protected. This is obtained by grinding CdTe or CdZnTe crystal doped with Cl, and preparing the polycrystalline semiconductor film again by using its powder as the source. The defect levels of crystal grain boundaries in the polycrystalline semiconductor film are also protected by further doping the polycrystalline semiconductor film prepared again with Cl. These features enable manufacture of the radiation detector which has excellent sensitivity and response to radiation.
摘要:
A Schottky barrier type radiation detecting element having a compound InxCdyTez comprising indium and cadmium, as means for applying a voltage to a compound semiconductor crystal principally comprising cadmium and tellurium, on one side of the compound semiconductor crystal. Percentage z of tellurium content in the compound InxCdyTez is preferably in the range of 42.9%-50% expressed in terms of the ratio of the number of atoms and percentage y of cadmium content in the compound InxCdyTez is preferably in the range of 0%-10% expressed in terms of the ratio of the number of atoms.
摘要:
The invention relates to a strip detector and a process for producing a strip detector for detecting ionising particles and/or radiation. Said strip detector has a silicon substrate which provides mutually spaced n-doped regions and therebetween a p-doped insulation region at least on a substrate surface in the form of strips and voltage supply regions, and a first insulation layer applied to a substrate surface, and metal strips arranged above the n-doped regions. The invention is characterised in that directly above the first insulation layer at least one other insulation layer is provided, and that at least one of the insulation layers is interrupted, in projection over the region, between two adjacent n-doped regions, and the p-doped insulation region has a lateral p-doping agent concentration distribution which provides in the region below the interruption of the interrupted insulation layer a higher doping agent concentration than in the insulation regions directly adjoining the n-doped regions.
摘要:
A particle detector formed in a chip of semiconductor material comprises:
a first layer (42) with a first type of conductivity (n) having a surface on the first major surface of the chip, a second layer (40) with the first type of conductivity (n) having a surface on the second major surface of the chip, a third layer (41) with the first type of conductivity (n) having a resistivity lower than those of the first and second layers and disposed between the first layer (42) and the second layer (40), a first region (46) with a second type of conductivity (p), extending from the first surface into the first layer (42), a second region (45) with the second type of conductivity (p), extending from the second major surface into the second layer (40), and first (48), second (50,51) and third (43,47) electrical connection means for connection with the first region (46) with the second region (45), and with the third layer (41), respectively.
To produce a position detector which does not require a large number of connections, the second electrical connection means comprise two electrodes (50,51) arranged a predetermined distance apart on the surface of the second region (45).