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124 条记录 (耗时 0.016 秒)

    Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
    11.
    发明公开
    Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell 有权
    适用于制造薄膜太阳能电池的铜 - 锌 - 锡的沉积金属电镀组合物和方法

    公开(公告)号：EP2336394A3

    公开(公告)日：2011-11-30

    申请号：EP11160198.5

    申请日：2007-05-15

    申请人： ATOTECH Deutschland GmbH

    发明人： Kühnlein, Holger ,  Voß, Torsten ,  Schulze, Jörg

    IPC分类号： C25D3/58 ,  C25D5/10 ,  C25D5/48 ,  C23C18/48 ,  H01L31/032 ,  H01L31/06 ,  H01L21/288 ,  C23C18/40

    CPC分类号： H01L31/0322 ,  C23C18/40 ,  C23C18/48 ,  C25D3/58 ,  C25D5/10 ,  C25D5/48 ,  H01L21/02557 ,  H01L21/0256 ,  H01L21/02568 ,  H01L21/02628 ,  H01L31/06 ,  Y02E10/541

    摘要： To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at least one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species. The metal plating composition additionally comprises at least one additive, selected from the group comprising disubstituted benzene compounds having general chemical formula I, wherein R 1 and R 2 are the same or different, are selected independently from the group comprising OH, SH, NR 3 R 4 , CO-R 5 , COOR 5 , CONR 3 R 4 , COSR 5 , SO 2 OR 5 SO 2 R 5 , SO 2 NR 3 R 4 and the salts thereof or have the aforementioned meanings and form a common condensation chain; with R 3 and R 4 being the same or different, being selected independently from the group comprising H and alkyl; and with R 5 being selected from the group comprising H, alkyl and hydroxyalkyl. Such alloys comprising at least one of sulfur and selenium may be used as an absorber in a thin film solar cell, which comprises a substrate (a) being coated with a back contact (b), the absorber layer (c), a buffer layer (d), a TCO / window layer (e) and a front grid (f).

    摘要翻译： 为了能够形成任选包含至少一种硫属元素化物并由此形成半导体而不使用有毒物质的铜 - 锌 - 锡合金，公开了用于沉积铜 - 锌 - 锡合金的金属镀覆组合物，其中所述 金属电镀组合物包含至少一种铜电镀物质，至少一种锌电镀物质，至少一种锡电镀物质和至少一种络合剂，并且如果合金含有至少一种硫族元素，则还包含至少一种硫族元素电镀物质。 金属电镀组合物还包含至少一种添加剂，选自包括具有I，其中R1和R2是相同或不同，独立地选自OH，SH选择化学通式二取代的苯化合物，NR3R4，CO- R5，COOR 5，CONR 3 R 4，COSR5，SO2OR5 SO2R5，SO2NR3R4以及它们的盐或具有上述含义和形成公共缩合链; 其中R 3和R 4相同或不同，独立地选自H和烷基; 并且R5选自H，烷基和羟烷基。 这种包含硫和硒中的至少一种的合金可以用作薄膜太阳能电池中的吸收体，该薄膜太阳能电池包括涂覆有背接触件（b）的衬底（a），吸收层（c），缓冲层 （d），TCO /窗口层（e）和前栅格（f）。

    SOLDER-PRECOATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    19.
    发明公开
    SOLDER-PRECOATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 失效
    焊料预制线路板及其制造方法

    公开(公告)号：EP0644713A1

    公开(公告)日：1995-03-22

    申请号：EP93910425.3

    申请日：1993-06-01

    申请人： IBIDEN CO., LTD.

    发明人： TAKAHASHI, Shinji ,  TUCHIYA, Toshihisa

    IPC分类号： H05K3/24 ,  H05K3/34 ,  C23C18/48 ,  C23C18/52

    CPC分类号： H05K3/244 ,  H05K3/3452 ,  H05K3/3473 ,  H05K2201/0338 ,  H05K2203/043 ,  H05K2203/0571 ,  H05K2203/072 ,  H05K2203/073 ,  Y10S428/901 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/24917

    摘要： A solder-precoated wiring board on which devices and component can be mounted at fine pitches and which can be manufactured with a high productivity. A solder layer on a conductor for connection of electronic components on the wiring board comprises an Sn thin film layer formed by, for example, Cu-Sn substitution reaction on the basis of forming a Cu-complex of thiourea, and a Pb-coated Sn layer made by forming an Sn film, forming Sn crystalline particles film by Sn disproportionating reaction based on selective deposition on the Sn film, and substituting Pb for at least part of the Sn crystalline particles by Sn-Pb substituting reaction on the basis of the ionization tendency. It is desirable to melt this solder layer, and then, cool it to form an alloyed layer.

    摘要翻译： 一种焊料预涂布线板，可以以很小的间距安装器件和元件，并且可以高生产率制造。 用于连接布线板上的电子部件的导体上的焊料层包括通过例如基于形成硫脲的Cu络合物的Cu-Sn取代反应形成的Sn薄膜层，以及Pb涂布的Sn 通过形成Sn膜，通过基于在Sn膜上的选择性沉积的Sn歧化反应形成Sn结晶粒子膜，并且基于电离的Sn-Pb取代反应用Pb替代至少部分Sn结晶粒子 趋势。 理想的是熔化该焊料层，然后将其冷却以形成合金层。