公开(公告)号：EP2537067A2

公开(公告)日：2012-12-26

申请号：EP11707361.9

申请日：2011-02-14

申请人： Süss Microtec Lithography GmbH

发明人： HANSEN, Sven ,  CONRADI, Matthias ,  FINK, Georg

IPC分类号： G03F7/00

CPC分类号： G03F7/0002 ,  B29C43/58 ,  B29C2043/025 ,  B29C2043/5858 ,  B82Y10/00 ,  B82Y40/00

摘要： The invention relates a method and device for expanding the travel of linear actuators that is available during an embossing stroke. The wedge error compensating head (2) comprises a movable part (4), a stationary part (3) and at least three linear actuators (8). Each linear actuator (8) is connected to one of the two parts (3, 4) at one end and to the other of the two parts (4, 3) by wedges (9) at the other end. By means of the wedges (9), it is possible to roughly compensate for wedge errors and possible tolerances of individual subcomponents of the system. The linear actuators (8) are only used for precision compensation for the wedge error. In this way, sufficient travel is available for the embossing stroke with the linear actuators.

公开(公告)号：EP2517237A2

公开(公告)日：2012-10-31

申请号：EP10840099.5

申请日：2010-12-22

申请人： Süss Microtec Lithography GmbH

发明人： HERMANOWSKI, James

IPC分类号： H01L21/683 ,  H01L21/304

CPC分类号： H01L21/67745 ,  H01L21/67132 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2924/30105 ,  Y10T156/1132 ,  Y10T156/15 ,  Y10T156/1944

摘要： An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

摘要翻译： 一种改进的用于剥离临时结合晶片的设备包括剥离器，清洁模块和贴带模块。 在去胶机中使用真空吸盘以保持脱粘的减薄晶片，并在清洁和安装到切割带上的后续处理步骤期间保留减薄的脱粘晶片。 在一个实施例中，脱粘的变薄晶片保持在真空吸盘上，并随真空吸盘一起移动到清洁模块中，然后移动贴带模块。 在另一个实施例中，剥离的变薄晶片保留在真空吸盘上，并且首先清洁模块在变薄晶片上移动以清洁晶片，然后贴带模块在变薄晶片上移动以将切割带安装到晶片上。

公开(公告)号：EP2150856B1

公开(公告)日：2012-08-01

申请号：EP08759892.6

申请日：2008-05-21

申请人： Süss MicroTec Lithography GmbH

发明人： KAISER, Paul

IPC分类号： G03F7/20

CPC分类号： G03F7/70791 ,  G03F7/70083 ,  G03F7/70091 ,  G03F7/70141 ,  G03F7/70391

摘要： The invention relates to an illumination unit (1) for a mask aligner. The illumination unit (1) comprises a light source (2), which may sequentially generate reasonable light distribution in the illumination plane (13) for nearly any mask aligner by means of a multi-axial positioning table. The illumination profile can be recorded and reproduced in a long-term and stable manner. The invention further relates to a mask aligner having such illumination units, and a method for illumination.

公开(公告)号：EP2351076A2

公开(公告)日：2011-08-03

申请号：EP09826887.3

申请日：2009-11-16

申请人： Süss MicroTec Lithography GmbH

发明人： GEORGE, Gregory

IPC分类号： H01L23/12 ,  H01L21/20 ,  B81B7/00

CPC分类号： H01L21/67092 ,  H01L21/187 ,  Y10T29/49131

摘要： An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.

公开(公告)号：EP2253997A3

公开(公告)日：2010-12-08

申请号：EP09169158.4

申请日：2009-09-01

申请人： Süss MicroTec Lithography GmbH

发明人： Völkel, Reinhard ,  Vogler, Uwe ,  Bich, Andreas ,  Weible, Kenneth J. ,  Eisner, Martin ,  Hornung, Michael ,  Kaiser, Paul ,  Zoberbier, Ralph ,  Cullmann, Elmar

IPC分类号： G03F7/20

CPC分类号： G03F7/7035 ,  G03F7/7005 ,  G03F7/70075 ,  G03F7/70566

摘要： An illumination system for a micro-lithographic contact and proximity exposure apparatus comprising a light source (1), a collector (2), two optical integrators (3,6), two Fourier lenses (4,7), at least one angle defining element (5); and at least one field lens (8). The first optical integrator (3) comprises optical sub-elements and produces a plurality of secondary light sources (6a) each emitting a light bundle. A first Fourier lens (7) effects a superposition of the light bundles and uniform irradiance in its Fourier plane (4a). The second optical integrator (6) is located at the Fourier plane (7a) of the first Fourier lnes (7), comprises optical sub-elements and produces a plurality of tertiary light sources (6a) each emitting a light bundle. A second Fourier lens (7) effects a superposition of the light bundles, uniform irradiance and a desired and uniform angular distribution of light illuminating a mask (9) for contact or proximity lithographic printing. The field lens (8) in the Fourier plane (7a) ensures telecentric illumination the mask (9). The optional field lens (12) in the Fourier plane (4a) of the first optical integrator (3) ensures telecentric illumination of the second optical integrator (6). The angle defining element (5) comprises optical sub-elements and defines the angular distribution of the light illuminating the mask (9). A change of the position of the second Fourier lens (7) or the use of a Fourier zoom lens (62) or hybrid Fourier lens (63) allows run-out control (registration error correction) of the lateral dimensions of the printed miniature pattern in the resist layer on the surface of the wafer (10).

公开(公告)号：EP1308788A3

公开(公告)日：2004-04-28

申请号：EP02023773.1

申请日：2002-10-25

申请人： Süss MicroTec Lithography GmbH

发明人： Maier, Nikolaus ,  Süss, Ralf, Dr. Ing. ,  Buttinger, Richard

IPC分类号： G03F9/00 ,  G03F7/20

CPC分类号： G03F7/707 ,  G03F7/70733 ,  G03F7/70741

摘要： Es wird eine Vorrichtung (1) zum Ausrichten von Masken in der Fotolithographie zur Verfügung gestellt, wobei in einem ersten Maskenhalter (2a) für eine erste Maske mindestens ein Adapter (2b) für eine zweite Maske (3b) anordenbar ist, so dass entweder an den ersten Maskenhalter oder an den mindestens einen Adapter angepasste Masken in der Vorrichtung verwendbar sind. Die Vorteile der Erfindung liegen in einem einfachen zeitsparenden und kostengünstigen Übergang von einer Maskengröße auf mindestens eine andere Maskengröße.

摘要翻译： 装置（1）具有支撑在框架（4）上并具有至少一个可更换适配器（2b）的面罩支架（2a）。 导轨（5）安装在框架上以支撑其他面罩（3b）。

公开(公告)号：EP1308788A2

公开(公告)日：2003-05-07

申请号：EP02023773.1

申请日：2002-10-25

申请人： Süss MicroTec Lithography GmbH

发明人： Maier, Nikolaus ,  Süss, Ralf, Dr. Ing. ,  Buttinger, Richard

IPC分类号： G03F9/00

CPC分类号： G03F7/707 ,  G03F7/70733 ,  G03F7/70741

摘要： Es wird eine Vorrichtung (1) zum Ausrichten von Masken in der Fotolithographie zur Verfügung gestellt, wobei in einem ersten Maskenhalter (2a) für eine erste Maske mindestens ein Adapter (2b) für eine zweite Maske (3b) anordenbar ist, so dass entweder an den ersten Maskenhalter oder an den mindestens einen Adapter angepasste Masken in der Vorrichtung verwendbar sind. Die Vorteile der Erfindung liegen in einem einfachen zeitsparenden und kostengünstigen Übergang von einer Maskengröße auf mindestens eine andere Maskengröße.

摘要翻译： 它是提供一种用于在光刻掩模的对准，其中在第一屏蔽支架（2a）中用于在第一掩模的至少一个适配器（图2b），用于第二掩模（3b）的可被布置成使得一个装置（1）任一 第一掩模保持器或将所述装置中的至少一个适配器定制掩模有用。 本发明在于对至少一个其它掩模尺寸的简单省时和经济有效的过渡从掩模尺寸的优点。