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公开(公告)号：EP1651018A4
公开(公告)日：2009-11-11
申请号：EP04735653
申请日：2004-06-01
申请人： OHMI TADAHIRO , ZEON CORP
CPC分类号： H05K3/107 , H05K3/0023 , H05K3/143 , H05K2201/0108
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公开(公告)号：EP1731931A4
公开(公告)日：2009-09-16
申请号：EP05727995
申请日：2005-03-31
申请人： OHMI TADAHIRO , ZEON CORP
发明人： OHMI TADAHIRO , TANAHASHI NAOKI , HAYASHI MASAHIKO
摘要： An optical member utilizing diffraction, which comprises a substrate having a fine structure comprising microstructures with an interval of 50-1,000 nm between the adjacent microstructures on a substrate surface, wherein the substrate has a surface layer portion comprising a region containing fluorine atoms in an amount larger than that in the inner layer portion thereof. The microstructures are preferably micro-protrusions each tapering toward the tip in the direction perpendicular to the substrate surface. The optical member is manufactured by a method comprising a step of exposing the surface of the substrate having a fine structure comprising microstructures with an interval of 50-1, 000 nm between the adjacent microstructures to an atmosphere containing a fluorine gas.
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公开(公告)号：EP1707858A4
公开(公告)日：2008-10-08
申请号：EP05703504
申请日：2005-01-13
申请人： FUJIKIN KK , OHMI TADAHIRO
发明人： OHMI TADAHIRO , MINAMI YUKIO , TUBOTA KENJI , SHINOHARA TSUTOMU , YAMAJI MICHIO , IKEDA NOBUKAZU , MORIMOTO AKIHIRO , KAWADA KOJI , NARIAI TOSHIRO
CPC分类号： F16K51/02 , Y10T137/6606 , Y10T137/7043 , Y10T137/7062
摘要： A vacuum heat insulation valve that can be used in high-temperature conditions in a gas supply system and gas discharge system and that can be drastically reduced in size and made compact because of excellent heat insulating performance of the valve. A vacuum heat insulation valve constructed from a valve that has a valve body and an actuator and from a vacuum insulation box that receives the valve. The vacuum heat insulation box (S) is constructed from a rectangular lower vacuum jacket (S5) that has on its side face a tubular vacuum insulation piping receiving section (J) and whose upper face is opened, and from a rectangular upper vacuum jacket (S4) that is air-tightly fitted to the lower vacuum jacket (S5) from the above and whose lower face is opened.
摘要翻译： 一种真空绝热阀，可用于供气系统和排气系统的高温条件下，由于阀门具有优异的绝热性能，可大幅度减小尺寸并制成紧凑的结构。 由阀门构成的真空隔热阀，该阀门具有阀体和致动器，以及来自容纳阀门的真空绝热箱。 真空隔热箱（S）由矩形的下部真空夹套（S5）构成，其侧面具有管状真空隔热管接收部分（J）并且其上表面开口，并且从矩形上部真空夹套 S4）从上方气密地装配到下部真空夹套（S5）并且其下表面打开。
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24.发明公开DEVICE FOR CONTROLLING CHAMBER INNER PRESSURE AND INNER PRESSURE CONTROLLED-TYPE CHAMBER 审中-公开一种用于控制腔内部压力和室内压控制型
公开(公告)号：EP1672457A4
公开(公告)日：2008-02-13
申请号：EP04817112
申请日：2004-09-14
申请人： FUJIKIN KK , OHMI TADAHIRO
发明人： OHMI TADAHIRO , TERAMOTO AKINOBU , UNO TOMIO , DOHI RYOUSUKE , NISHINO KOUJI , NAKAMURA OSAMU , MATSUMOTO ATSUSHI , NAGASE MASAAKI , IKEDA NOBUKAZU
CPC分类号： G05D16/208 , Y10T137/7761 , Y10T137/8741 , Y10T137/87507
摘要： Flow rate control accuracy is prevented from being reduced in a low flow rate region to enable highly accurate flow rate control over the entire flow rate control region. By this, a chamber inner pressure is highly accurately controlled over a wide range by regulating the flow rate of a gas fed to a chamber. A gas feeding device for feeding a gas to a chamber, where the device is constituted of parallelly connected pressure-type flow rate control devices and a control device for controlling the flow rate control devices and feeds a desired gas, while controlling the flow rate, to a chamber deaerated by a vacuum pump. The gas feeding device is constructed such that one of the pressure-type flow control devices controls a gas flow rate range of up to 10% maximum of the maximum flow rate fed to the chamber and the remaining flow control devices control the remaining range. Further, a pressure detector is installed on a chamber and a detected value from the detector is inputted in the control device. Control signals to the pressure-type flow rate control devices are regulated to control the amount of the gas fed to the chamber, controlling a chamber inner pressure.
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公开(公告)号：EP1065709A4
公开(公告)日：2007-10-31
申请号：EP99949372
申请日：1999-10-22
发明人： OHMI TADAHIRO , HIRAYAMA MASAKI , NITTA TAKAHISA
IPC分类号： H01L21/302 , H01L21/00 , H01L21/205 , H01L21/3065
CPC分类号： H01L21/67213 , H01L21/67167 , H01L21/6719
摘要： A semiconductor manufacturing apparatus which can process the surface of a wafer uniformly and requires a small installation floor area and has an excellent maintainability. The apparatus comprises a vacuum enclosure including at least one wafer mounting stage on its bottom plate, and a cylinder surrounding the wafer mounting stage, and at least one cylinder lifting mechanism disposed for each cylinder for moving the cylinder vertically to vary the clearance between the cylinder and the top plate or bottom plate of the vacuum enclosure and for separating the space outside the cylinder constituting a transfer chamber for transferring the wafer from the space inside the cylinder constituting a process chamber for processing the surface of the wafer, wherein the transfer chamber includes a wafer transfer mechanism for transferring the wafer between the process chamber and the transfer chamber through the clearance, the process chamber has a process chamber gas feed port and a process chamber gas exhaust port, and said transfer chamber has a transfer chamber gas feed port and a transfer chamber gas exhaust port.
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26.发明公开DIFFERENTIAL PRESSURE TYPE FLOWMETER AND DIFFERENTIAL PRESSURE TYPE FLOWMETER CONTROLLER 审中-公开差压式和流量计控制差压式流量计
公开(公告)号：EP1643218A4
公开(公告)日：2007-05-09
申请号：EP04746098
申请日：2004-06-18
申请人： FUJIKIN KK , OHMI TADAHIRO
发明人： OHMI TADAHIRO , SUGIYAMA KAZUHIKO , UNO TOMIO , IKEDA NOBUKAZU , NISHINO KOUJI , NAKAMURA OSAMU , DOHI RYOUSUKE , MATSUMOTO ATSUSHI
CPC分类号： G01F1/50 , G01F1/42 , G05D7/0635
摘要： A differential pressure type flow meter in which production cost is lowered by simplifying the structure and high-accuracy measurement of flow rate can be carried out in real time under inline state with an error E not higher than (1%SP) over a wide flow rate range of 100%-1%. The differential pressure type flow meter comprises an orifice, a detector of pressure P1 on the upstream side of the orifice, a detector of pressure P2 on the downstream side of the orifice, a detector of fluid temperature T on the upstream side of the orifice, and a control operation circuit for operating the flow rate Q of fluid passing through the orifice using detected pressures P1 and P2 and detected temperature T from respective detectors, wherein the flow rate Q of fluid is operated according to the following expression; Q=C1.P1/√T.((P2/P1) -(P2/P1) ) (where, C1 is a proportional constant, m and n are constants).
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公开(公告)号：EP1300875A4
公开(公告)日：2006-12-20
申请号：EP02707228
申请日：2002-03-28
申请人： OHMI TADAHIRO , TOKYO ELECTRON LTD
发明人： OHMI TADAHIRO , HIRAYAMA MASAKI , SUGAWA SHIGETOSHI , GOTO T , HONGOH TOSHIAKI
IPC分类号： H01J37/32 , H05H1/46 , C23C16/50 , C23C16/511 , C23F4/00 , C30B25/10 , H01L21/302 , H01L21/3065 , H01L21/31
CPC分类号： H01J37/3222 , H01J37/32192 , H01J37/3244
摘要： A micro wave plasma processing device having a radial line slot antenna capable of suppressing an abnormal discharge to increase the exciting efficiency of micro wave plasma, wherein the tip part of a power supply line in a coaxial wave guide is separated from a slot plate forming a radiating surface at a connection part between the radial line slot antenna and the coaxial wave guide.
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公开(公告)号：EP1596107A4
公开(公告)日：2006-05-17
申请号：EP04709325
申请日：2004-02-09
申请人： FUJIKIN KK , OHMI TADAHIRO
摘要： A diaphragm valve for a vacuum evacuation system applicable to a semiconductor manufacturing system. Corrosion of members due to deposition/adhesion of products produced by thermolysis of gas, clogging due to products, and seat leakage are prevented. This diaphragm valve leads to reduction in the scale of the vacuum evacuation system facility, reduction in cost, and reduction in diameter of piping of the vacuum evacuation system for the purpose of decrease in vacuum evacuation time. Specifically, the diaphragm valve (1) comprises a body (2) having an inlet passage (6), an outlet passage (7), and a valve seat (8) provided between the passages, a diaphragm (3) which is provided to the body (2) and can be separated from the valve seat (8) and brought into contact with the same, and drive means (4) provided to the body (2) and adapted to separate the diaphragm (3) from the valve seat (8) and to bring the diaphragm (3) into contact with the same. The portion (25) of the body (2) and the portion (25) of the diaphragm (3) both coming into contact with a fluid are coated with a synthetic resin coating (5) of predetermined thickness.
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公开(公告)号：EP1487112A4
公开(公告)日：2005-12-21
申请号：EP03705222
申请日：2003-02-17
申请人： OHMI TADAHIRO
发明人： OHMI TADAHIRO , MOCHIZUKI KENJI , KOTANI KOJI
CPC分类号： G06K9/6202 , H03M7/30 , H03M7/3082 , H03M7/3084 , H04N19/94
摘要： Data compression using vector quantization is performed at a high speed by using hardware. Among a plurality of template patterns, a template pattern most similar to the input pattern is searched. For this, a template pattern calculating similarity by using feature amounts of the input pattern and the template pattern is selected. When calculating the similarity between the selected template pattern and the input pattern, the calculation is performed by a bit serial way so as to reduce the number of templates requiring matching by a pattern matching processing in the vector quantization and reduce the number of cycles required for calculation of the matching, thereby executing the data compression using the vector quantization at a high speed.
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公开(公告)号：EP1377138A4
公开(公告)日：2005-04-06
申请号：EP02707231
申请日：2002-03-28
申请人： TOKYO ELECTRON LTD , OHMI TADAHIRO
IPC分类号： H05H1/00 , B01J19/08 , C23C16/511 , C23C16/52 , H01J37/32 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/31 , H05H1/46
CPC分类号： H01J37/32266 , H01J37/32192 , H01J37/32954 , H01J37/3299
摘要： A micro wave plasma processing device, wherein micro wave is led into a process chamber through a wave guide (26) to generate plasma, the power of the reflected wave reflected by the plasma generated in the process chamber is monitored by a reflection monitor (40) and a power monitor (42), the frequency of the micro wave generated by a magnetron (24) is monitored by an incident monitor (36) and a frequency monitor (48), and a power fed to the magnetron (24) is controlled based on the monitored power and frequency of the reflected wave, whereby the density of the plasma can be controlled at a constant.
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