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21.发明公开VERFAHREN ZUM ENTFERNEN VON PERMEATEN AUS FLÄCHENGEBILDEN UND KLEBEBAND DAFÜR 审中-公开除去方法渗透织物上和磁带THEREFOR
公开(公告)号：EP2935499A1
公开(公告)日：2015-10-28
申请号：EP13799576.7
申请日：2013-12-05
申请人： Tesa SE
CPC分类号： C09J7/385 , B32B38/10 , B32B43/006 , B32B2305/30 , B32B2311/00 , B32B2319/00 , B32B2405/00 , C08K3/08 , C08K3/22 , C08K3/34 , C08K2003/2206 , C09J7/22 , C09J7/29 , C09J2203/326 , C09J2205/102 , C09J2433/00 , H01L51/5246 , H01L51/5259 , Y10T428/28 , Y10T428/2848
摘要： The invention relates to an easy-to-carry-out and effective method and a suitable device for absorbing permeates from flat structures. The method according to the invention comprises the following steps: gluing an adhesive tape containing at least one getter material onto the flat structure, storing the composite so obtained and consisting of the adhesive tape and the flat structure, and removing at least part of the adhesive tape which contains a getter material from the flat structure, the adhesive tape being designed to absorb at least partially at least one permeate from the flat structure. The invention further relates to an adhesive tape comprising at least one substrate layer having a water vapor permeation rate of 2
* d) (measured according to ASTM F-1249 at 38°C and 90% relative humidity), to an adhesive compound and to at least one getter material arranged between the substrate layer and the adhesive compound or contained in the adhesive compound and capable of absorbing at least one substance capable of permeation, characterized in that the adhesive compound is reversible. In a preferred embodiment, the getter material is selected from the group comprising calcium oxide, calcium sulfate, calcium chloride, pyrogenic silica and zeolites and mixture of two or more of the above substances.-
22.发明授权
公开(公告)号：EP2493995B1
公开(公告)日：2014-12-17
申请号：EP10766023.5
申请日：2010-10-08
申请人： Tesa SE
IPC分类号： C09J5/06
CPC分类号： C09J5/06 , B29C65/364 , B29C65/3644 , B29C65/368 , B29C65/3696 , B29C65/4855 , B29C65/5014 , B29C65/5057 , B29C65/8215 , B29C65/8246 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/72321 , B29C66/73113 , B29C66/8244 , B29C66/8322 , B29C66/92445 , B29C66/929 , B29C66/949 , B29C66/954 , B29C66/959 , B29C66/9592 , B29K2995/0008 , C09J7/28 , B29K2069/00 , B29K2067/006 , B29K2067/003 , B29K2067/00 , B29K2055/02 , B29K2033/12 , B29K2027/06 , B29K2023/12
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公开(公告)号：EP2742106A1
公开(公告)日：2014-06-18
申请号：EP12735844.8
申请日：2012-07-10
申请人： Tesa SE
CPC分类号： C09J7/38 , C08F220/18 , C08K3/04 , C08K3/08 , C08K7/06 , C09J7/10 , C09J9/02 , C09J11/04 , C09J133/08 , C09J2201/602 , C09J2201/606 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2433/00 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/29347 , H01L2224/29499 , H01L2224/83815 , H01L2224/83851 , H01L2224/83905 , H01L2924/01322 , H01L2924/12041 , H01L2924/12044 , H01L2924/181 , Y10T428/2857 , H01L2924/00012 , C08F2220/1825 , C08F2220/1858 , C08F220/06 , H01L2924/00
摘要： The invention relates to adhesive compound compositions, comprising a) a polymer-metal blend comprising at least one adhesive compound, at least one metal component, which melts within the temperature range of 50°C to 400°C, and b) at least one fibrous, electrically conductive filler material, wherein the filler material is present at least in part as an interconnected fiber network comprising the metal component.
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公开(公告)号：EP2465149B1
公开(公告)日：2014-01-22
申请号：EP10737333.4
申请日：2010-07-30
申请人： TESA SE
IPC分类号： H01L51/52 , C09J7/02 , C09J7/00 , C09J153/02
CPC分类号： C09J153/025 , H01L51/5246 , H01L2251/5338
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公开(公告)号：EP2516573A1
公开(公告)日：2012-10-31
申请号：EP10790401.3
申请日：2010-12-07
申请人： Tesa SE
CPC分类号： B29C65/368 , B29C65/3612 , B29C65/3644 , B29C65/4815 , B29C65/4825 , B29C65/4835 , B29C65/5014 , B29C65/5021 , B29C65/5057 , B29C65/76 , B29C65/8207 , B29C65/8215 , B29C66/034 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/7352 , B29C66/8122 , B29C66/8322 , B29C66/91411 , B29C66/91651 , B29C66/919 , B29C66/91921 , B29C66/91935 , B29C66/929 , B29C66/949 , C09J5/06 , C09J7/22 , C09J7/28 , C09J7/35 , C09J2201/134 , C09J2201/61 , C09J2205/302 , C09J2400/163 , Y10T428/24942 , B29K2069/00 , B29K2071/00
摘要： The invention relates to a method for gluing together and detaching again two substrate surfaces, wherein a surface element that can be glued by heat activation is used for gluing. The surface element that can be glued by heat activation comprises at least one electrically conductive sheet material and at least two layers made of different heat-activatable adhesive compounds, wherein the first heat-activatable adhesive compound layer is substantially located on the one side of the electrically conductive sheet material and the second heat-activatable adhesive compound is substantially located on the other side of the electrically conductive sheet material. The method is characterized in that the gluing is effected by exposing the surface element that can be glued by heat activation to a temperature T1, at which a simultaneous heat activation of the two heat-activatable adhesive compounds takes place. The detachment is effected by exposing the gluing site to a temperature T2, at which under predetermined conditions only one of the heat-activatable layers of the surface element that can be glued by heat activation loses the adhesive effect thereof in the adhesive bond so much that the adhesive bond is separated.
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公开(公告)号：EP2281022B1
公开(公告)日：2011-11-23
申请号：EP09783325.5
申请日：2009-09-23
申请人： TESA SE
IPC分类号： C09J133/00
CPC分类号： C09J133/06 , F28D20/02 , F28F2013/006 , F28F2275/025 , Y02E60/145
摘要： A thermally conductive adhesive mass is proposed, comprising a polymer mass and aluminum oxide particles, said adhesive mass having an especially high cohesion even without subsequent curing and also capable of being formed as a bubble-free coating without causing the adhesive mass to gel. In order to accomplish this, aluminum oxide particles comprising more than 95 wt % of alpha-aluminum oxide are used. Also described are a thermally conducting surface element manufactured from said adhesive mass as well as application possibilities thereof.
摘要翻译： 提出了一种导热粘合剂物质，其包含聚合物物质和氧化铝颗粒，所述粘合物质即使没有后续固化也具有特别高的内聚力，并且还能够形成为无气泡涂层而不会使粘合物质凝胶化。 为了实现这一点，使用包含大于95重量％的α-氧化铝的氧化铝颗粒。 还描述了由所述粘合剂块制造的导热表面元件及其应用可能性。
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公开(公告)号：EP2279537A1
公开(公告)日：2011-02-02
申请号：EP09756304.3
申请日：2009-11-18
申请人： TESA SE
IPC分类号： H01L51/52 , C03C27/00 , C09J153/00
CPC分类号： H01L51/5246 , C03C27/10 , C08L2666/02 , C09J153/00 , C09J153/005 , C09J153/02 , C09J153/025 , Y10T428/28 , Y10T428/2852
摘要： The present invention relates to a method for encapsulating an electronic arrangement against permeates, wherein a pressure-sensitive adhesive mass based on butylene block copolymers, particularly isobutylene block copolymers, is provided, and wherein the pressure-sensitive adhesive mass is applied to and/or around the areas of the electronic arrangement to be encapsulated.
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公开(公告)号：EP3212728B1
公开(公告)日：2018-10-03
申请号：EP15786882.9
申请日：2015-10-15
申请人： tesa SE
IPC分类号： C09J153/02 , C08L83/06 , C08L91/00 , C09J11/08 , C09J11/06 , H01L23/26 , H01L51/52 , C08K5/1515 , C08K5/5425 , C08K5/5435 , H01L51/00 , H01L51/56
CPC分类号： C09J153/02 , C08G77/18 , C08K5/1515 , C08K5/5425 , C08K5/5435 , C08K2201/008 , C08L83/06 , C08L91/00 , C08L2203/206 , C09J11/06 , C09J133/08 , C09J2203/318 , C09J2203/322 , C09J2205/102 , C09J2453/00 , C09J2463/00 , H01L51/004 , H01L51/0043 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L51/56
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