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    COMPOSITE MATERIALS COMPRISING A HARD CERAMIC PHASE AND A CU-NI-SN INFILTRATION ALLOY
    23.
    发明公开
    COMPOSITE MATERIALS COMPRISING A HARD CERAMIC PHASE AND A CU-NI-SN INFILTRATION ALLOY 审中-公开
    与硬陶瓷相和Cu-NI-SN-浸渗合金，复合材料

    公开(公告)号：EP2113035A1

    公开(公告)日：2009-11-04

    申请号：EP08730201.4

    申请日：2008-02-20

    Applicant: Kennametal Inc.

    Inventor： WATWE, Arunkumar S. ,  KELLEY, Harold E.

    IPC: C22C29/00 ,  C22C1/04 ,  C22C9/00

    CPC classification number: C22C9/06 ,  C22C1/1036 ,  C22C9/05 ,  C22C29/005 ,  Y10T428/12049 ,  Y10T428/12167

    Abstract: Composite materials comprising a hard ceramic phase (16) and an infiltration alloy (20) are disclosed. The hard ceramic phase (16) may comprise a carbide such as tungsten carbide and/or cast carbide. The infiltration alloy (20) is Cu-based and comprises Ni and Sn. The infiltration alloy (20) may further include Nb, and may be substantially free of Mn. The composite material may be heat treated in order to improve its mechanical properties. For example, the composition of the Cu-Ni-Sn infiltration alloy (20) may be selected such that its hardness, wear resistance, toughness and/or transverse rupture strength are improved after the composite material is solutioned and aged at elevated temperatures.

    ALUMINUM/SILICON CARBIDE COMPOSITE AND RADIATING PART COMPRISING THE SAME
    25.
    发明公开
    ALUMINUM/SILICON CARBIDE COMPOSITE AND RADIATING PART COMPRISING THE SAME 有权
    Verfahren zur Herstellung einer Grundplattefüreinem Leistungsmodul

    公开(公告)号：EP2012354A1

    公开(公告)日：2009-01-07

    申请号：EP07742205.3

    申请日：2007-04-23

    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha

    Inventor： HIROTSURU, Hideki ,  IWAMOTO, Goh ,  TSUKAMOTO, Hideo ,  HIGUMA, Satoshi ,  HASHIMOTO, Nobuyuki

    IPC: H01L23/373

    CPC classification number: H01L23/3733 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  C04B2111/00844 ,  C22C1/1036 ,  C22C29/065 ,  C22C32/0063 ,  C22C2001/1073 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12479 ,  Y10T428/24496 ,  Y10T428/24999 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B41/515 ,  C04B14/4631 ,  C04B41/4541 ,  C04B41/5144 ,  C04B35/565 ,  C04B38/00 ,  H01L2924/00

    Abstract: A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 µm in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies,
    wherein the aluminum layers each has an average thickness of from 10 to 150 µm, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 µm, and the difference between average thicknesses of the aluminum layers on the respective principal planes is at most 50 µm, and wherein the shape of the silicon carbide porous body is rectangle or a rectangle from which peripheral portions encompassing holes are removed.

    Abstract translation: 一种用于功率模块的基板，包括铝 - 碳化硅复合材料和由铝 - 金属组成的铝层作为主要组分形成在铝 - 碳化硅复合材料的主要平面上，其中铝 - 碳化硅复合材料由 在整个多孔体中形成或制造平板状的碳化硅多孔体至少具有100μm的厚度差异，并将这些多孔体堆叠在各自的夹具之间，使得在平面内的紧固扭矩 方向为1〜20Nm，将含有铝的金属作为主要成分渗入到碳化硅多孔体中，其中铝层的平均厚度为10〜150μm，最大厚度与最小值之间的差 每个主平面中铝层的厚度至多为80μm，铝的平均厚度之差 各主面上的层为50μm以下，碳化硅多孔质体的形状为矩形或长方形，除去周边部分。

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