公开(公告)号：EP3216229A1

公开(公告)日：2017-09-13

申请号：EP15794431.5

申请日：2015-11-03

Applicant: Robert Bosch GmbH

Inventor： SALMON, Jay Scott

IPC: H04R1/04 ,  H01L23/495

CPC classification number: H04R19/005 ,  B81C1/00301 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/73207 ,  H01L2224/92 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R2201/003 ,  H04R2201/029 ,  H01L2224/45099

Abstract: Systems and methods for lead frame-based chip carriers for use with MEMS transducers. One embodiment provides a method for manufacturing a MEMS microphone package. In one exemplary embodiment, the method includes flip chip bonding a first plurality of I/O pads on an application specific integrated circuit to a plurality of traces on a lead frame. The method further includes removing at least one of the plurality of traces such that at least one of the first plurality of I/O pads is electrically isolated from the lead frame. The method further includes bonding the lead frame to a lid and electrically connecting, via at least one wire bond, a MEMS microphone mounted to the lid to the application specific integrated circuit using a second plurality of I/O pads of the application specific integrated circuit. The method further includes bonding a substrate to the lead frame to form an air tight volume within the lid.

Abstract translation: 用于MEMS换能器的引线框架式芯片载体的系统和方法。 一个实施例提供了一种用于制造MEMS麦克风封装的方法。 在一个示例性实施例中，该方法包括将专用集成电路上的第一多个I / O焊盘倒装芯片接合到引线框架上的多个迹线。 该方法还包括去除多个迹线中的至少一个，使得第一多个I / O焊盘中的至少一个与引线框电隔离。 该方法进一步包括将引线框结合到盖并且使用专用集成电路的第二多个I / O焊盘将经由至少一个线键合将安装到盖的MEMS麦克风电连接到专用集成电路 。 该方法还包括将衬底结合到引线框架以在盖内形成气密体积。

公开(公告)号：EP3200478A1

公开(公告)日：2017-08-02

申请号：EP16152930.0

申请日：2016-01-27

Applicant: Sonion Nederland B.V.

Inventor： Voss, Rasmus

IPC: H04R11/02 ,  H04R1/10 ,  H04R19/00 ,  H04R19/01 ,  H04R19/04 ,  H04R25/00

CPC classification number: H04R25/604 ,  H04R1/1016 ,  H04R11/02 ,  H04R19/005 ,  H04R19/01 ,  H04R19/04 ,  H04R25/00 ,  H04R2201/003 ,  H04R2225/021 ,  H04R2225/023 ,  H04R2225/025

Abstract: The present invention relates to a receiver assembly comprising a moving armature having a first portion and a second portion, and a first diaphragm being operatively connected to the first portion of the moving armature, wherein the first portion of the moving armature is operatively connected to the first diaphragm in a manner so that an angular momentum induced by movements of the first portion of the moving armature is essentially counteracted by an angular momentum induced by movements of the first diaphragm.

Abstract translation: 本发明涉及一种接收器组件，其包括具有第一部分和第二部分的移动电枢以及可操作地连接到移动电枢的第一部分的第一膜片，其中移动电枢的第一部分可操作地连接到 第一隔膜以使得由移动电枢的第一部分的运动引起的角动量基本上被由第一隔膜的运动引起的角动量抵消。

公开(公告)号：EP2254353B1

公开(公告)日：2017-07-05

申请号：EP10159349.9

申请日：2010-04-08

Applicant: Sivantos Pte. Ltd.

Inventor： Weidner, Tom ,  Weistenhöfer, Christian ,  Albach, Thorsten ,  Sutor, Alexander ,  Lerch, Reinhard

IPC: H04R25/00 ,  H04R15/00 ,  H04R17/00 ,  H04R1/10

CPC classification number: H04R15/00 ,  H04R1/1075 ,  H04R17/00 ,  H04R25/604 ,  H04R2201/003

公开(公告)号：EP2566186B1

公开(公告)日：2017-05-10

申请号：EP12177801.3

申请日：2012-07-25

Applicant: Sony Corporation

Inventor： Ide, Kenji ,  Kito, Kazuhisa ,  Tsunoda, Naotaka

IPC: H04R1/10 ,  H04R5/04

CPC classification number: H04R1/1016 ,  H04R1/1025 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/04 ,  H04R2201/003 ,  H04R2201/107 ,  H04R2460/01

公开(公告)号：EP3140246A4

公开(公告)日：2017-04-26

申请号：EP15788858

申请日：2015-05-08

Applicant: INVENSENSE INC

Inventor： TSAI JULIUS MING-LIN ,  CAGDASER BARIS ,  LIM MARTIN ,  KHENKIN ALEKSEY S

IPC: B81C1/00 ,  B81B7/02 ,  G01L23/08

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

Abstract translation: 公开了至少一个环境传感器和至少一个MEMS声学传感器的集成包。 该软件包包含一个共享端口，可将两个传感器暴露于环境中，其中环境传感器测量环境的特性，声波传感器测量声波。 该端口将环境传感器暴露于空气流中，并将声音传感器暴露于声波中。 声学传感器的一个例子是麦克风，环境传感器的一个例子是湿度传感器。

公开(公告)号：EP3140909A1

公开(公告)日：2017-03-15

申请号：EP14723066.8

申请日：2014-05-08

Applicant: Epcos AG

Inventor： MARKER-VILLUMSEN, Niels ,  ROMBACH, Pirmin Hermann Otto

IPC: H03G3/30

CPC classification number: H03G3/301 ,  H03F1/32 ,  H03F3/183 ,  H03G3/3005 ,  H03G3/3089 ,  H04R3/00 ,  H04R2201/003

Abstract: A circuit having a first amplifier with a variable gain, a second amplifier with a variable gain configured to provide an output signal, a control unit, a memory element, and a switching member. The control unit is configured to adjust the variable gain of the first amplifier and the variable gain of the second amplifier. The memory element is configured to store a sample of the output signal. The switching member is configured to connect an output port of the circuit to either the second amplifier or to the memory element. A method of operating this circuit is also disclosed.

Abstract translation: 具有可变增益的第一放大器的电路，被配置为提供输出信号的可变增益的第二放大器，控制单元，存储元件和开关构件。 控制单元被配置为调整第一放大器的可变增益和第二放大器的可变增益。 存储器元件被配置为存储输出信号的采样。 开关构件被配置为将电路的输出端口连接到第二放大器或存储器元件。 还公开了一种操作该电路的方法。

公开(公告)号：EP3135044A1

公开(公告)日：2017-03-01

申请号：EP15719663.5

申请日：2015-04-24

Applicant: Usound GmbH

Inventor： RUSCONI CLERICI, Andrea ,  BOTTONI, Ferruccio

IPC: H04R15/02 ,  H04R19/02

CPC classification number: H04R19/02 ,  H04R3/00 ,  H04R2201/003

Abstract: The present invention relates to a loud speaker arrangement (1) with a circuit board (2), an MEMS loudspeaker (3) for producing sound waves in the audible wavelength spectrum, said MEMS loud speaker having a membrane (9) deflectable along a z-axis, a sound-conducting channel (21) adjacent to the MEMS loudspeaker (3) with an acoustic outlet opening (22) and an ASIC (4) electrically connected to the MEMS loudspeaker (3). Further, the circuit board (2) comprises a first circuit board cavity (11) in which the ASIC (4) is arranged so as to be fully integrated in the circuit board (2). Further, the circuit board (2) comprises a second circuit board cavity (13) with an opening (14), said opening being closed by means of the MEMS loudspeaker (3) so that the second circuit board cavity (13) forms at least one part of a cavity (15) of the MEMS loudspeaker (3). According to the invention, the sound-conducting channel (21) extends obliquely to the z-axis of the MEMS loudspeaker. Moreover, the acoustic outlet opening (22) is arranged on the lateral surface of the loudspeaker arrangement (1).

Abstract translation: 本发明涉及包括印刷电路板（2）的扬声器阵列（1）; MEMS扬声器（3），其用于产生可听波长范围内的声波并且具有沿着Z轴可偏转的振动膜（9）; 传声通道（21），所述传声通道邻近所述MEMS扬声器（3）并且具有声学出口开口（22）; 以及电连接到MEMS扬声器（3）的ASIC（4）。 此外，印刷电路板（2）包括第一电路板腔（11），其中ASIC（4）被设置为完全集成到印刷电路板（2）中。 此外，印刷电路板（2）包括具有通过MEMS扬声器（3）封闭的开口（14）的第二电路板腔（13），使得第二电路板腔（13）形成在 MEMS扬声器（3）的空腔（15）的至少一部分。 根据本发明，声音传导通道（21）与MEMS扬声器的Z轴成一定角度延伸。 此外，声音出口开口（22）布置在扬声器阵列（1）的侧面上。

公开(公告)号：EP2332344A4

公开(公告)日：2016-12-21

申请号：EP09815717

申请日：2009-07-17

Applicant: NOKIA TECHNOLOGIES OY

Inventor： CAI CHENGUANG ,  XU LIANGFENG ,  WANG XIA ,  NURMINEN JANI ,  SALO ANTTI ,  OZCAN KORAY

IPC: H04R1/32 ,  B06B1/06 ,  G10K11/26 ,  H04B11/00 ,  H04R1/24 ,  H04R1/40 ,  H04R3/00 ,  H04R3/12 ,  H04R17/00

CPC classification number: B06B1/0644 ,  H04R1/24 ,  H04R1/403 ,  H04R3/12 ,  H04R17/00 ,  H04R2201/003 ,  H04R2201/401 ,  H04R2203/12 ,  H04R2205/022 ,  H04R2217/03 ,  H04R2499/11

Abstract: An apparatus uses a transducer to produce vibration in the ultrasonic frequency range and in the audible frequency range. A membrane or cantilever structure is coupled to the transducer to produce acoustic waves. When the vibration is in the audible frequency range, the membrane structure works like a conventional loudspeaker. When the vibration is in the ultrasonic frequency range, the ultrasonic signal is modulated by audio signal for creating better directivity. The acoustic waves in the ultrasonic frequency range can reproduce directional audible sound due to the nonlinear interaction of ultrasonic waves in air.

公开(公告)号：EP2605545B1

公开(公告)日：2016-11-09

申请号：EP11788759.6

申请日：2011-03-18

Applicant: OMRON Corporation

Inventor： KASAI, Takashi

IPC: H04R3/00 ,  H04R31/00 ,  H04R19/04 ,  H04R19/00 ,  H04R23/00

CPC classification number: H04R23/00 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R3/005 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003 ,  H04R2410/03 ,  H01L2924/00014

公开(公告)号：EP2710815B1

公开(公告)日：2016-10-19

申请号：EP12723735.2

申请日：2012-05-18

Applicant: Warwick Audio Technologies Limited

Inventor： ATKINS, Brian ,  BILLSON, Duncan ,  HOARE, David

IPC: H04R19/02 ,  H04R7/08

CPC classification number: H04R19/02 ,  H04R7/08 ,  H04R19/04 ,  H04R23/006 ,  H04R2201/003