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    ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION
    22.
    发明授权
    ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION 有权

    公开(公告)号：EP2831955B1

    公开(公告)日：2018-08-29

    申请号：EP13770149.6

    申请日：2013-02-07

    Applicant: Deere & Company

    Inventor： DUPPONG, Jeffrey, S.

    IPC: H01R12/00 ,  H05K1/02

    CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/10303

    Abstract: An electrical assembly comprises a substrate having a dielectric layer and one or more electrically conductive traces overlying the dielectric layer. An electrical component is mounted on a first side of the substrate. The electrical component is capable of generating heat. A plurality of conductive through holes in the substrate are located around a perimeter of the electrical component. The conductive through holes are connected to a conductive trace for heat dissipation. A cooling cavity has bores that face a second side of the substrate opposite the first side. A plurality of respective compliant pins are inserted into corresponding conductive through holes and the bores, wherein a generally exposed portion of the compliant pin is exposed to air or a coolant liquid within the cooling cavity.

    Heat-transfer plate, heat-transfer plate module, and submarine apparatus
    26.
    发明公开
    Heat-transfer plate, heat-transfer plate module, and submarine apparatus 有权
    Wärmeleitplatte，Wärmeleitplattenmodulund Unterwasservorrichtung

    公开(公告)号：EP2814305A2

    公开(公告)日：2014-12-17

    申请号：EP14170755.4

    申请日：2014-06-02

    Applicant: FUJITSU LIMITED

    Inventor： Yoshizumi, Takahisa ,  Hoshiyama, Naoto

    IPC: H05K1/02

    CPC classification number: H05K1/0204 ,  G02B6/4448 ,  G02B6/506 ,  H05K1/0201 ,  H05K3/0061 ,  H05K3/284 ,  H05K7/20463 ,  H05K2201/064

    Abstract: A heat-transfer plate includes a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with a heating component so as to transfer the heat from the heating component to the heat-transfer plate, a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate, a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion, and a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels.

    Abstract translation: 传热板包括被配置为具有部分凹陷表面并且加载与加热部件接触的导热树脂以便将热量从加热部件传递到传热板的池部分 树脂量检查部，被配置为具有多个深度并且被布置在所述导热树脂在所述印刷电路板固定到所述传热板的状态下可视的位置处，所述堤部被构造成 设置在池部分和树脂量检查部分之间并且抑制导热树脂朝向树脂量检查部分的流动，以及构造成设置在池部分和树脂量检查之间的流动通道 并且用作从池部分流入树脂量检查部分的导热树脂行进的路径。

    SYSTEM FOR FAST AND ACCURATE FILLING OF A TWO-PHASE COOLING DEVICE, NOTABLY A HEAT PIPE, ADAPTED FOR USE IN AN AUTOMATED PROCESS
    27.
    发明公开
    SYSTEM FOR FAST AND ACCURATE FILLING OF A TWO-PHASE COOLING DEVICE, NOTABLY A HEAT PIPE, ADAPTED FOR USE IN AN AUTOMATED PROCESS 审中-公开
    SYSTEM FOR快速和准确的充填装置用于冷却相，尤其是加热管，这是用在CAR配合一种适合

    公开(公告)号：EP2769601A1

    公开(公告)日：2014-08-27

    申请号：EP12769685.4

    申请日：2012-10-10

    Applicant: Thales Nederland B.V.

    Inventor： WITS, Wessel Willems ,  TEN HOEVE, Harm Jan ,  TE RIELE, Gert Jan ,  VAN ES, Johannes

    IPC: H05K1/02 ,  F28D15/02 ,  H05K7/20 ,  H05K1/18

    CPC classification number: F25B45/00 ,  F25B2345/00 ,  F28D15/0283 ,  F28D15/04 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/064

    Abstract: The current invention relates to a system for fast and accurate filling of a two- phase cooling device, comprising a binding device (30) intended to be hermetically mounted onto the cooling device, the binding device (30) comprising a through-hole (32) able to be in fluid contact with the cooling device, said through-hole (32) being extending between a lower surface adapted to the cooling device's surface, and an essentially plane upper surface, the binding device (30) further comprising a gripping head essentially level with said upper surface, allowing for a filling tool (400) to be put in hermetic contact with said upper surface. In a preferred embodiment, the through-hole (32) can be hermetically sealed by forced insertion of a pin- shaped plug (33). The invention also relates to the filling tool (400) to be used in combination with the binding device (30), allowing gas removal from the cooling device, filling of a working fluid, and hermetic sealing of the cooling device. The invention also relates to the high accuracy of filling by using zero dead volume valves. The binding device (30) is notably particularly well adapted for use in an automated process.

    Abstract translation: 当前发明涉及一种用于两相冷却装置，其包括意在被气密地安装在捆扎装置（30）在冷却装置，包括结合装置（30）的快速和准确的填充的系统的贯通孔（32 ），其能够以与冷却装置流体接触，所述通孔（32）的下表面angepasst到冷却装置的表面上，并且平面本质上表面之间被扩展，该结合装置（30），还包括一个夹头 与所述上表面基本上水平，从而允许填充工具（400）被置于与所述上表面密封接触。 在优选的实施例中的通孔（32）可以被气密地通过销形插头（33）的压入密封。 因此，本发明涉及在组合使用具有允许从冷却装置气体去除，工作流体的填充，以及冷却装置的气密密封的结合装置（30）填充工具（400）。 因此，本发明通过使用零个死体积阀涉及填充的精度高。 结合装置（30）是尤其是用于上自动过程使用特别好angepasst内容。

    System for fast and accurate filling of a two-phase cooling device, notably a heat pipe, adapted for use in an automated process
    29.
    发明公开
    System for fast and accurate filling of a two-phase cooling device, notably a heat pipe, adapted for use in an automated process 审中-公开
    在自动处理用于两相冷却的装置的快速和精确的填充，特别是适于使用的热管的系统

    公开(公告)号：EP2584876A1

    公开(公告)日：2013-04-24

    申请号：EP11186242.1

    申请日：2011-10-21

    Applicant: Thales Nederland B.V.

    Inventor： Wits, Wessel Willems ,  Ten Hoeve, Harm Jan ,  Te Riele, Gert Jan ,  Van Es, Johannes

    IPC: H05K1/02 ,  F28D15/02 ,  H05K7/20

    CPC classification number: F25B45/00 ,  F25B2345/00 ,  F28D15/0283 ,  F28D15/04 ,  H05K1/0203 ,  H05K1/0272 ,  H05K2201/064

    Abstract: The current invention relates to a system for fast and accurate filling of a two-phase cooling device, comprising a binding device (30) intended to be hermetically mounted onto the cooling device, the binding device (30) comprising a through-hole (32) able to be in fluid contact with the cooling device, said through-hole (32) being extending between a lower surface adapted to the cooling device's surface, and an essentially plane upper surface, the binding device (30) further comprising a gripping head essentially level with said upper surface, allowing for a filling tool (400) to be put in hermetic contact with said upper surface. In a preferred embodiment, the through-hole (32) can be hermetically sealed by forced insertion of a pin-shaped plug (33). The invention also relates to the filling tool (400) to be used in combination with the binding device (30), allowing gas removal from the cooling device, filling of a working fluid, and hermetic sealing of the cooling device. The invention also relates to the high accuracy of filling by using zero dead volume valves. The binding device (30) is notably particularly well adapted for use in an automated process.

    Abstract translation: 当前发明涉及一种用于两相冷却装置，其包括意在被气密地安装在捆扎装置（30）在冷却装置，包括结合装置（30）的快速和准确的填充的系统的贯通孔（32 ），其能够以与冷却装置流体接触，所述通孔（32）的下表面angepasst到冷却装置的表面上，并且平面本质上表面之间被扩展，该结合装置（30），还包括一个夹头 与所述上表面基本上水平，从而允许填充工具（400）被置于与所述上表面密封接触。 在优选的实施例中的通孔（32）可以被气密地通过销形插头（33）的压入密封。 因此，本发明涉及在组合使用具有允许从冷却装置气体去除，工作流体的填充，以及冷却装置的气密密封的结合装置（30）填充工具（400）。 因此，本发明通过使用零个死体积阀涉及填充的精度高。 结合装置（30）是尤其是用于上自动过程使用特别好angepasst内容。

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