公开(公告)号：EP2958188A4

公开(公告)日：2016-11-02

申请号：EP14751763

申请日：2014-02-14

Applicant: FUJIKURA LTD

Inventor： UEMICHI YUSUKE

IPC: H01P5/107 ,  H01P11/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/02

CPC classification number: H01P11/003 ,  H01P5/107 ,  H05K1/0251 ,  H05K3/002 ,  H05K3/0029 ,  H05K2201/037 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2203/0733 ,  Y10T29/49018

Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface and has a predetermined depth, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface and is configured to transmit a high-frequency signal, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light and thereby forming a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion and thereby forming the micro hose; and filling the micro hole with a conductive material and thereby form the pin.

公开(公告)号：EP2330683A1

公开(公告)日：2011-06-08

申请号：EP09816075.7

申请日：2009-09-15

Applicant: Sony Corporation

Inventor： KAWAMURA, Hirofumi ,  OKADA, Yasuhiro

IPC: H01P5/107 ,  H01P3/16 ,  H01P5/08 ,  H04B3/52

CPC classification number: H01P5/107 ,  H01P1/047 ,  H01P5/028 ,  H04B3/52 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2201/10303 ,  Y10T29/49016

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract translation: 设置有电路基板的多元性的电子设备使用的支撑部件，用于支撑所述电路板作为一个无线信号的传输路径。 对于实施例，电子装置是用于处理毫米波信号具有一第一印刷电路板，第二印刷电路板的所有这是信号耦合到所述印刷电路板并接收毫米波信号向受试者所接收的信号，以 其被设置为与印刷电路板之间的预定的介电常数，worin波导的信号处理，和一个波导，用于所有构成介电体传输路径，并且所述波导支持印刷电路板。 这种构造使得能够接收基于从构成介电体传输路径的波导的一端辐射毫米波信号的电磁波，在其另一端。

公开(公告)号：EP2258022A4

公开(公告)日：2012-10-31

申请号：EP09722528

申请日：2009-03-17

Applicant: CHENG SHI ,  KRATZ KARL HENRIK ,  YOUSEF HANNA ALI

Inventor： CHENG SHI ,  KRATZ KARL HENRIK ,  YOUSEF HANNA ALI

IPC: H01P11/00 ,  B81C1/00 ,  H01P3/12 ,  H05K1/02 ,  H05K3/40

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/4076 ,  H05K3/42 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2203/092 ,  H05K2203/1572 ,  Y10T29/49016

公开(公告)号：EP2330683A4

公开(公告)日：2012-09-05

申请号：EP09816075

申请日：2009-09-15

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: H01P5/107 ,  H01P1/04 ,  H01P5/02 ,  H04B3/52 ,  H05K1/14

CPC classification number: H01P5/107 ,  H01P1/047 ,  H01P5/028 ,  H04B3/52 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2201/10303 ,  Y10T29/49016

公开(公告)号：EP2334156A1

公开(公告)日：2011-06-15

申请号：EP09178552.7

申请日：2009-12-09

Applicant: RESEARCH IN MOTION LIMITED

Inventor： Wong, Joshua Kwan Ho Wong ,  Man, Thomas Ying Tong ,  Qi, Yihong ,  Jarmuszewski, Perry ,  Chan, Antonio

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01P3/08

CPC classification number: H05K1/0219 ,  H01P3/085 ,  H01P3/121 ,  H05K1/0224 ,  H05K1/0393 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10356

Abstract: A flexible cable for carrying RF signals and method of manufacturing same. The cable (170) includes an elongate base substrate including a dielectric layer (176) with an upper metal layer (178) deposited on one side and a lower metal layer (174) deposited on its other side. It further includes two parallel spaced-apart series of vias (180) formed along the length of the base substrate, each via electrically interconnecting the upper metal layer and the lower metal layer, whereby a rectangular cross-sectional waveguide (190) is provided between the upper metal layer, the lower metal layer and the two series of vias.

Abstract translation: 用于承载RF信号的柔性电缆及其制造方法。 电缆（170）包括细长的基底基底，其包括在一侧沉积有上金属层（178）的介电层（176）和沉积在另一侧的下金属层（174）。 它还包括沿着基底衬底的长度形成的两个平行间隔开的​​一系列通孔（180），每个通孔将上部金属层和下部金属层电连接，从而在矩形横截面波导（190）之间提供矩形横截面波导 上金属层，下金属层和两系列通孔。

公开(公告)号：EP1433221A1

公开(公告)日：2004-06-30

申请号：EP02752720.9

申请日：2002-08-07

Applicant: INTEL CORPORATION

Inventor： BRIST, Gary ,  MEJIA, Charles ,  ALGER, William ,  LONG, Gary

IPC: H01P11/00

CPC classification number: H05K1/0237 ,  H01P11/002 ,  H05K3/0017 ,  H05K2201/037 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09981

Abstract: A method is provided for forming a waveguide in a printed circuit board, This may include forming a trench in a printed circuit substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.

公开(公告)号：EP3341654A1

公开(公告)日：2018-07-04

申请号：EP16838113.5

申请日：2016-08-26

Applicant: Thin Thermal Exchange Pte Ltd ,  Contarino, Aldo

Inventor： CONTARINO, Aldo ,  FREIBERG, Michael

IPC: F21V29/00 ,  F21V29/70 ,  F21V29/74 ,  F21V7/00 ,  F21V13/00

CPC classification number: F21V29/70 ,  F21V29/74 ,  F21V29/85 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/181 ,  H05K3/06 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/037 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10522 ,  H05K2203/0323 ,  H05K2203/082

Abstract: An evacuated core circuit board (10) for dissipating heat from a heat generating electronic component, the evacuated core circuit board comprising: at least one circuit layer (12) to which the heat generating electronic component (14) is electronically coupled; a base layer (16) a comprising a body structure (19) having a substantially hollow interior (20); and a dielectric layer (18) provided between at least a portion of the circuit layer (12) and the base layer (16), wherein the hollow interior (20) is at least partially evacuated.

公开(公告)号：EP2562470B1

公开(公告)日：2018-04-11

申请号：EP12180113.8

申请日：2012-08-10

Applicant: OSRAM GmbH ,  OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI

Inventor： Katzler, Gerald ,  Scordino, Alessandro ,  Zanon, Franco

IPC: F21S4/00 ,  F21V23/06 ,  H05K3/28 ,  H05K3/40 ,  H01R12/51

CPC classification number: F21S4/20 ,  F21V23/06 ,  F21Y2115/10 ,  H01R12/52 ,  H01R12/718 ,  H01R13/10 ,  H01R13/11 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/284 ,  H05K3/403 ,  H05K2201/037 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2203/0228 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49002

Abstract: A method for producing lighting devices, comprising at least one lighting module (20). The method comprises the stages of: - providing a plurality of lighting modules (20), wherein each lighting module comprises a first set of contacts placed at a first end of said lighting module (20) and a second set of contacts (204c, 204d) placed in corresponding positions at a second end of said lighting module (20); - connecting together a plurality of the lighting modules (20) for forming a series of lighting modules (20), wherein each lighting module (20a) is connected to the next lighting module (20b) by means of interconnecting elements (10) which connect the first set of contacts of each lighting module (20a) to the second set of contacts of the next lighting module (20b); and - cutting the series of lighting modules (20) in lighting devices comprising at least one lighting module (20), wherein the interconnecting elements (10) of the last lighting module of each lighting device are cut along their transverse axes. In particular, the interconnecting elements (10) comprise a base plate and a hollow portion in order to form female connectors when the interconnecting elements (10) are cut along their transverse axes.

公开(公告)号：EP1433221B1

公开(公告)日：2011-11-02

申请号：EP02752720.9

申请日：2002-08-07

Applicant: Intel Corporation

Inventor： BRIST, Gary ,  MEJIA, Charles ,  ALGER, William ,  LONG, Gary

IPC: H01P11/00

CPC classification number: H05K1/0237 ,  H01P11/002 ,  H05K3/0017 ,  H05K2201/037 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09981

Abstract: A method is provided for forming a waveguide in a printed circuit board, This may include forming a trench in a printed circuit substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.

公开(公告)号：EP1937040B1

公开(公告)日：2011-02-23

申请号：EP07123279.7

申请日：2007-12-14

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kornbichler, Andreas ,  Nalezinski, Martin ,  Richter, Olaf ,  Ziroff, Andreas Dr.

IPC: H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3442 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/10371