公开(公告)号：EP1569504A1

公开(公告)日：2005-08-31

申请号：EP04292973.7

申请日：2004-12-14

Applicant: Johnson Controls Technology Company

Inventor： Combe, Jean-Christophe ,  Montarou, Laurent

IPC: H05K3/34 ,  H05K5/00 ,  H05K7/14

CPC classification number: H05K5/006 ,  H05K3/306 ,  H05K3/3415 ,  H05K3/3447 ,  H05K7/142 ,  H05K2201/10189 ,  H05K2201/105 ,  H05K2203/0173

Abstract: Le boîtier électrique (1) comporte un capot (3) pour protéger une carte électronique (4) comportant un circuit imprimé (5) et des composants (6, 7, 8), dont au moins un connecteur (8) intégré au boîtier (1). Le boîtier est agencé pour le soudage des composants (6, 7, 8) par refusion. Après le soudage, le capot (3) et le connecteur (8) sont maintenus par la carte (4). Le connecteur (8) est solidaire du capot (3) par des bras flexibles (12).
L'invention s'applique bien au domaine de l'électronique automobile.

Abstract translation: 壳体（1）具有用于保护包括印刷电路（5），表面安装部件（6），通孔安装部件（7）和连接器（8））的电子板（4）的盖（3）。 该情况被布置为通过焊料熔合来焊接表面安装部件，通孔安装部件和连接器。 在焊接部件和连接器之后，连接器通过柔性臂（12）集成到盖子上。

公开(公告)号：EP0158230A1

公开(公告)日：1985-10-16

申请号：EP85103709.3

申请日：1985-03-27

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Edinger, Egon, Dipl.-Ing. (FH) ,  Pedall, Friedrich, Dipl.-Ing. (FH)

IPC: H04R17/00 ,  H04R1/04 ,  H05K3/34

CPC classification number: H04R1/04 ,  H04R17/00 ,  H05K3/3405 ,  H05K2201/10083 ,  H05K2201/10446 ,  H05K2201/105 ,  Y10T29/42 ,  Y10T29/49005

Abstract: Piezoelektrisch-akustische Wandler haben in der Regel zwei Anschlußbändchen zur Verbindung der akustisch-elektrischen Wandlerplatte mit der Verstärkerbaugruppe des Mikrofons. Bisher werden die beiden Anschlußbändchen manuell unter Zugabe von Lötzinn an Griplet-Lötnieten auf der Leiterplatten-Bauteileseite angelötet und mit Hilfe eines Isolierringes gegen das Gehäuse isoliert. Erfindungsgemäß werden die Anschlußbändchen (6) direkt auf den Leiterbahnen (12) einer Verstärkerflachbaugruppe (9) angelötet und mit einem Etikett (10) gegen das Gehäuse elektrisch isoliert. Voraussetzung für diese Art der automatengerechten Lötung und Isolierung ist ein Werkstückträger (13) mit mehreren Vorrichtungen zum Montieren der Flachbaugruppe (9) auf der Trägerplatte (13).

Abstract translation: 一种压电换能器具有两个连接带向声电换能器板与所述放大器单元的麦克风的正常连接。 到目前为止，两个连接带被手动添加焊料到Griplet焊料在PCB组件侧铆钉和通过针对绝缘壳体中的绝缘环的装置来进行焊接。 根据本发明，所述连接条带（6）被直接施加到放大器平坦组件的导体轨迹（12）（9）被钎焊并用抗壳体中的标签（10）电隔离。 一种用于这种类型的机器只是焊接和隔离的前提是一个工件支承（13），具有用于在所述载体板（13）的印刷电路板（9）安装若干设备。

公开(公告)号：EP3329751A1

公开(公告)日：2018-06-06

申请号：EP16729514.6

申请日：2016-06-06

Applicant: Robert Bosch GmbH

Inventor： LISKOW, Uwe

IPC: H05K3/32 ,  H05K3/28 ,  H05K3/30 ,  H05K5/00

CPC classification number: H05K3/284 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K3/328 ,  H05K5/0082 ,  H05K5/065 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/105 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/2072 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The invention relates to an electronic module (1) and a method for producing same. The electronic module has a circuit board (3), at least one first component (5), and a socket element (7) which has a first surface (6) and a second surface (8) opposite the first surface and the first surface (6) of which lies on a surface of the circuit board (3) and is fixed to the circuit board. The electronic module has a second component (9) which is secured to the socket element (7) and is electrically connected to the circuit board (3) via the socket element. Furthermore, a protective compound (11) is provided which is arranged on the surface of the circuit board (3) and encapsulates the first component (5). The electronic module (1) is characterized in that the socket element (7) is partly embedded into the protective compound (11) such that lateral flanks (10) of the socket element (7) are covered by the protective compound (11), and the second surface (8) of the socket element (7) protrudes out of the protective compound (11) in an exposed manner. Connection elements (19) of the socket element (7) and connections (17) of the second component (9) can be connected preferably via a welding connection (17) and can be encapsulated by a protective compound (21) or a cover. Second components (9), such as sensors or plugs for example, can thereby be attached to the circuit board (3) in a mechanically secured and electrically reliable manner. Because standard components and standard assembly methods can be used, changes to the design of the electronic module can be implemented easily and quickly.

公开(公告)号：EP2218376A3

公开(公告)日：2014-07-30

申请号：EP10163051.5

申请日：2008-10-01

Applicant: Nestec S.A.

Inventor： Etter, Stefan ,  Gaudenz, Urs ,  Gavillet, Gilles ,  Hodel, Thomas ,  Kollep, Alexandre ,  Möri, Peter ,  Moser, Renzo ,  Preisig, Peter ,  Schwab, Robin

IPC: A47J31/36

CPC classification number: A47J31/441 ,  A47J31/407 ,  A47J31/542 ,  A47J31/545 ,  F24H1/101 ,  F24H9/2028 ,  H01H37/52 ,  H05K1/18 ,  H05K3/306 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2201/2036

Abstract: An in-line heating device (1,2,3,4) for a liquid food or beverage preparation machine in which liquid is circulated through the heating device and then guided into a brewing chamber. This heating device comprises: a thermoblock with a metal mass (1) that incorporates an inlet, an outlet and a heating chamber extending therebetween to form a passage for guiding said liquid circulating through said mass, the mass being arranged to accumulate heat and to supply heat to the liquid; and one or more electric components (60,70,75) that are rigidly secured onto or into the thermoblock and that are connected to a printed circuit board (4) and/or a flex-print (4') arranged to control the thermoblock. The electric components are rigidly connected to the printed circuit board and/or flex-print, in particular via rigid connector pins or blades or rigid plug and socket members.

公开(公告)号：EP2218375A3

公开(公告)日：2014-07-30

申请号：EP10163041.6

申请日：2008-10-01

Applicant: Nestec S.A.

Inventor： Etter, Stefan ,  Gaudenz, Urs ,  Gavillet, Gilles ,  Hodel, Thomas ,  Kollep, Alexandre ,  Möri, Peter ,  Moser, Renzo ,  Preisig, Peter ,  Schwab, Robin

IPC: A47J31/36

CPC classification number: A47J31/441 ,  A47J31/407 ,  A47J31/542 ,  A47J31/545 ,  F24H1/101 ,  F24H9/2028 ,  H01H37/52 ,  H05K1/18 ,  H05K3/306 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2201/2036

Abstract: An in-line heating device (1,2,3,4) for a liquid food or beverage preparation machine in which liquid is circulated through the heating device and then guided into a brewing chamber. This heating device comprises: a thermoblock with a metal mass (1) that incorporates an inlet, an outlet and a heating chamber extending therebetween to form a passage for guiding said liquid circulating through said mass, the mass being arranged to accumulate heat and to supply heat to the liquid; and one or more electric components (60,70,75) that are rigidly secured onto or into the thermoblock and that are connected to a printed circuit board (4) and/or a flex-print (4') arranged to control the thermoblock. The electric components are rigidly connected to the printed circuit board and/or flex-print, in particular via rigid connector pins or blades or rigid plug and socket members.

公开(公告)号：EP2260684A1

公开(公告)日：2010-12-15

申请号：EP09723626.9

申请日：2009-03-21

Applicant: Kiekert Aktiengesellschaft

Inventor： SCHIFFER, Holger ,  REDDMANN, Uwe ,  WESTERWICK, Volker ,  HILD, Sven ,  RIEFERS, Stephan

IPC: H05K3/20 ,  H05K1/18

CPC classification number: H05K1/189 ,  E05B81/06 ,  E05B81/54 ,  E05B81/64 ,  H05K1/18 ,  H05K3/0058 ,  H05K3/3447 ,  H05K2201/0999 ,  H05K2201/105 ,  H05K2203/1572

Abstract: The subject matter of the present invention is a component carrier for electrical/electronic components (1, 2, 3; 4), in particular for mounting in a motor vehicle door lock, and an associated manufacturing method. The component carrier is equipped with at least one carrier plate (10) and with a conductor track structure (9) for making contact with the components (1, 2, 3; 4). According to the invention, the electrical components (1, 2, 3) and/or their contacts (11) and the conductor track structure (9) are arranged on two different sides compared to the carrier plate (9) arranged between them.

公开(公告)号：EP2218376A2

公开(公告)日：2010-08-18

申请号：EP10163051.5

申请日：2008-10-01

Applicant: Nestec S.A.

Inventor： Etter, Stefan ,  Gaudenz, Urs ,  Gavillet, Gilles ,  Hodel, Thomas ,  Kollep, Alexandre ,  Möri, Peter ,  Moser, Renzo ,  Preisig, Peter ,  Schwab, Robin

IPC: A47J31/36

CPC classification number: A47J31/441 ,  A47J31/407 ,  A47J31/542 ,  A47J31/545 ,  F24H1/101 ,  F24H9/2028 ,  H01H37/52 ,  H05K1/18 ,  H05K3/306 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2201/2036

Abstract: An in-line heating device (1,2,3,4) for a liquid food or beverage preparation machine in which liquid is circulated through the heating device and then guided into a brewing chamber. This heating device comprises: a thermoblock with a metal mass (1) that incorporates an inlet, an outlet and a heating chamber extending therebetween to form a passage for guiding said liquid circulating through said mass, the mass being arranged to accumulate heat and to supply heat to the liquid; and one or more electric components (60,70,75) that are rigidly secured onto or into the thermoblock and that are connected to a printed circuit board (4) and/or a flex-print (4') arranged to control the thermoblock. The electric components are rigidly connected to the printed circuit board and/or flex-print, in particular via rigid connector pins or blades or rigid plug and socket members.

公开(公告)号：EP2120523A2

公开(公告)日：2009-11-18

申请号：EP09005017.0

申请日：2009-04-04

Applicant: SEMIKRON Elektronik GmbH & Co. KG

Inventor： Backhaus, Klaus, Dr.

IPC: H05K7/14

CPC classification number: H05K5/006 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/189 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/105

Abstract: Es wird ein Anordnung mit einem Hauptträger und einer Leiterplatte beschrieben. Auf der Leiterplatte sind leichte und schweren elektrischen und / oder elektronischen Bauelementen befestigt, wobei mindestens ein schweres Bauelement mechanisch fest mit dem Hauptträger und elektrisch leitend mit Leiterbahnen eines ersten Abschnitts der Leiterplatte verbunden ist. Dieser erste Abschnitt ist elektrisch leitend mit einem zweiten Abschnitt der Leiterplatte verbunden und mittels einer Entkopplungseinrichtung von dem zweiten Abschnitt der Leiterplatte bezüglich mechanischer Schwingungen entkoppelt.

Abstract translation: 该装置具有轻和重的电气或电子部件（142，4）固定在印刷电路板（1）。 重分量E.G. 变压器，被机械地牢固连接到主载体（3）和导电地连接到电路板的一个部分（10）的导体条迹。 所述电路板的部分导电地连接到电路板的另一部分（14）。 前者部从后面的段解耦关于使用去耦装置（18）的机械振动E.G. 灵活的部分。

公开(公告)号：EP0101359B1

公开(公告)日：1988-02-10

申请号：EP83401545.5

申请日：1983-07-27

Applicant: DAV INDUSTRIES

Inventor： Viennois, Jean-Paul ,  Baudry, Jean-Pierre ,  Albert, Paul ,  Fadla, Roger

IPC: H01R9/09 ,  H05K5/02 ,  H05K7/02 ,  H05K3/36

CPC classification number: H05K7/026 ,  H01R12/523 ,  H05K1/144 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/105