公开(公告)号：EP2891175A4

公开(公告)日：2016-03-02

申请号：EP13833045

申请日：2013-09-02

申请人： SEMICONDUCTOR TECH & INSTR INC

发明人： JIN JIAN PING ,  LEE LENG KHEAM

IPC分类号： H01L21/683 ,  H01L21/687

CPC分类号： H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

摘要： A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

公开(公告)号：EP2840599A4

公开(公告)日：2015-11-18

申请号：EP13778995

申请日：2013-04-10

申请人： RORZE CORP

发明人： SAKIYA FUMIO ,  SAKATA KATSUNORI

IPC分类号： H01L21/673 ,  B25J11/00 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67742 ,  B25J11/0095 ,  E05F15/47 ,  E05F15/50 ,  E05F15/603 ,  E05F15/78 ,  H01L21/67265 ,  H01L21/67346 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67748 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

公开(公告)号：EP2919260A4

公开(公告)日：2015-10-28

申请号：EP12887866

申请日：2012-11-07

申请人： FUJI MACHINE MFG

发明人： YAMASAKI TOSHIHIKO ,  SHIMIZU TOSHINORI ,  OHASHI HIROYASU ,  MURAI MASAKI

IPC分类号： H01L21/52

CPC分类号： H01L21/68785 ,  B25J11/0095 ,  B25J15/0028 ,  H01L21/67144 ,  H01L21/67346 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L24/75 ,  H01L2224/7565

公开(公告)号：EP2891173A1

公开(公告)日：2015-07-08

申请号：EP13832999.0

申请日：2013-09-02

申请人： Semiconductor Technologies & Instruments Pte Ltd.

发明人： JIN, Jian Ping ,  LEE, Leng Kheam

IPC分类号： H01L21/677 ,  H01L21/68 ,  H01L21/683

CPC分类号： H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

摘要： A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

公开(公告)号：EP2408004A1

公开(公告)日：2012-01-18

申请号：EP10750632.1

申请日：2010-01-29

申请人： Kawasaki Jukogyo Kabushiki Kaisha

发明人： HASHIMOTO Yasuhiko ,  YOSHIDA Tetsuya

IPC分类号： H01L21/677 ,  B25J15/08

CPC分类号： B25J15/0014 ,  B25J9/042 ,  B25J9/10 ,  B25J11/0095 ,  B25J15/0052 ,  B25J15/0616 ,  H01L21/67742 ,  H01L21/68707 ,  Y10S414/137 ,  Y10S414/141 ,  Y10T74/20305

摘要： The present invention relates to an end effector including: blade members for holding substrates, each configured to hold the substrate, and configured such that each interval between the blade members can be changed; a blade support unit configured to support the blade members, the blade support unit being configured to be driven integrally with the blade members by the robot; and blade drive means configured to change the interval between the blade members by moving at least one of the blade members relative to another blade member.

摘要翻译： 本发明涉及一种末端执行器，包括：用于保持基板的叶片构件，每个构件用于保持基板，并且构造成可以改变叶片构件之间的每个间隔; 构造成支撑所述叶片构件的叶片支撑单元，所述叶片支撑单元构造成由所述机器人与所述叶片构件一体地驱动; 以及刀片驱动装置，其构造成通过相对于另一个叶片构件移动至少一个叶片构件来改变叶片构件之间的间隔。