公开(公告)号：EP2197781A2

公开(公告)日：2010-06-23

申请号：EP08803521.7

申请日：2008-09-02

Applicant: Robert Bosch GmbH

Inventor： FRANKE, Axel ,  TRAUTMANN, Achim ,  FEYH, Ando ,  KNIES, Sonja

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81C2201/019 ,  B81C2203/036

Abstract: The invention relates to a composite (1) comprising a first semiconductor substrate (4) having at least one MEMS-component (2) and at least one second semiconductor substrate (4), wherein at least one layer (6) comprising germanium is bonded eutectically with at least one layer (3) comprising aluminum. According to the invention, the layer (3) comprising aluminum is provided on the first semiconductor substrate (1) and the layer (6) comprising germanium on the second semiconductor substrate (4). The invention further relates to a production method for a composite (1).

Abstract translation: 本发明涉及包括具有至少一个MEMS部件（2）和至少一个第二半导体衬底（4）的第一半导体衬底（4）的复合物（1），其中包含锗的至少一个层（6）被结合 与至少一个包含铝的层（3）共熔。 根据本发明，在第一半导体衬底（1）上提供包含铝的层（3），并且在第二半导体衬底（4）上提供包含锗的层（6）。 本发明还涉及用于复合材料（1）的生产方法。

公开(公告)号：EP2093797A1

公开(公告)日：2009-08-26

申请号：EP09354005.2

申请日：2009-02-10

Applicant: Commissariat à l'Energie Atomique

Inventor： Rousseau, Maxime ,  Viala, Bernard

IPC: H01L23/544

CPC classification number: B81C3/004 ,  B81B2207/017 ,  B81C2201/019 ,  B81C2203/051 ,  H01L23/645 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

Abstract: Des substrats à aligner comportent des microbobines disposées au niveau de leurs faces en regard. Dans une phase d'alignement, au moins les microbobines du premier substrat sont alimentées, tandis que l'inductance des microbobines du second substrat est mesurée. Les microbobines sont de préférence des microbobines planes en forme de spirale ou de méandre.

Abstract translation: 该方法涉及在对准阶段中在平行于衬底的平面中相对于彼此移动两个衬底。 测量与对准检测单元相关联的电量，并且基于量的变化确定衬底对准，其中单元包括平面微卷线器。 测量在底物的金属互连水平形成的微线圈（1a）。 将电流提供给其中一个基板的微线圈，并测量另一个基板的微线圈的电感，其中电感构成量。

公开(公告)号：EP2091861A1

公开(公告)日：2009-08-26

申请号：EP07847092.9

申请日：2007-11-01

Applicant: ETA SA Manufacture Horlogère Suisse

Inventor： MARMY, Philippe ,  HELFER, Jean-Luc ,  CONUS, Thierry

IPC: B81C5/00

CPC classification number: B81C99/0095 ,  B81B2201/035 ,  B81C2201/019 ,  B81C2201/056 ,  B81C2203/038 ,  B81C2203/051 ,  G04B31/004 ,  G04D3/0069 ,  Y10T29/49579

Abstract: The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated from the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

公开(公告)号：EP1857423B1

公开(公告)日：2009-08-05

申请号：EP06300471.7

申请日：2006-05-15

Applicant: Corning Incorporated

Inventor： NEDELEC, Yann

IPC: C03C27/06

CPC classification number: B81C1/00071 ,  B01L3/5027 ,  B81C2201/019 ,  C03C17/04 ,  C03C27/06 ,  C03C27/10 ,  Y10T29/494 ,  Y10T137/2224 ,  Y10T428/24562 ,  Y10T428/24661 ,  Y10T428/24744 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24926

公开(公告)号：EP2075223A2

公开(公告)日：2009-07-01

申请号：EP08172569.9

申请日：2008-12-22

Applicant: Commissariat à l'Energie Atomique

Inventor： Caplet, Stéphane

IPC: B81C1/00

CPC classification number: B81C1/00944 ,  B81C2201/019

Abstract: Dispositif (100) à structure pré-libérée comportant au moins :
- au moins un premier empilement, comprenant au moins une première couche (102) à base d'au moins un premier matériau, disposé contre un second empilement comprenant au moins une seconde couche (104) à base d'au moins un second matériau,
- au moins une cavité (112) fermée, réalisée dans le premier et/ou le second empilement, et disposée entre une portion (114) du premier empilement formant la structure pré-libérée et le second empilement,
- au moins un espaceur (116) disposé dans la cavité (112) et reliant la portion (114) du premier empilement au second empilement.

Abstract translation: 所述装置具有包括由半导体材料制成的有用层（102），所述有效层（102）设置成抵抗另一桩，所述堆叠包括由半导体氧化物，玻璃和/或二氧化硅材料制成的衬底（104）。 在桩中形成封闭的空腔（112），并且布置在形成预释放结构的后者桩的前一个桩的有用层的一部分（114）之间。 间隔件即凸耳（116）被放置在空腔中，用于将前者的一部分与后者的桩相连接。 电介质层（106）布置在层和层的基底之间。 独立权利要求还包括以下内容：（1）实现具有预释放结构的装置的方法（2）用于在装置（3）中实现预释放结构的方法，用于释放结构的方法 设备。

公开(公告)号：EP2029475A1

公开(公告)日：2009-03-04

申请号：EP07743258.1

申请日：2007-05-08

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： YAMAGUCHI, Mayumi ,  IZUMI, Konami, c/o Semiconductor Energy Laboratoy Co., Ltd.

IPC: B81C3/00 ,  B81B3/00

CPC classification number: H01L21/762 ,  B32B38/10 ,  B81C3/008 ,  B81C2201/019 ,  Y10T428/24802

Abstract: Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.

公开(公告)号：EP1486455B1

公开(公告)日：2009-02-25

申请号：EP03707062.0

申请日：2003-02-25

Applicant: Hitachi Chemical Company, Ltd.

Inventor： KAWAZOE,H. HITACHI CHEMICAL CO.LTD.Res.&Devel.Center ,  NAKASO,A. HITACHI CHEMICAL CO.LTD.Res.&Devel.Center ,  ARIKE,S. HITACHI CHEMICAL CO.LTD.Res.&Devel.Center

IPC: B01J19/00 ,  B01L3/00

CPC classification number: B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

Abstract: A micro fluid system support unit includes a first support body (2), a first adhesive layer (1a) arranged on the surface of the first support body (2), a first hollow filament group consisting of a plurality of hollow filaments (501 to 508) arranged with an arbitrary shape on the surface of the first adhesive layer (1a), a second hollow filament group consisting of a plurality of hollow filaments (511 to 518) arranged in the direction orthogonal to the first hollow filament group, a second adhesive layer (1b) arranged on the surface of the second hollow filament group, and a second support body (6) arranged on the surface of the second adhesive layer (1b). The first and the second hollow filament group constitute a flow passage layer.

公开(公告)号：EP1989732A1

公开(公告)日：2008-11-12

申请号：EP07712320.6

申请日：2007-02-26

Applicant: Tracit Technologies

Inventor： ASPAR, Bernard ,  LAGAHE-BLANCHARD, Chrystelle

IPC: H01L21/762

CPC classification number: B81C1/00357 ,  B81C1/0038 ,  B81C2201/019 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/76251 ,  H01L21/76254 ,  Y10T428/12674

Abstract: The invention relates to a method for producing a semiconductor structure comprising a superficial layer (20'), at least one embedded layer (36, 46), and a support (30), which method comprises: a step of forming, on a first support, patterns (23) in a first material, a step of forming a semiconductor layer, between and on said patterns, a step of assembling said semiconductor layer with a second support (30).

公开(公告)号：EP1979080A2

公开(公告)日：2008-10-15

申请号：EP06846047.6

申请日：2006-12-22

Applicant: Corning Incorporated

Inventor： DAVIDOVITS, Jerome, V. ,  SUTHERLAND, James, S.

IPC: B01F5/00

CPC classification number: B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00824 ,  B01J2219/00831 ,  B01J2219/00853 ,  B01J2219/0086 ,  B01J2219/00907 ,  B01J2219/00963 ,  B01J2219/0097 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/051 ,  B81B2203/0127 ,  B81C2201/019 ,  C03C17/04 ,  C03C2218/328 ,  C03C2218/33

Abstract: Microfluidic devices having wall structures comprised of sintered glass frit and further including a glass, glass-ceramic or ceramic membrane structure sealed by a sintered seal to said wall structures, such that a a fluid passage or chamber is defined at least in part by the wall structures and said membrane structure. This allows for changes in pressure within the fluid passage or chamber to cause deflections of the membrane structure, providing for direct measurement of pressure within the device. The microfluidic device may have both floors and walls of sintered frit, or may have only walls of sintered frit, with planar floor-like substrate structures, thicker than the membrane structure defining the vertical boundaries of the internal passages. The device may include multiple fluid passages or chambers each defined at least in part by a membrane structure. Multiple membrane structures may be used in a single device, and one single membrane structure may be used for multiple passages or chamber.

公开(公告)号：EP1902780A3

公开(公告)日：2008-04-02

申请号：EP08000283.5

申请日：2003-02-25

Applicant: Hitachi Chemical Co., Ltd.

Inventor： The designation of the inventor has not yet been filed

IPC: B01J19/00 ,  B01L3/00

CPC classification number: B01L3/502707 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00822 ,  B01J2219/00833 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0655 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2203/032 ,  Y10T156/10

Abstract: A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. No groove to receive the hollow filament is arranged on the first support.

Abstract translation: 用于微流体系统的支撑单元包括第一支撑件; 设置在所述第一支撑件的表面上的第一粘合剂层; 以及设置在第一粘合剂层的表面上的中空丝，以具有任意形状并用作微流体系统的流动通道层。 在第一支架上不设置用于接收中空丝的凹槽。