-
公开(公告)号：EP0868975A1
公开(公告)日：1998-10-07
申请号：EP98106067.6
申请日：1998-04-02
IPC分类号： B24B37/04
摘要： The polishing apparatus (100) comprises a turn table (10), which polishes a semiconductor wafer (2), and a holding and pressing part (20), which holds and presses the semiconductor wafer (2) against a polishing surface (12a) of the turn table (10). The holding and pressing part (20) transmits a force from an air bag (62) to the semiconductor wafer (2) via a pressurized fluid layer (L) to thereby press the semiconductor wafer (2) against the polishing surface (12a) via the pressurized fluid layer (L), so that the semiconductor wafer (2) can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer (2).
摘要翻译： 研磨装置（100）包括对半导体晶片（2）进行研磨的转台（10）和将半导体晶片（2）保持并按压在研磨面（12a）上的保持按压部（20） 的转台（10）。 保持按压部20经由加压流体层L将来自气囊62的力传递给半导体晶片2，从而经由加压流体层L将半导体晶片2按压在研磨面12a上， 加压流体层（L），从而可以抛光半导体晶片（2）。 由此，可以均匀地研磨半导体晶片（2）。
-
公开(公告)号：EP0824056A2
公开(公告)日：1998-02-18
申请号：EP97113996.9
申请日：1997-08-13
发明人： Azuma, Masayuki
IPC分类号： B28D5/02
CPC分类号： B28D5/029 , Y10T83/6587
摘要： A dicing machine of the present invention is provided with two spindles (64, 66), which are arranged parallel to one another in the direction of the Y-axis and face one another. A workpiece (W) is moved toward the spindles (64, 66) in the direction of the X-axis, and two blades (68, 70) fitted to the two spindles (64, 66) cut the workpiece (W). The two spindles (64, 66) are movable in the direction of the Y-axis, so that the two blades (68, 70) can be arranged at a desired interval. One of the spindles (64, 66) is movable in the direction of the X-axis so that the two blades (68, 70) can be arranged on the same street. Hence, desired two streets or one street can be simultaneously cut with the two blades (68, 70).
摘要翻译： 本发明的切割机设有两个主轴（64,66），它们沿Y轴方向彼此平行地布置并且彼此面对。 工件（W）在X轴方向上朝主轴（64,66）移动，并且安装在两个主轴（64,66）上的两个刀片（68,70）切割工件（W）。 两个主轴（64,66）可沿Y轴方向移动，从而两个刀片（68,70）可以以期望的间隔布置。 其中一个主轴（64,66）可沿X轴方向移动，使得两个刀片（68,70）可布置在相同的街道上。 因此，可以用两个刀片（68,70）同时切割所需的两条街道或一条街道。
-
公开(公告)号：EP0562606B1
公开(公告)日：1997-10-29
申请号：EP93104958.9
申请日：1993-03-25
发明人： Yoshida, Hitoshi
IPC分类号： G01B5/00
CPC分类号： G01B21/04
-
44.发明公开Apparatus for recognizing the shape of a semiconductor wafer 失效Gerätzur Erkennung der Form einer Halbleiterscheibe。
公开(公告)号：EP0614080A3
公开(公告)日：1995-01-25
申请号：EP94301426.6
申请日：1994-02-28
CPC分类号： H01L21/681
摘要： The present invention provides an apparatus for recognizing the shape of a semiconductor wafer, capable of stably achieving accurate shape recognition without being affected by a circuit pattern formed on the semiconductor wafer. The shape recognizing apparatus in accordance with the present invention comprises an illuminating means (1) for illuminating a semiconductor wafer (100), an image pickup means (3) for picking up an image of the semiconductor wafer (100) and providing video signals representing the image, disposed so that specular light reflected by the semiconductor wafer (100) will not fall thereon, and a shape recognizing means (6) which processes the video signals to recognize the shape of the semiconductor wafer (100), a first polarizing means (7) is disposed on a light path along which the illuminating light emitted by the illuminating means (1) travels, and a second polarizing means (8) is placed on a path along which reflected light from the semiconductor wafer (100) travels toward the image pickup means (3).
摘要翻译： 本发明提供一种用于识别半导体晶片的形状的装置，其能够在不受半导体晶片上形成的电路图案影响的情况下稳定地实现精确的形状识别。 根据本发明的形状识别装置包括用于照射半导体晶片（100）的照明装置（1），用于拾取半导体晶片（100）的图像的图像拾取装置（3），并且提供表示 所述图像被布置成使得由所述半导体晶片（100）反射的镜面光不会落在其上;以及形状识别装置（6），其处理所述视频信号以识别所述半导体晶片（100）的形状;第一偏振装置 （7）设置在由所述照明装置（1）发射的照明光行进的光路上，并且将第二偏振装置（8）放置在沿着半导体晶片（100）的反射光朝着 图像拾取装置（3）。
-
45.发明公开Mounting structure for cutting blade of dicing apparatus 失效Aufnahmevorrichtungfürdas Schneidemesser einesScheibenschneidegeräts。
公开(公告)号：EP0614719A1
公开(公告)日：1994-09-14
申请号：EP94301586.7
申请日：1994-03-07
发明人： Tsuchishima, Jiro, c/o Tokyo Seimitsu Co., Ltd. , Chiba, Kiyotaka, c/o Tokyo Seimitsu Co., Ltd.
CPC分类号： B23D61/10 , B24B45/00 , B26D7/2621 , Y10T83/9379 , Y10T83/9403 , Y10T83/9464
摘要： A mounting structure for a cutting blade in a dicing apparatus in which a mounted blade is rotated in a well-balanced condition and further the blade can be easily attached to and detached from the apparatus. The mounting structure of the invention comprises a mount (3) including a first cylindrical engagement portion (31), and a first screw portion (33); a cutting blade (4) including a second engagement portion (43) engaging with a first engagement portion (31); and a screw member (5) including a second screw portion (51) being screwed into the first screw portion (33) so that the screw member (5) presses the cutting blade (4) against the flange surface (32) for fixation, the mount (3) further including a third cylindrical engagement portion (36), and the screw member (5) including a fourth engagement portion (52) engaging with the third engagement portion (36).
摘要翻译： 一种用于切割装置中的切割刀片的安装结构，其中安装的刀片在平衡状态下旋转，并且刀片可以容易地附接到设备上并从设备拆下。 本发明的安装结构包括一个包括第一圆柱形接合部分（31）和第一螺纹部分（33）的安装件（3）。 包括与第一接合部分（31）接合的第二接合部分（43）的切割刀片（4）; 以及螺钉构件（5），其包括螺纹连接到所述第一螺纹部分（33）中的第二螺纹部分（51），使得所述螺钉构件（5）将所述切割刀片（4）压靠在所述凸缘表面（32）上以进行固定， 所述安装件（3）还包括第三圆柱形接合部分（36），所述螺钉部件（5）包括与所述第三接合部分（36）接合的第四接合部分（52）。
-
46.发明公开Method of measuring the depth of full-cut dicing grooves by using an ultrasonic detector and a dicing apparatus for carrying out the same 失效用于测量全切网格沟槽的深度与超声波检测器和用于实现该方法切割装置的方法。
公开(公告)号：EP0612978A1
公开(公告)日：1994-08-31
申请号：EP94301056.1
申请日：1994-02-14
IPC分类号： G01B17/00
CPC分类号： G01B17/00
摘要： The present invention provides a method of measuring the depth of a dicing groove, employing an ultrasonic detector, capable of measuring the depth of the groove in a high accuracy when the groove is cut in a full-cut mode. A method according to the present invention employes an ultrasonic detector which emits ultrasonic waves, measures the time interval between the emission of the ultrasonic waves and the return of their echo, the phase difference between the emitted ultrasonic waves and the reflected ultrasonic waves, or both the time interval and the phase difference to measure the depth of the groove. The method of the present invention is featured by determining the depth of the dicing groove on the basis of the depth of the groove formed in an exposed area of the adhesive sheet not occupied by the workpiece.
摘要翻译： 本发明提供测量切割槽的深度，使用超声波的检测器的，能够测量槽的深度在高精度当槽在全切割的方式切割的方法。 雅丁到在超声波检测器，其发射超声波本发明聘用过的员工的方法，测量超声波的发射及回声返回，所发射的超声波和反射的超声波，或两者之间的相位差之间的时间间隔 的时间间隔和相位差来测量槽的深度。 本发明的方法是通过确定性挖掘功能在工件上的粘合片的暴露区域形成的槽的深度的基础上切割槽的未被占据的深度。
-
47.发明公开
公开(公告)号：EP0601320A1
公开(公告)日：1994-06-15
申请号：EP93117342.1
申请日：1993-10-26
发明人： Tange, Kouichi
IPC分类号： G06F3/023
CPC分类号： G06F3/04817
摘要： An icon relocation system and a method therefore applied to a three-dimensional coordinates measuring machine (16) having measurement programs for performing various measurements and measuring based on a specified measurement program. The icon menu table indicating said various measurements and divided into from first group to Nth group is read out from an external storage medium. The respective icons of the selected icon menu are displayed on a display means (12) in a row by selecting one group from the read-out icon menu table, and further, the measurement program is selected by selecting an icon among from a icon group displayed on said display means (12). Each utilization frequency of the icon is counted based on the icon selection, and the icon menu table is edited so as to locate an icon with high utilization frequency in a high group. And, the edited icon menu table is memorized in the storage media.
摘要翻译： 一种图标搬迁系统和方法，其应用于具有基于特定测量程序执行各种测量和测量的测量程序的三维坐标测量机（16）。 从外部存储介质中读出表示各种测量并从第一组到第N组分配的图标菜单表。 所选择的图标菜单的各个图标通过从读出图标菜单表中选择一个组而显示在行的显示装置（12）上，并且还通过从图标组中选择图标来选择测量程序 显示在所述显示装置（12）上。 基于图标选择对图标的每个使用频率进行计数，编辑图标菜单表，以便在高组中定位具有高利用频率的图标。 并且，编辑的图标菜单表被存储在存储介质中。
-
48.发明公开Method and apparatus for slicing semiconductor wafer 失效Verfahren und Vorrichtung zum Abschneiden einer Halbleiterscheibe。
公开(公告)号：EP0579227A1
公开(公告)日：1994-01-19
申请号：EP93111377.3
申请日：1993-07-15
发明人： Honda, Katsuo
CPC分类号： B28D5/0058 , B28D5/0088 , B28D5/028
摘要： An inner peripheral cutting edge (10) is made of a doughnut-shaped blade (12) deposited diamond grains, arranged rotatably in the directionof an arrow and held in a moving trestle (16). The moving trestle (16) is mounted movable in the direction of an arrow B along rails (18 and 18) located in sides of the inner peripheral cutting edge (10), and driven by instruction signals from a control section (20). A workpiece (22) is placed at the inner peripheral position of the inner peripheral cutting edge (10) and rocked about the axis thereof by a motor (25). The motor (25) is fitted on a beam member and driven by instruction signals from the control section (20). With this arrangement, the inner peripheral cutting edge (10) is rotated in the direction of the arrow A, and then the moving trestle (16) is fed in the direction of the arrow B by the control section (20) and the workpiece (22) is pressed against a grindstone (14) of the inner peripheral cutting edge (10), sthat the workpiece (22) is cut by a predetermined value, thereafter, the moving trestle (16) is stopped by the control section (20) and the workpiece (22) is rocked about the axis thereof by driving the motor (25), so that a reminder part can be cut.
摘要翻译： 内圆周切割刃（10）由圆形刀片（12）制成，沉积金刚石晶粒，沿箭头方向可旋转地设置并保持在移动的支架（16）中。 移动支架（16）沿着位于内周切削刃（10）侧面的轨道（18和18）沿着箭头B的方向移动，并由来自控制部分（20）的指令信号驱动。 工件（22）位于内周切削刃（10）的内周位置，通过电动机（25）围绕其轴线摆动。 电动机（25）安装在梁构件上并由来自控制部分（20）的指令信号驱动。 通过该结构，内周切削刃10沿箭头A的方向旋转，然后通过控制部（20）和工件（B）向箭头B的方向供给移动支架（16） 22）被压靠在内周切削刃（10）的磨石（14）上，工件（22）被切割预定值，此后，移动支架（16）被控制部（20）停止， 并且通过驱动马达（25）使工件（22）围绕其轴线摇摆，从而可以切割提醒部件。
-
公开(公告)号：EP0534499A2
公开(公告)日：1993-03-31
申请号：EP92119722.4
申请日：1988-01-29
发明人： Honda, Katsuo , Sawafuji, Susumu
摘要： A method for slicing a cylindrical semiconductor ingot (34) into thin wafer pieces using an inner peripheral slicing blade (14) is provided. In the wafer slicing method, a grind stone shaft (62) with a grind stone (16) mounted to the tip end thereof is located movably axially within a rotor (38) provided with the inner peripheral slicing blade (14) and the grind stone shaft (62) and rotor (38) can be rotated integrally. The grind stone (16) and slicing blade (14) are arranged efficiently, so that, after the semiconductor ingot (34) is sliced with the slicing blade (14), the grind stone approaches the end face of the ingot (349 to grind it. This can save a lapping step, thereby improving a working efficiency.
-
50.发明公开A slicing machine and a slicing method by the same 失效Schneidemachine und Abschneideverfahren mit dieser Maschine。
公开(公告)号：EP0456223A1
公开(公告)日：1991-11-13
申请号：EP91107503.4
申请日：1991-05-08
IPC分类号： B23D5/02 , B23D45/08 , B26D1/147 , H01L21/304
CPC分类号： B28D5/028 , B23D47/005 , B23D59/002 , Y10S125/901 , Y10T83/148
摘要： A slicing method is disclosed in which a crystal ingot is sliced by a rotary blade (14) while the inner peripheral cutting edge of the blade (14) is kept in a highly rigid state. In particular, in a slicing machine which is adapted to slice out a crystal ingot (20) into thin pieces by use of an inner peripheral cutting edge 16 of a doughnut-shaped rotary blade (14), an axial force is previously applied to the rotary blade (14) prior to starting of the slicing to thereby displace the rotary blade 14 in the axial direction thereof and thus, while the rigidity of the inner peripheral cutting edge (16) is kept in a high state, the crystal ingot (20) is sliced so as to realize a highly accurate slicing operation.
摘要翻译： 公开了一种切片方法，其中，当刀片（14）的内周切削刃保持在高度刚性状态时，通过旋转刀片（14）切割晶锭。 特别地，在适于通过使用环形旋转刀片（14）的内周切削刃16将晶锭（20）切割成薄片的切片机中，预先将轴向力施加到 旋转刀片（14）在开始切片之前使旋转刀片14沿其轴向移位，因此在内周切削刃（16）的刚性保持在高状态的同时，晶锭（20 ）切片，以实现高精度的切片操作。
-
-
-
-
-
-
-
-
-
搜索结果
285 条记录 (耗时 0.036 秒)
