摘要:
A method for making a molded high voltage splice body by positioning a conductive elastomeric electrode on a mandrel, positioning an extruded conductive elastomeric sleeve over the elastomeric electrode, sealing the ends of the elastomeric sleeve, placing the mandrel with the electrode and sleeve on it into a mold, injecting a curable insulating compound between the electrode and the sleeve under pressure and curing the insulating compound.
摘要:
A method of manufacturing a resin sealing module, which includes an injection step of injecting an uncured curable liquid resin into a module case and a positioning step of positioning the mold member, is provided. In the injection step, a substrate with electronic components is immersed into the curable liquid resin. In the positioning step, the mold member is positioned so that inside space of the first partition wall faces a second region. In the positioning step, at least a protruding end potion of the first partition wall is immersed into the curable liquid resin while a gas layer is held in the inside space. Thereby, a partial region of an upper surface of the curable liquid resin is depressed by the gas layer, so that this region is positioned lower in level than other regions.
摘要:
A method of manufacturing a fluorescent silicone film contains: steps of: A. mixing optical silicone and fluorescent powders so as to produce a mixture, and adding liquid to the mixture; B. vacuuming, degassing and feeding the mixture into an accommodation cavity of a mold (100); C. placing the mold (100) into a planetary centrifugal mixer so as to centrifuge the mixture; D. forming the fluorescent silicone film in the accommodation cavity; and E. solidifying and removing the fluorescent silicone film from the mold (100). In the step of A, the optical silicone and the fluorescent powders are mixed at a ratio of 100:10 to 100:25. In the step of B, the accommodation cavity is closed after feeding the mixture. In the step of D, the fluorescent silicone film has a silicone layer and a fluorescent powder layer which are formed in the accommodation cavity in a chemical vapor deposition (CVD) manner.
摘要:
A uniaxially-stretched, high yield extruded capacitor film comprising a compatible polymer blend comprising a polyetherimide and a polyphenylene ether sulfone, wherein the polyetherimide comprises units derived from polymerization of an aromatic dianhydride with a diamine comprising a m-phenylenediamine, a p-phenylenediamine, or combinations thereof, wherein the polyetherimide is endcapped with a substituted or unsubstituted aromatic primary monoamine, wherein the polyphenylene ether sulfone comprises both an ether linkage and an aryl sulfone linkage in its backbone, wherein the compatible polymer blend comprises a dispersed phase having an average cross section of from equal to or greater than about 0.01 microns to about 20 microns, and wherein the high yield extruded capacitor film comprises equal to or greater than about 90 wt. % of the compatible polymer blend entering an extruder used for manufacturing the capacitor film, based on the total weight of the compatible polymer blend prior to entering the extruder.
摘要:
Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.
摘要:
An imprinting method for forming a pattern of a cured product by irradiating a curable composition for imprinting disposed on a substrate with light while the curable composition is in contact with a mold having surface asperities and removing the mold from a cured product of the curable composition. The method includes bringing the mold into contact with the curable composition in a condensable gas atmosphere, wherein the curable composition for imprinting has a viscosity in the range of 1 cP to 40 cP in air at 23° C., and the condensable gas is introduced between the mold and the curable composition such that the curable composition for imprinting has a condensable gas solubility (gas/(curable composition+gas)) (g/g) in the range of 0.1 to 0.4.
摘要:
A curable composition for imprinting in a condensable gas atmosphere, wherein the maximum condensable gas solubility (gas/(curable composition+gas)) (g/g) is 0.1 or more and 0.4 or less, and the curable composition for imprinting has a viscosity of 40 cP or less at 23° C. The maximum condensable gas solubility is determined by charging a 9-ml brown bottle with 3 g of the curable composition, measuring the weight of the curable composition at 23° C. at 1 atm before and after bubbling of the condensable gas at a flow rate of 0.1 L/min for 15 minutes, and dividing the increased weight due to the bubbling by the total weight of the curable composition and the condensable gas.
摘要:
A method for manufacturing an insert-molded bus bar (50) includes the steps of: preparing a first bus bar (10) having a through hole (12) and a second bus bar (14) having a protrusion (16) corresponding to the through hole (12); preparing a mold (20) having therein a swaging member (30) capable of swaging the protrusion (16); placing the first and second bus bars (10, 14) in the mold (20) with the protrusion (16) being inserted into the through hole (12); swaging the first and second bus bars (10, 14) using the swaging member (30) of the mold (20) to obtain connected bus bars that are the bus bars connected to each other; and injecting a molding material (52) around the connected bus bars that are the bus bars connected to each other by swaging to perform insert molding using the mold (20) and obtain the insert-molded bus bar (50).
摘要:
The present invention provides a biaxially stretched polypropylene film that achieves excellent dielectric strength and protective properties in a high voltage capacitor and ensures consistent processability into an element. The present invention provides a biaxially stretched polypropylene film including protrusions on both surfaces, in which the biaxially stretched polypropylene film has a thickness t1 of 1 µm to 3 µm, has a tensile strength in the machine direction of 120 MPa to 250 MPa, has a tensile strength in the transverse direction of 250 MPa to 400 MPa, has a minimum protrusion height P min of 100 nm or greater and a maximum protrusion height P max of 1,600 nm or smaller for either surface, and satisfies all of Formulae (1) to (3) when one of the surfaces is surface A and the other is surface B: 0.5 ‰¤ Pa 250 - 450 / Pa ‰¤ 1.0 0.5 ‰¤ Pb 450 - 1600 / Pb ‰¤ 1.0 600 ‰¤ Pa + Pb ‰¤ 1 , 200