SIGNAL TRANSMISSION METHOD AND MOTHERBOARD STRUCTURE
    44.
    发明公开
    SIGNAL TRANSMISSION METHOD AND MOTHERBOARD STRUCTURE 审中-公开
    信号传输方法和母亲的电路结构

    公开(公告)号:EP1078479A1

    公开(公告)日:2001-02-28

    申请号:EP99923622.7

    申请日:1999-05-10

    申请人: Nokia Networks Oy

    发明人: MARJAKANGAS, Jari

    IPC分类号: H04B10/12 G06F1/10

    CPC分类号: H04B10/801 G06F1/105

    摘要: The invention relates to a signal transmission method and a motherboard structure (50) used in a base station of a radio system, for example, and comprises printed circuit board units (10-12) communicating with the motherboard structure and communicating with one another by signals. The motherboard structure (50) comprises an optical fibre sheet (40) having optical fibres (41, 42) arranged therein, first converter means (20, 21) receiving from the printed circuit board unit electrical low-power and high-frequency signals, such as clock signals and RF signals. The first converter means convert the received signals into optical signals, and each optical signal is conducted into an optical fibre of its own in the fibre sheet (40). The motherboard structure further comprises second converter means (30, 31) converting the optical signals which have propagated in the fibre sheet (40) back into electrical signals which are conducted to the printed circuit board units after the conversion.

    Processor arrangements
    46.
    发明公开
    Processor arrangements 失效
    处理器的配置。

    公开(公告)号:EP0033631A2

    公开(公告)日:1981-08-12

    申请号:EP81300359.7

    申请日:1981-01-27

    CPC分类号: H04B10/801 G06F1/105 G06F1/26

    摘要: A processor arrangement consists of a number of individual autonomous processor units which communicate with each other by means of electro-magnetic waves. The electro-magnetic energy is typically at infra-red optical frequencies. Although the energy necessary to operate the individual processor units can be supplied by means of conductive bus bars, in a preferred arrangement the energy is supplied from a light source at optical frequencies to photo cells mounted on each of the processor units. Each processor arrangement is provided with an input-output device which communicates with the individual processor units by means of electro-magnetic waves and is provided with external conductive leads in a conventional manner. The whole processor arrangement is encapsulated in an evacuated chamber.