摘要:
A chemical mechanical polishing composition and slurry comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition and slurry to polish tungsten containing substrates.
摘要:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-lutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.
摘要:
A slurry containing abrasive particles and a dual-valent rare earth ion or suspension of its colloidal hydroxide is especially useful for polishing surfaces, including those used in microelectronics. A suspension of a colloidal dual-valent rare earth hydroxide is especially useful for polishing silica.
摘要:
A composition for polishing an aluminum, copper or tungsten film, which comprises water and a polishing agent selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, silicon nitride and zirconium oxide, and which further contains an iron(III) compound dissolved in the composition, wherein the iron(III) compound is selected from the group consisting of iron(III) pyrophosphate, iron(III) citrate, iron(III) ammonium citrate, iron(III) ammonium oxalate, iron(III) ammonium sulfate, iron(III) perchlorate, iron(III) chloride, iron(III) sulfate and iron(III) phosphate.
摘要:
A chemical mechanical polishing precursor composition comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate. Also disclosed is a chemical mechanical polishing composition comprising an oxidizing agent and at least one catalyst having multiple oxidation sites, the composition being useful when combined with an abrasive or an abrasive pad to remove metal layers from a substrate.
摘要:
A chromium and ferricyanide free aqueous deoxidizer/desmutter for aluminum and magnesium alloys contains nitric acid, ferric ions, persulfate, and molybdate and preferably also sulfate, fluoride, and ethoxylated acetylenic diol surfactant.
摘要:
A burnishing liquid used in a physicochemical mass finishing process serves to chemically remove the conversion coating as well as to promote brightness of the treated metal surface. The burnishing liquid has a very low content of organic constituent and therefore a low chemical oxygen demand characteristic. The burnishing liquid comprises a water-soluble tetrapyrophosphate or hexametaphosphate and has a pH of about 8.5 to 10.5.
摘要:
A composition for polishing a layer of non-electrolysis nickel plating, an alumite layer or an aluminium substrate in a memory hard disc comprises water, a polishing agent of aluminium oxide, and a polishing accelerator comprising nickel nitrate or aluminium nitrate or both nickel nitrate and aluminium nitrate, or nickel sulfate and aluminium nitrate.