公开(公告)号：EP2974046A1

公开(公告)日：2016-01-20

申请号：EP14769253.7

申请日：2014-03-07

申请人： Robert Bosch GmbH ,  Feyh, Ando, Lars ,  O'Brien, Gary ,  Yama, Gary

发明人： FEYH, Ando ,  O'BRIEN, Gary ,  YAMA, Gary

IPC分类号： H04B1/40

CPC分类号： G01J5/505 ,  G01J5/0265 ,  G01J5/0859 ,  G01J5/089 ,  G01J5/20 ,  G01J2005/0077

摘要： A hand-held device having a housing and a processor disposed within the housing, includes a camera and a temperature sensing element having an adjustable field of view. The camera is configured to generate an image of an object and to permit the user to frame the image at a portion of the object to determine the temperature of the framed portion. The temperature sensing element includes a plurality of temperature sensors and the processor is configured to select ones of the plurality of sensors to produce a field of view (FOV) of the temperature sensing element that is less than or equal to the frame in the image. The selected sensors are activated to generate signals corresponding to the temperature of the object in the FOV and the processor is configured to determine a sensed temperature based on the sensor signals.

公开(公告)号：EP2972158A1

公开(公告)日：2016-01-20

申请号：EP13814287.2

申请日：2013-11-27

申请人： Robert Bosch GmbH

发明人： SAMARAO, Ashwin, K. ,  O'BRIEN, Gary ,  FEYH, Ando ,  PURKL, Fabian ,  YAMA, Gary

IPC分类号： G01J5/04 ,  G01J5/08 ,  G01J5/02 ,  G01J5/10 ,  G01J5/20

CPC分类号： H01L31/18 ,  G01J5/024 ,  G01J5/045 ,  G01J5/0815 ,  G01J5/0837 ,  G01J5/0856 ,  G01J5/10 ,  G01J5/20

摘要： A method of fabricating a semiconductor device includes forming an absorber on a substrate, and supporting a cap layer over the substrate to define a cavity between the substrate and the cap layer in which the absorber is located. The method further includes forming a lens layer on the cap layer. The lens layer is spaced apart from the cavity and defines a plurality of grooves and an opening located over the absorber.

公开(公告)号：EP2972157A1

公开(公告)日：2016-01-20

申请号：EP14772989.1

申请日：2014-03-12

申请人： Robert Bosch GmbH

发明人： FEYH, Ando ,  CHEN, Po-jui ,  YAMA, Gary ,  PURKL, Fabian

IPC分类号： G01J5/00 ,  G01K1/16 ,  G01K11/00 ,  G06T11/00 ,  B81B7/02

CPC分类号： G01K13/00 ,  G01J5/0205 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/0806 ,  G01J5/0859 ,  G01J5/089 ,  G01J5/20 ,  G01J2005/0077 ,  G01K1/02 ,  G01K2211/00 ,  G01K2213/00

摘要： In one embodiment, a portable temperature sensing system includes a portable housing configured to be carried by a user, a micro electrical mechanical system (MEMS) thermal sensor assembly supported by the housing and including an array of thermal sensor elements, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, determine an average sensed temperature based upon the signals, and render data associated with the determined average sensed temperature.

摘要翻译： 在一个实施例中，便携式温度感测系统包括被配置为由用户携带的便携式外壳，由外壳支撑并包括热传感器元件阵列的微型电子机械系统（MEMS）热传感器组件，包括程序指令 以及处理器，其可操作地连接到所述存储器和所述传感器，并且被配置为执行所述程序指令以从所述热传感器元件阵列的所选择的一组热传感器元件中的每一个获得信号，基于所述 信号并呈现与所确定的平均感测温度相关联的数据。

公开(公告)号：EP2971229A1

公开(公告)日：2016-01-20

申请号：EP14770096.7

申请日：2014-03-08

申请人： Robert Bosch GmbH ,  Purkl, Fabian ,  Provine, John ,  Yama, Gary ,  Feyh, Ando ,  O'Brien, Gary

发明人： PURKL, Fabian ,  PROVINE, John ,  YAMA, Gary ,  FEYH, Ando ,  O'BRIEN, Gary

IPC分类号： C23C16/44 ,  C23C16/448

CPC分类号： C23C16/45529 ,  Y10T428/24851

摘要： A metamaterial includes a first continuous layer formed with a first material by atomic layer deposition (ALD), a first non-continuous layer formed with a second material by ALD on first upper surface portions of a first upper surface of the first continuous layer, and a second continuous layer formed with the first material by ALD on second upper surface portions of the first upper surface of the first continuous layer and on a second upper surface of the first non-continuous layer.

摘要翻译： 超材料包括通过原子层沉积（ALD）形成的第一材料的第一连续层，在第一连续层的第一上表面的第一上表面上由ALD形成的第二材料的第一非连续层，以及 在所述第一连续层的第一上表面的第二上表面部分上以及在所述第一非连续层的第二上表面上由所述第一材料形成的第二连续层。

公开(公告)号：EP2946182A2

公开(公告)日：2015-11-25

申请号：EP13870385.5

申请日：2013-12-18

申请人： Robert Bosch GmbH

发明人： PURKL, Fabian ,  YAMA, Gary ,  FEYH, Ando

IPC分类号： G01J5/20 ,  G01J5/08

CPC分类号： H01L31/101 ,  G01J5/0853 ,  G01J5/20 ,  H01L31/02327

摘要： A semiconductor device includes a substrate having an upper surface that defines a sensing region. A fixed beam structure is supported at a first level above the sensing region. The fixed beam structure includes fixed beam supports that extend upwardly from the upper surface of the substrate to position the fixed beam structure at the first level above the sensing region. An absorber structure is supported above the fixed beam structure at a second level above the sensing region. The absorber structure includes a pillar support that extends upwardly from the fixed beam structure to position the absorber structure at the second level above the sensing region.

公开(公告)号：EP2909591A1

公开(公告)日：2015-08-26

申请号：EP13786040.9

申请日：2013-10-16

申请人： Robert Bosch GmbH ,  Feyh, Ando, Lars ,  Chen, Po-Jui ,  Purkl, Fabian ,  Yama, Gary ,  O'Brien, Gary

发明人： FEYH, Ando Lars ,  CHEN, Po-Jui ,  PURKL, Fabian ,  YAMA, Gary ,  O'BRIEN, Gary

IPC分类号： G01J5/02 ,  G01J5/10 ,  G01J5/20 ,  G01J5/08

CPC分类号： H01L31/09 ,  G01J5/024 ,  G01J5/0853 ,  G01J5/10 ,  G01J5/20 ,  H01L37/02

摘要： A semiconductor device includes a substrate, suspension structures extending from the upper surface of the substrate, and an absorber stack attached to the substrate by the suspension structures. The suspension structures suspend the absorber stack over the substrate such that a gap is defined between the absorber stack and the substrate. The absorber stack includes a plurality of metallization layers interleaved with a plurality of insulating layers. At least one of the metallization layers has a thickness of approximately 10nm or less.

公开(公告)号：EP2697159A1

公开(公告)日：2014-02-19

申请号：EP12721622.4

申请日：2012-04-13

申请人： Robert Bosch GmbH

发明人： GRAHAM, Andrew, B. ,  YAMA, Gary ,  O'BRIEN, Gary

IPC分类号： B81C1/00

CPC分类号： B81B3/0021 ,  B81B2207/095 ,  B81C1/00301

摘要： In one embodiment, a method of forming an out-of-plane electrode includes providing an oxide layer above an upper surface of a device layer, providing a first cap layer portion above an upper surface of the oxide layer, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the first material portion, vapor releasing a portion of the oxide layer, depositing a third cap layer portion above the second cap layer portion, etching a second electrode perimeter defining trench extending through the second cap layer portion and the third cap layer portion, and depositing a second material portion within the second electrode perimeter defining trench, such that a spacer including the first material portion and the second material portion define out-of-plane electrode.

摘要翻译： 在一个实施例中，形成平面外电极的方法包括在器件层的上表面上方提供氧化物层，在氧化物层的上表面之上提供第一帽层部分，蚀刻限定 沟槽延伸穿过第一盖层部分并停止在氧化物层处，在第一电极周界限定沟槽内沉积第一材料部分，在第一材料部分上方沉积第二帽层部分，释放氧化物层的一部分， 在所述第二盖层部分上方的第三盖层部分，蚀刻延伸穿过所述第二盖层部分和所述第三盖层部分的第二电极周界限定沟槽，以及在所述第二电极周界限定沟槽内沉积第二材料部分， 包括第一材料部分和第二材料部分的间隔件限定了平面外的电极。