公开(公告)号：EP2971229A1

公开(公告)日：2016-01-20

申请号：EP14770096.7

申请日：2014-03-08

申请人： Robert Bosch GmbH ,  Purkl, Fabian ,  Provine, John ,  Yama, Gary ,  Feyh, Ando ,  O'Brien, Gary

发明人： PURKL, Fabian ,  PROVINE, John ,  YAMA, Gary ,  FEYH, Ando ,  O'BRIEN, Gary

IPC分类号： C23C16/44 ,  C23C16/448

CPC分类号： C23C16/45529 ,  Y10T428/24851

摘要： A metamaterial includes a first continuous layer formed with a first material by atomic layer deposition (ALD), a first non-continuous layer formed with a second material by ALD on first upper surface portions of a first upper surface of the first continuous layer, and a second continuous layer formed with the first material by ALD on second upper surface portions of the first upper surface of the first continuous layer and on a second upper surface of the first non-continuous layer.

摘要翻译： 超材料包括通过原子层沉积（ALD）形成的第一材料的第一连续层，在第一连续层的第一上表面的第一上表面上由ALD形成的第二材料的第一非连续层，以及 在所述第一连续层的第一上表面的第二上表面部分上以及在所述第一非连续层的第二上表面上由所述第一材料形成的第二连续层。

公开(公告)号：EP2938979A1

公开(公告)日：2015-11-04

申请号：EP13821755.9

申请日：2013-12-20

申请人： Robert Bosch GmbH ,  Samarao, Ashwin ,  O'Brien, Gary ,  Feyh, Ando ,  Yama, Gary ,  Purkl, Fabian

发明人： SAMARAO, Ashwin ,  O'BRIEN, Gary ,  FEYH, Ando ,  YAMA, Gary ,  PURKL, Fabian

IPC分类号： G01J5/08 ,  G01J5/02 ,  G01J5/20 ,  G01J5/00

CPC分类号： G01J5/0815 ,  G01J5/025 ,  G01J5/0806 ,  G01J5/20 ,  G01J2005/0077

摘要： A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.

公开(公告)号：EP2986959A1

公开(公告)日：2016-02-24

申请号：EP13821342.6

申请日：2013-12-20

申请人： Robert Bosch GmbH ,  Purkl, Fabian ,  Yama, Gary ,  Feyh, Ando ,  Graham, Andrew ,  Samarao, Ashwin ,  O'Brien, Gary

发明人： PURKL, Fabian ,  YAMA, Gary ,  FEYH, Ando ,  GRAHAM, Andrew ,  SAMARAO, Ashwin ,  O'BRIEN, Gary

IPC分类号： G01J5/04 ,  G01J5/20

CPC分类号： H01L31/0203 ,  G01J5/045 ,  G01J5/20 ,  H01L31/09 ,  H01L31/18

摘要： A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity.

公开(公告)号：EP2909591A1

公开(公告)日：2015-08-26

申请号：EP13786040.9

申请日：2013-10-16

申请人： Robert Bosch GmbH ,  Feyh, Ando, Lars ,  Chen, Po-Jui ,  Purkl, Fabian ,  Yama, Gary ,  O'Brien, Gary

发明人： FEYH, Ando Lars ,  CHEN, Po-Jui ,  PURKL, Fabian ,  YAMA, Gary ,  O'BRIEN, Gary

IPC分类号： G01J5/02 ,  G01J5/10 ,  G01J5/20 ,  G01J5/08

CPC分类号： H01L31/09 ,  G01J5/024 ,  G01J5/0853 ,  G01J5/10 ,  G01J5/20 ,  H01L37/02

摘要： A semiconductor device includes a substrate, suspension structures extending from the upper surface of the substrate, and an absorber stack attached to the substrate by the suspension structures. The suspension structures suspend the absorber stack over the substrate such that a gap is defined between the absorber stack and the substrate. The absorber stack includes a plurality of metallization layers interleaved with a plurality of insulating layers. At least one of the metallization layers has a thickness of approximately 10nm or less.

公开(公告)号：EP2822892A2

公开(公告)日：2015-01-14

申请号：EP13711519.2

申请日：2013-03-08

申请人： Robert Bosch GmbH ,  Yama, Gary ,  Purkl, Fabian ,  Liger, Matthieu ,  Illing, Matthias

发明人： YAMA, Gary ,  PURKL, Fabian ,  LIGER, Matthieu ,  ILLING, Matthias

IPC分类号： B81C1/00 ,  G01J5/02 ,  G01J5/20 ,  H01L27/146 ,  B81B3/00

CPC分类号： B81C1/00039 ,  B81B3/007 ,  B81B2201/0207 ,  B81B2203/0307 ,  B81C2201/0181 ,  G01J5/023 ,  H01L27/14649 ,  H01L27/14683

摘要： In one embodiment, a method of forming a semiconductor device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a first trench in the sacrificial layer, forming a first sidewall layer with a thickness of less than about 50 nm on a first sidewall of the first trench using atomic layer deposition (ALD), and removing the sacrificial layer.

公开(公告)号：EP2822892B1

公开(公告)日：2019-06-19

申请号：EP13711519.2

申请日：2013-03-08

申请人： Robert Bosch GmbH ,  Yama, Gary ,  Purkl, Fabian ,  Liger, Matthieu ,  Illing, Matthias

发明人： YAMA, Gary ,  PURKL, Fabian ,  LIGER, Matthieu ,  ILLING, Matthias

IPC分类号： B81C1/00 ,  G01J5/02 ,  G01J5/20 ,  H01L27/146 ,  B81B3/00

公开(公告)号：EP3077804A1

公开(公告)日：2016-10-12

申请号：EP14806252.4

申请日：2014-12-02

申请人： Robert Bosch GmbH

发明人： SAMARAO, Ashwin ,  FEYH, Ando ,  OBRIEN, Gary ,  YAMA, Gary ,  PURKL, Fabian

IPC分类号： G01N27/12

CPC分类号： G01N27/028 ,  G01N27/12 ,  G01N33/0062

摘要： A semiconductor gas sensor device includes a substrate, a conductive layer supported by the substrate, a non-suitable seed layer, and a porous gas sensing layer portion. The non-suitable seed layer is formed from a first material and includes a first support portion supported by the conductive layer, a second support portion supported by the conductive layer, and a suspended seed portion extending from the first support portion to the second support portion and suspended above the conductive layer. The porous gas sensing layer portion is formed from a second material and is supported directly by the non-suitable seed layer in electrical communication with the conductive layer. The first material and the second material form a non-suitable pair of materials.

摘要翻译： 半导体气体传感器装置包括衬底，由衬底支撑的导电层，非合适的晶种层和多孔气体感测层部分。 非合适种子层由第一材料形成，并且包括由导电层支撑的第一支撑部分，由导电层支撑的第二支撑部分和从第一支撑部分延伸到第二支撑部分的悬挂种子部分 并悬浮在导电层上方。 所述多孔气体感测层部分由第二材料形成，并且由与所述导电层电连通的所述非合适晶种层直接支撑。 第一材料和第二材料形成非合适的材料对。

公开(公告)号：EP3063791A1

公开(公告)日：2016-09-07

申请号：EP14856905.6

申请日：2014-10-30

申请人： Robert Bosch GmbH

发明人： SAMARAO, Ashwin, K. ,  O'BRIEN, Gary ,  FEYH, Ando ,  PURKL, Fabian ,  YAMA, Gary

IPC分类号： H01L27/14 ,  H01L29/94 ,  H01L21/205

CPC分类号： G01N27/227 ,  G01N27/125 ,  G01N27/16

摘要： A semiconductor sensor device includes a substrate, a non-suitable seed layer located above the substrate, at least one electrode located above the non-suitable seed layer, and a porous sensing layer supported directly by the non-suitable seed layer and in electrical communication with the at least one electrode, the porous sensing layer defining a plurality of grain boundaries formed by spaced-apart nucleation on the non-suitable seed layer using atomic layer deposition.

摘要翻译： 一种半导体传感器装置包括衬底，位于衬底上方的不合适种子层，位于不合适种子层上方的至少一个电极以及直接由非合适种子层支撑并且电连通的多孔传感层 利用所述至少一个电极，所述多孔传感层使用原子层沉积在所述不合适的种子层上限定通过间隔成核形成的多个晶界。

公开(公告)号：EP2981816A1

公开(公告)日：2016-02-10

申请号：EP13821336.8

申请日：2013-12-20

申请人： Robert Bosch GmbH

发明人： FEYH, Ando ,  O'BRIEN, Gary ,  PURKL, Fabian ,  YAMA, Gary ,  SAMARAO, Ashwin

IPC分类号： G01N27/414

CPC分类号： H01L21/28008 ,  G01N27/4146 ,  H01L29/4238

摘要： A method of fabricating a semiconductor sensor device includes providing a substrate, supporting a source region and a drain region with the substrate, forming an insulator layer above the source region and the drain region, and forming a porous metallic gate region above the insulator layer using plasma enhanced atomic layer deposition (PEALD).

公开(公告)号：EP3230702B1

公开(公告)日：2020-03-04

申请号：EP15866993.7

申请日：2015-12-10

申请人： Robert Bosch GmbH

发明人： SAMARAO, Ashwin, K. ,  O'BRIEN, Gary ,  FEYH, Ando ,  PURKL, Fabian ,  YAMA, Gary

IPC分类号： G01J5/20 ,  G01J5/02 ,  G01J5/08 ,  H01L31/101 ,  H01L31/02 ,  H01L31/0224 ,  H01L27/146 ,  H01L31/11