公开(公告)号：EP2013531A2

公开(公告)日：2009-01-14

申请号：EP07755817.9

申请日：2007-04-19

申请人： Underwater Kinetics, LLP

发明人： GIUNTOLI, David, M. ,  GUNDERSON, Richard, H. ,  FISCHER, Elmer, Frederick ,  UKE, Alan, K.

IPC分类号： F21L13/00

CPC分类号： F21V23/0414 ,  F21L4/027 ,  F21V29/508 ,  F21V29/70 ,  F21Y2115/10

摘要： Methods and devices are described that use one op more thermally responsive current- controlling elements to regulate current flow to an electrical component, particularly a light source such as an LED, Examples of such thermally responsive current-controlling elements include thermistors, inductors, and capacitors.

公开(公告)号：EP3044497B1

公开(公告)日：2018-04-11

申请号：EP14752612.3

申请日：2014-08-14

申请人： Philips Lighting Holding B.V.

发明人： XIONG, Yan ,  JIANG, Qingqing

IPC分类号： F21V23/00 ,  F21V29/00 ,  F21K9/23 ,  F21Y115/10

CPC分类号： F21V29/83 ,  F21K9/23 ,  F21V23/006 ,  F21V29/503 ,  F21V29/506 ,  F21V29/508 ,  F21Y2101/00 ,  F21Y2115/10

摘要： A lighting device or a lamp bulb (100, 200) comprises at least one light source (101) and a driver assembly (108), said driver assembly comprising driver electronics; wherein during operation of the light source, a distance between an optical axis (120) of the lighting device and a heat flow of the lighting device is less than a distance between the optical axis (120) and a component of the driver electronics having the highest temperature sensitivity.

公开(公告)号：EP2997296B1

公开(公告)日：2018-02-21

申请号：EP14725340.5

申请日：2014-04-18

申请人： Osram Sylvania Inc.

发明人： ZOLOTYKH, Valeriy ,  JESWANI, Anil ,  DUTTA, Arunava

IPC分类号： F21K9/233 ,  F21K9/237 ,  F21V29/83 ,  F21Y115/10

CPC分类号： F21V29/70 ,  F21K9/23 ,  F21K9/237 ,  F21V23/007 ,  F21V29/507 ,  F21V29/508 ,  F21V29/713 ,  F21V29/83 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10

摘要： A lighting device including one or more solid state light sources providing air cooling of the electronic driver is disclosed. The driver receives power and provides it to the light source(s). The device also includes a first and a second housing. The first housing contains, at least in part, the driver, and includes a support having an exterior and an interior, that provides mechanical support to the second housing connected thereto. The interior includes a first opening. The second housing is a heat sink for the device. The second housing has an interior portion, with a second opening corresponding to the first opening, and an exterior portion, having a plurality of external openings. Air entering an external opening is able to mix with air in the first housing by flowing through the first opening and the corresponding second opening, which cools the electronic driver.

公开(公告)号：EP2663806B1

公开(公告)日：2018-01-03

申请号：EP12703883.4

申请日：2012-01-11

申请人： Philips Lighting Holding B.V.

发明人： TER WEEME, Berend, Jan, Willem ,  VAN DE MOESDIJK, Remco, Yuri ,  VAN DEN BOSCH, Marcus, Joannes ,  XIONG, Yan ,  DUAN, Xiaoqing

IPC分类号： F21V29/71 ,  F21V29/00 ,  F21V3/02 ,  F21V29/15 ,  F21V29/505 ,  F21V29/506 ,  F21V29/77 ,  F21V29/83 ,  F21V29/503 ,  F21V29/508 ,  F21K9/232 ,  F21Y103/33 ,  F21Y115/10

CPC分类号： F21V29/505 ,  F21K9/232 ,  F21V3/02 ,  F21V29/004 ,  F21V29/15 ,  F21V29/503 ,  F21V29/506 ,  F21V29/508 ,  F21V29/71 ,  F21V29/713 ,  F21V29/717 ,  F21V29/77 ,  F21V29/773 ,  F21V29/83 ,  F21Y2103/33 ,  F21Y2115/10 ,  Y02B20/30

摘要： There is provided a lighting device 100 comprising a light source, a driver arranged for powering the light source, which is separated in space from the light source. The lighting device has two separate heat sinks, a light source heat sink 112 to which the light source is thermally coupled, and a driver heat sink 115 to which the driver is thermally coupled. The light source heat sink and the driver heat sink are separated by an air gap 114 to provide thermal decoupling of the light source heat sink and the driver heat sink.

公开(公告)号：EP3253620A1

公开(公告)日：2017-12-13

申请号：EP16706985.5

申请日：2016-02-05

申请人： Valeo Vision

发明人： ZOJCESKI, Zdravko ,  DUARTE, Marc

IPC分类号： B60Q1/00 ,  H01L33/62 ,  F21V23/00 ,  F21S8/10 ,  H01R43/16 ,  H05K3/20

CPC分类号： F21V23/06 ,  B60Q1/0094 ,  F21S41/141 ,  F21S41/192 ,  F21S45/47 ,  F21V23/006 ,  F21V29/508 ,  F21V29/713 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/62 ,  H01R4/023 ,  H01R4/183 ,  H05K1/0209 ,  H05K1/117 ,  H05K7/20409 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10287

摘要： The invention relates to an electrical connection device (100) for at least one light source having an electrical power supply device. The device (100) is used, in particular, in a light device for a motor vehicle and enables the placing of light sources at a distance from the connection element (110, 120, 130), which can in turn be placed at a distance from an electrical power supply device for the light sources. The connection device allows great freedom of location for light sources with respect to the device, since the device provides only little shadow on the light sources while ensuring good dissipation of the heat produced by same.

公开(公告)号：EP3211967A4

公开(公告)日：2017-11-15

申请号：EP16752260

申请日：2016-01-29

申请人： KANEKA CORP

发明人： SAIKI HIDEMARO ,  NISHIKAWA AKIRA

IPC分类号： H05B33/06 ,  F21S8/00 ,  F21V15/01 ,  F21V19/00 ,  F21V23/00 ,  F21V29/83 ,  F21Y105/00 ,  F21Y115/15 ,  H01L51/50

CPC分类号： H01L27/32 ,  F21S2/005 ,  F21S8/03 ,  F21V15/01 ,  F21V19/004 ,  F21V23/001 ,  F21V23/005 ,  F21V29/508 ,  F21V29/83 ,  F21Y2105/00 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L51/5221 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/529 ,  H01L2251/5361

摘要： To provide, in a simple and cost-effective manner, a planar light-emitting module with reduced thickness as a whole, with its substrate end ensuring shock resistance and low risk of injury, and being excellent in transferring and dissipating heat. A light-emitting module 100 of the present invention includes: a bezel 8 having a leg part 84 having an inner height H; a planar light-emitting tile 120; and a printed circuit board 71 having a plurality of heat dissipating through holes 201. A heat dissipating interval 110 is provided between the printed circuit board 71 and the mounted surface. The printed circuit board 71 includes a tile-side main surface being a soaking metal layer including through hole openings.

公开(公告)号：EP2836761B1

公开(公告)日：2017-09-13

申请号：EP13716071.9

申请日：2013-03-28

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： SEKI, Katsushi

IPC分类号： F21V19/00 ,  F21S8/02 ,  F21V17/00 ,  F21Y101/00 ,  F21Y115/10

CPC分类号： F21V19/0055 ,  F21S8/02 ,  F21V17/005 ,  F21V19/0035 ,  F21V19/004 ,  F21V29/508 ,  F21Y2115/10

摘要： A lamp that emits light and includes: a mounting board on which a light-emitting element is provided; a support disposed on a side opposite a light-emission-side of the mounting board; and a case connected to a support. The case includes a securing part which is disposed on the light-emission-side of the mounting board, and secures the mounting board to the support by sandwiching the mounting board between the securing part and the support.

摘要翻译： 一种发光的灯具，其特征在于，具有：安装基板，其上设置有发光元件; 布置在安装板的与发光侧相对的一侧上的支撑件; 以及连接到支架的壳体。 壳体包括设置在安装板的光发射侧上的固定部分，并且通过将安装板夹在固定部分和支撑件之间而将安装板固定到支撑件。

公开(公告)号：EP3167224A1

公开(公告)日：2017-05-17

申请号：EP15721647.4

申请日：2015-04-29

申请人： OSRAM GmbH

发明人： WENG, Thomas ,  RINGLER, Stefan ,  KLAFTA, Thomas ,  AUERNHAMMER, Marianne

IPC分类号： F21K99/00 ,  F21V23/00 ,  F21V29/508 ,  F21V29/83 ,  F21V29/87 ,  F21Y101/00

CPC分类号： F21K9/237 ,  F21K9/232 ,  F21K9/233 ,  F21K9/238 ,  F21K9/69 ,  F21V5/004 ,  F21V5/04 ,  F21V17/10 ,  F21V17/101 ,  F21V23/005 ,  F21V23/06 ,  F21V29/508 ,  F21V29/70 ,  F21V29/83 ,  F21V29/87 ,  F21Y2115/10

摘要： A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.

摘要翻译： 半导体灯（1）具有布置在基板（6）的正面（7）上的至少一个半导体光源（8）和用于激活至少一个半导体光源（8）的驱动器电路（11） 所述驱动电路（11）的至少一部分固定在所述衬底（6）的背离所述至少一个半导体光源（8）的背面（10）上。 本发明尤其可用于改型灯，特别是白炽灯或卤素改型灯。

公开(公告)号：EP3040610A1

公开(公告)日：2016-07-06

申请号：EP14840378.5

申请日：2014-08-26

申请人： KMW Inc.

发明人： KIM, Duk-Yong

IPC分类号： F21V17/00 ,  F21V29/00 ,  F21V5/04

CPC分类号： F21S8/085 ,  F21K9/60 ,  F21S8/086 ,  F21V15/01 ,  F21V23/002 ,  F21V23/009 ,  F21V23/023 ,  F21V23/026 ,  F21V27/02 ,  F21V29/508 ,  F21W2111/02 ,  F21W2131/103 ,  F21Y2115/10

摘要： The present invention relates to an LED streetlamp comprising: an integral housing having a light-emitting opening from which light is emitted at a bottom surface thereof and provided with an accommodation space at an inner side thereof; a power supply unit inserted into and fixed to the accommodation space through the light-emitting opening of the housing; a reflecting part inserted into and fixed to the accommodation space through the light-emitting opening of the housing to separate one part of the accommodation space at which the power supply unit is located from the accommodation space of the lower part of the one part, and reflecting light from a bottom surface thereof; a substrate for supplying power to multiple LEDs provided by being coupled and fixed to an inner side surface of the housing of a lower side of the reflecting part; and a cover part for covering the light-emitting opening of the housing. The present invention manufactures a case with a single structure and provides parts such as the power supply unit, the substrate having the LEDs provided thereon, and the reflecting plate so as to be assembled in the case through the light emitting opening, thereby minimizing a manufacturing cost, and thus speeding up commercialization of LED lamps.

公开(公告)号：EP3026324A2

公开(公告)日：2016-06-01

申请号：EP15195180.3

申请日：2015-11-18

申请人： Kabushiki Kaisha Toshiba

发明人： Kato, Mitsuaki ,  Hayashihara, Hiromichi ,  Ohno, Hiroshi ,  Takamatsu, Tomonao

IPC分类号： F21K99/00 ,  F21V29/83 ,  F21V7/04 ,  F21V29/70 ,  F21V29/508 ,  F21Y115/10

CPC分类号： G02B6/0085 ,  F21K9/20 ,  F21K9/61 ,  F21S8/026 ,  F21V5/00 ,  F21V7/041 ,  F21V29/508 ,  F21V29/70 ,  F21V29/773 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0046 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0088

摘要： A lighting device (100, 100A) according to one embodiment includes a light guide member (11), at least one light source (40) and a substrate (41) on which the light source (40) is mounted. The light guide member (11) includes a first surface (11a) facing an outside of the lighting device (100, 100A), a second surface (11b) opposite to the first surface (11a), and a side surface (11c) extending from an end of the first surface (11a) to an end of the second surface (11b). The light guide member (11) also includes a diffusion portion (12). The light source (40) faces a side surface (11c) of the light guide member (11). The casing (10) includes a thermal dissipation portion (51, 52) formed of a metal and extending along the second surface (11b) of the light guide member (11). The casing (10) supports the substrate (41) and is thermally connected to the light source (40).

摘要翻译： 根据一个实施例的照明装置（100,100A）包括光导构件（11），至少一个光源（40）和光源（40）安装在其上的基板（41）。 导光部件（11）具有与照明装置（100,100A）的外侧相对的第一面（11a），与第一面（11a）相反侧的第二面（11b），和延伸设置的侧面（11c） 从第一表面（11a）的一端延伸到第二表面（11b）的一端。 导光部件（11）还包括扩散部（12）。 光源（40）与导光部件（11）的侧面（11c）相对。 壳体（10）包括由金属形成并且沿着导光构件（11）的第二表面（11b）延伸的散热部（51,52）。 壳体（10）支撑基板（41）并且热连接到光源（40）。