公开(公告)号：EP1637554A1

公开(公告)日：2006-03-22

申请号：EP03733281.4

申请日：2003-06-03

申请人： MATSUSHITA ELECTRIC WORKS, LTD.

发明人： MOTOBE, Hidetsugu c/o Matsushita Elec. Works, Ltd. ,  HIBINO, Akinori c/o Matsushita Electric Works, Ltd ,  ITO, Katsuhiko c/o Matsushita Electric Works, Ltd.

IPC分类号： C08G59/22 ,  C08G59/62 ,  C08J5/24 ,  H05K1/03 ,  H05K3/46

CPC分类号： C08G59/621 ,  C08G59/063 ,  C08G59/226 ,  C08G59/30 ,  C08G59/38 ,  C08G59/686 ,  H05K1/0326 ,  Y10T428/31511 ,  Y10T442/2713

摘要： An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolac, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the epoxy (a) is a brominated epoxy resin which is obtained by reacting/mixing a bisphenol A epoxy resin with tetrabromobisphenol A and has an epoxy equivalent of 350 to 470 g/eq and an n=0 component content of 20 to 35% in terms of areal percentage in a GPC chart, and the epoxy (b) is at least one bifunctional epoxy resin which is obtained by reacting any one selected from the group consisting of bisphenol A, bisphenol F, and tetrabromobisphenol A with epichlorohydrin and has an n=0 component content as determined from a GPC chart of 60% or higher.

摘要翻译： 一种环氧树脂组合物，其用于制备外观，阻燃性等优异的印刷线路板用预浸料，其包含环氧树脂，酚醛清漆和固化促进剂。 其特征在于环氧树脂包括环氧树脂（a）和环氧树脂（b），其中环氧（a）是通过使双酚A环氧树脂与四溴双酚A反应/混合获得的溴化环氧树脂，并且具有 环氧当量为350〜470g / eq，n = 0成分含量在GPC图中以面积百分数计为20〜35％，环氧（b）为至少一种双官能环氧树脂，其通过使任何 一种选自双酚A，双酚F和四溴双酚A与表氯醇，并且由GPC图表确定的n = 0组分含量为60％以上。

公开(公告)号：EP1141071B1

公开(公告)日：2005-09-14

申请号：EP99950127.3

申请日：1999-09-30

申请人： 3M Innovative Properties Company

发明人： TARBUTTON, Kent, S. ,  ROBINS, Janis ,  HORVATH, Daniel, J.

IPC分类号： C08G59/06 ,  C08G59/68 ,  C08L63/00 ,  C09J163/00

CPC分类号： C08G59/686 ,  C08G59/182 ,  C08L2666/04 ,  C09J163/00

摘要： A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.

公开(公告)号：EP0806445B1

公开(公告)日：2003-08-13

申请号：EP97303004.2

申请日：1997-05-01

申请人： MORTON INTERNATIONAL, INC.

发明人： Correll, Glenn D. ,  Kozlowski, Joseph J. ,  Daly, Andres T. ,  Haly, Richard P. ,  Muthiah, Jeno ,  Reinheimer, Eugene P. ,  Horinka, Paul R.

IPC分类号： C08G59/18 ,  C09D163/00 ,  C09D5/03 ,  C08J3/24

CPC分类号： C08G59/182 ,  B05D1/06 ,  B05D3/0218 ,  B05D3/0227 ,  B05D3/0254 ,  B05D3/0263 ,  C08G59/18 ,  C08G59/184 ,  C08G59/50 ,  C08G59/686 ,  C09D5/03 ,  C09D163/00 ,  Y10T428/31511 ,  Y10T428/662

公开(公告)号：EP1279688A1

公开(公告)日：2003-01-29

申请号：EP02254964.6

申请日：2002-07-15

申请人： Toray Composites (America), Inc.

发明人： Li, Wei (Helen) ,  Miwa, Kishio

IPC分类号： C08G59/00 ,  C08L63/04 ,  C08G59/44 ,  C08G59/40

CPC分类号： C08G59/686 ,  C08G59/4021 ,  C08L63/00 ,  Y10T428/31511 ,  Y10T428/31525 ,  C08L2666/04

摘要： An epoxy composition includes an epoxy resin, a latent amine curing agent and a specific catalyst. Preferably, the epoxy resin includes two epoxide groups per molecule, and the latent amine curing agent is a dicyanopolyamide, most preferably, dicyandiamide. The specific catalyst is 2,4-toluene bis dimethyl urea. A prepreg employing the epoxy composition of the present invention can achieve a 95% cure in about one half of the time required by a prepreg that differs only in the catalyst employed. Furthermore, prepregs employing the epoxy composition of the present invention have glass transition temperatures higher than the curing temperatures when cured at a temperature range from about 80° C to about 150° C, enabling cured prepregs to be removed from molds without being cooled.

摘要翻译： 环氧组合物包括环氧树脂，潜胺胺固化剂和特定催化剂。 优选地，环氧树脂每分子包含两个环氧基团，潜胺胺固化剂是二氰基多胺，最优选双氰胺。 特定的催化剂是2,4-甲苯二甲基脲。 使用本发明的环氧组合物的预浸料可以在仅使催化剂不同的预浸料所需的时间的约一半的时间内达到95％的固化。 此外，使用本发明的环氧组合物的预浸料坯在约80℃至约150℃的温度范围内固化时具有高于固化温度的玻璃化转变温度，使得固化的预浸料坯能够从模具中除去而不被冷却。

公开(公告)号：EP1260532A1

公开(公告)日：2002-11-27

申请号：EP02253417.6

申请日：2002-05-15

申请人： Ajinomoto Co., Inc.

发明人： Koto, Hiroyasu, Ajinomoto Fine Techno Co., Inc. ,  Ohashi, Junji, Ajinomoto Fine Techno Co., Inc. ,  Sakamoto, Hiroshi, Ajinomoto Fine Techno Co., Ltd. ,  Kobayashi, Masato, Ajinomoto Fine Techno Co., Inc.

IPC分类号： C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08G59/56 ,  C08G59/62

CPC分类号： C08G59/686 ,  C08G59/18 ,  C08L63/00 ,  C08L2666/02

摘要： Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25°C.

摘要翻译： 提供一种提供具有改善的储存稳定性和低温固化性的环氧树脂组合物的潜在性固化剂; 和通过混合所述固化剂和环氧化合物制备的可固化环氧树脂组合物。 环氧树脂组合物具有改善的储存稳定性，并且在较低温度下固化较常规时间短。 环氧树脂的潜在性固化剂包含两种组分，（A）至少具有可聚合双键的单体的自由基聚合聚合物，其在分子中至少具有叔氨基，和（B）至少具有聚合物 分子中的羟基，并形成在25℃下为固体的固溶体。

公开(公告)号：EP1209211A1

公开(公告)日：2002-05-29

申请号：EP00937250.9

申请日：2000-06-15

申请人： Hitachi Chemical Company, Ltd.

发明人： TANAKA, Yuko ,  SHIMADA, Yasushi ,  INADA, Teiichi, Hitachi Ch. Matsushiro House B-108 ,  KURIYA, Hiroyuki ,  YAMAMOTO, Kazunori ,  KUMASHIRO, Yasushi ,  SUMIYA, Keiji

IPC分类号： C09J163/00 ,  C09J133/00 ,  C09J7/02 ,  H05K3/32 ,  H01L23/14 ,  H01L21/52

CPC分类号： H01L24/83 ,  C08G59/027 ,  C08G59/686 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/26 ,  C09J7/35 ,  C09J133/068 ,  C09J163/00 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/29298 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt.%, a glass transition temperature of -10°C or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

摘要翻译： （1）100重量份的环氧树脂及其固化剂，（2）75-300重量份的（甲基）丙烯酸缩水甘油酯单元含量为0.5-6重量％的环氧化丙烯酸类共聚物， ，玻璃化转变温度为-10℃或更高，重均分子量为100,000或更高，和（3）0.1至20重量份潜伏性固化促进剂; 具有一层粘合剂的粘合剂构件; 具有粘合构件的用于半导体安装的互连基板; 以及包含其的半导体器件。

公开(公告)号：EP1205504A1

公开(公告)日：2002-05-15

申请号：EP01309104.6

申请日：2001-10-26

申请人： ROHM AND HAAS COMPANY

发明人： Mcleish, Tabitha Lynn ,  Ruth, William George

IPC分类号： C08G59/40 ,  C08G59/68 ,  C09D163/00 ,  C09D5/03

CPC分类号： C08G59/686 ,  C08G59/4021 ,  C09D163/00 ,  Y10T428/31529 ,  C08L2666/04

摘要： A clear coat dicyandiamide cured epoxy powder coating for non-metallic substrates wherein the finish coat is visually haze-free as a result of the addition of a small amount of an aromatic substituted urea compound. Non-metallic substrates, such as brass, cannot withstand extremely high temperatures which are required to cure well known powder coatings. However, coating systems which cure at lower temperatures often produce a haze within the finish clear coat. The present invention alleviates this problem.

摘要翻译： 一种用于非金属基材的透明涂层双氰胺固化环氧粉末涂料，其中由于加入少量芳族取代的脲化合物，其中涂层目视无雾。 诸如黄铜的非金属基底不能承受固化众所周知的粉末涂料所需的极高温度。 然而，在较低温度下固化的涂层体系通常在清漆层内产生雾度。 本发明减轻了这个问题。

公开(公告)号：EP0669949B1

公开(公告)日：2002-03-13

申请号：EP93923804.4

申请日：1993-10-14

申请人： Cognis Corporation

发明人： MISKEL, John, J., Jr. ,  GRINSTEIN, Reuben, H. ,  FISCHER, Stephen, S.

IPC分类号： C08G59/68 ,  C08G59/66

CPC分类号： C08G59/686 ,  C08L63/00 ,  C08L2666/20

摘要： Curable systems for the preparation of polymeric products in which the curable system comprises an epoxy resin or an isocyanate, wherein the system contains a condensation reaction product of (a) a polyamine having only one primary amino group and only one tertiary amino group, and a non-cyclic backbone containing from 1 to 18 carbon atoms; and (b) at least one of urea, guanidine, guanylurea, thiourea, and a mono-N,N' alkyl substituted urea or thiourea having from 1 to 3 carbon atoms in the alkyl moieties.

公开(公告)号：EP0728789B1

公开(公告)日：2001-04-18

申请号：EP96200451.1

申请日：1996-02-22

申请人： MATSUSHITA ELECTRIC WORKS, LTD.

发明人： Nakamura, Yoshihiko ,  Matsumura, Masahiro ,  Iwamoto, Narimasa ,  Motobe, Hidetsugu ,  Hatta, Yukio

IPC分类号： C08G59/68 ,  C08G59/62

CPC分类号： C08G59/621 ,  C08G59/5086 ,  C08G59/686 ,  H05K1/0326

公开(公告)号：EP1049735A1

公开(公告)日：2000-11-08

申请号：EP99901405.3

申请日：1999-01-08

申请人： Alpha Metals, Inc.

发明人： GILLEO, Ken

IPC分类号： C08G59/68 ,  C08G59/42 ,  H01L21/58 ,  H01L21/56

CPC分类号： H01L24/83 ,  C08G59/42 ,  C08G59/686 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A two-stage accelerator for use in filled anhydride/epoxy systems is disclosed. In particular, the present invention makes use of a first accelerator to initiate curing of the epoxy while the filler becomes wetted, and a second, faster accelerator to complete the curing process.