公开(公告)号：EP0100509B1

公开(公告)日：1986-05-21

申请号：EP83107276.4

申请日：1983-07-25

Applicant: BASF Aktiengesellschaft

Inventor： Naarmann, Herbert, Dr. ,  Simak, Petr, Dr. ,  Koehler, Gernot, Dr.

IPC: H01B1/12

CPC classification number: C07C255/00 ,  C07C57/42 ,  C08L101/00 ,  C08L2201/04 ,  H01B1/128 ,  H01M4/60 ,  C08L2666/14

公开(公告)号：EP2374844B1

公开(公告)日：2018-12-05

申请号：EP11305400.1

申请日：2011-04-06

Applicant: CENTRE NATIONAL D'ETUDES SPATIALES

Inventor： Remaury, Stéphanie ,  Nabarra, Pascale ,  Guillaumon, Olivier ,  Reymond, Serge

IPC: C08K3/22 ,  C08L83/04 ,  C09D183/04 ,  C09D183/06 ,  C09D5/24 ,  B64G1/22 ,  B64G1/54

CPC classification number: B64G1/226 ,  C08G77/16 ,  C08G77/18 ,  C08K3/22 ,  C08K5/5419 ,  C08K5/57 ,  C08L83/04 ,  C08L83/06 ,  C08L2201/04 ,  C08L2205/02 ,  C09D5/004 ,  C09D5/24 ,  C09D7/61 ,  C08L83/00

公开(公告)号：EP3228667A4

公开(公告)日：2018-08-01

申请号：EP15864321

申请日：2015-12-03

Applicant: KURARAY CO

Inventor： SAITOU YUUSUKE ,  SUZUKI TAKAHIRO ,  FUJI JUNICHI

IPC: C08L101/00 ,  C08K5/10 ,  C08L27/06 ,  H01B3/44 ,  H01B7/02

CPC classification number: H01B3/443 ,  C08K3/22 ,  C08K5/0016 ,  C08K5/10 ,  C08K2003/2296 ,  C08L23/16 ,  C08L23/286 ,  C08L27/06 ,  C08L101/00 ,  C08L2201/02 ,  C08L2201/04 ,  C08L2201/08 ,  C08L2203/202 ,  C08L2666/04 ,  H01B3/422 ,  H01B7/02

Abstract: [Problem] To provide an insulation material that has an excellent volume resistivity while retaining the balance among various capabilities including the mechanical strength, the heat resistance, the oil resistance, the bleed-out resistance, the plasticizer migration resistance, and the like, equivalent to a resin composition containing an ordinary phthalate ester. [Solution] An insulation material containing a resin composition containing: an ester (i) having one or more constitutional unit represented by the following formula (A) (wherein R 1 and R 2 each independently represent an alkyl group having from 1 to 4 carbon atoms); and a resin (ii).

公开(公告)号：EP3279264A1

公开(公告)日：2018-02-07

申请号：EP16772142.2

申请日：2016-03-08

Applicant: Adeka Corporation

Inventor： CUI Chun ,  NAKAMURA Tatsuhito ,  NOMURA Kazukiyo

IPC: C08L67/02 ,  C08K5/098 ,  C08K5/521 ,  C08L23/00 ,  C09K3/16

CPC classification number: C09K3/16 ,  C07F5/069 ,  C08G63/00 ,  C08G81/00 ,  C08K5/0075 ,  C08K5/098 ,  C08K5/521 ,  C08K5/527 ,  C08K5/56 ,  C08L23/00 ,  C08L23/02 ,  C08L67/02 ,  C08L2201/04

Abstract: Provided are: a resin additive composition capable of imparting excellent antistatic effect in a small amount, and an antistatic thermoplastic resin composition. The resin additive composition contains two or more selected from aromatic metal phosphates (H) represented by the following Formula (3) or (4) in an amount of 0.001 to 50 parts by mass with respect to 100 parts by mass of a polymer compound (E). The polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which contains at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds:

Abstract translation: 本发明提供一种能够赋予少量优异的防静电效果的树脂添加剂组合物和抗静电性热塑性树脂组合物。 相对于高分子化合物100质量份，树脂添加剂组合物含有选自下述式（3）或（4）所示的芳香族金属磷酸盐（H）中的2种以上0.001〜50质量份 E）。 高分子化合物（E）具有二醇，脂肪族二羧酸，芳香族二羧酸，含有至少一个下述式（1）所示的基团且两末端具有羟基的化合物（B）的结构 ，具有2个以上环氧基的环氧化合物（D）通过酯键结合的结构：

公开(公告)号：EP3184598A4

公开(公告)日：2018-01-24

申请号：EP15833531

申请日：2015-08-05

Applicant: ADEKA CORP

Inventor： NAKAMURA TATSUHITO ,  NOMURA KAZUKIYO

IPC: C09K3/16 ,  C08G63/668 ,  C08L67/00

CPC classification number: C09K3/16 ,  C08G63/199 ,  C08G63/668 ,  C08G63/672 ,  C08L55/02 ,  C08L67/00 ,  C08L2201/04

Abstract: Provided are: an antistatic agent and an antistatic agent composition which are capable of providing excellent antistatic effect in a small amount and have sufficient persistence and wiping resistance; and an antistatic resin composition and a molded article using the same. The antistatic agent includes a polymer compound (E) having a structure in which a diol, a dicarboxylic acid, a compound (B) which comprises at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and a polycarboxylic acid compound (D) are bound via ester bonds: €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CH 2 -CH 2 -O-€ƒ€ƒ€ƒ€ƒ€ƒ(1)

公开(公告)号：EP3227364A1

公开(公告)日：2017-10-11

申请号：EP15791123.1

申请日：2015-10-21

Applicant: Dow Global Technologies LLC

Inventor： LEANO, Mauricio E. ,  ELOWE, Paul R. ,  LEUGERS, Mary Anne ,  BHATTACHARJEE, Debkumar ,  PANGBURN, Todd O. ,  PETERSON, Bruce ,  TOYLI, Matthew

IPC: C08J7/04 ,  B32B27/08 ,  B32B27/32

CPC classification number: B32B27/08 ,  B32B7/02 ,  B32B7/10 ,  B32B7/12 ,  B32B9/048 ,  B32B25/08 ,  B32B27/06 ,  B32B27/16 ,  B32B27/20 ,  B32B27/28 ,  B32B27/32 ,  B32B27/327 ,  B32B2250/242 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/24 ,  B32B2255/26 ,  B32B2264/108 ,  B32B2270/00 ,  B32B2307/30 ,  B32B2307/40 ,  B32B2307/4026 ,  B32B2307/406 ,  B32B2307/418 ,  B32B2307/42 ,  B32B2307/51 ,  B32B2307/514 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/72 ,  B32B2307/732 ,  B32B2307/736 ,  B32B2307/75 ,  B32B2439/70 ,  C08J7/047 ,  C08J2323/06 ,  C08L23/08 ,  C08L2201/04 ,  C08L2201/08 ,  C09B23/0066 ,  C09B23/06 ,  C09B23/083 ,  C09B23/086 ,  C09B31/068

Abstract: A shrink film comprising a polyethylene-based film having a top surface, a bottom surface, and comprising one or more layers, wherein at least one layer of the polyethylene-based film comprises a low density polyethylene having a density of from 0.917 g/cc to 0.935 g/cc and melt index, I2, of from 0.1 g/10 min to 5 g/10 min, a linear low density polyethylene having a density of from 0.900 g/cc to 0.965 g/cc and melt index, I2, of from 0.05 g/10 min to 15 g/10 min, or combinations thereof, and optionally, a medium density polyethylene, a high density polyethylene, or combinations thereof, and a coating layer disposed on the top surface of the polyethylene-based film, wherein the coating layer comprises an adhesive and a near-infrared absorbent material.

Abstract translation: 一种收缩膜，其包含基于聚乙烯的膜，其具有顶表面，底表面并且包含一个或多个层，其中至少一层基于聚乙烯的膜包含密度为0.917g / cc 至0.935g / cc，熔体指数I2为0.1g / 10min至5g / 10min，密度为0.900g / cc至0.965g / cc的线性低密度聚乙烯和熔体指数I2， 为0.05g / 10min至15g / 10min，或其组合，并且任选地，中密度聚乙烯，高密度聚乙烯或其组合，以及设置在聚乙烯基膜的顶表面上的涂层 其中所述涂层包含粘合剂和近红外吸收材料。

公开(公告)号：EP2460859A4

公开(公告)日：2016-08-17

申请号：EP10804137

申请日：2010-07-30

Applicant: SANYO CHEMICAL IND LTD

Inventor： YABUTA TAKASHI ,  NODA HIDETOSHI ,  HATTORI MASANORI

IPC: C08L101/00 ,  C09K3/16

CPC classification number: C08K5/0075 ,  C08F255/06 ,  C08F290/04 ,  C08L51/04 ,  C08L71/126 ,  C08L101/12 ,  C08L2201/04 ,  Y10T428/24802 ,  C08F222/06 ,  C08L23/26 ,  C08L71/02

Abstract: An antistatic resin composition is provided, from which a thermoplastic resin molded article having a sufficient permanent antistatic property without impairing an excellent mechanical property or a good appearance of the molded article, even in a case that the content of an antistatic agent contained in the composition is less than that in a conventional composition, is provided. The antistatic resin composition contains an antistatic agent (A) and a thermoplastic resin (B)" in which a melt viscosity ratio of the thermoplastic resin (B) to the antistatic agent (A) at 220°C is 0.5-5 and an absolute value of a difference between solubility parameters (SPs) of the antistatic agent (A) and the thermoplastic resin (B) is 1.0-3.0. The antistatic resin molded article is obtained by molding the antistatic resin composition.

公开(公告)号：EP2690146A4

公开(公告)日：2014-08-20

申请号：EP12761389

申请日：2012-03-22

Applicant: SUMITOMO BAKELITE CO

Inventor： ISHIBA AKIHIRO ,  ISOBE MASATOSHI

IPC: C09J7/02 ,  H01L21/301 ,  H01L21/683

CPC classification number: H01L21/6836 ,  C08L23/10 ,  C08L2201/04 ,  C09J7/241 ,  C09J2203/326 ,  C09J2421/006 ,  C09J2423/106 ,  C09J2453/006 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/2852 ,  Y10T428/2878 ,  C08L23/04 ,  C08L23/16

Abstract: An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) (100) for processing a semiconductor wafer or the like includes a base layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on the base layer (200). The adhesive layer (300) contains a curing component that cures the adhesive layer (300). The base layer (200) is composed mainly of a resin. A polymer-type antistatic agent is kneaded into the resin. The polymer-type antistatic agent has an MFR, measured under measurement conditions of 190°C and 21.18 N in accordance with JIS K7210, of at least 10.0 g/10 min and not more than 15.0 g/10 min.

公开(公告)号：EP2759560A2

公开(公告)日：2014-07-30

申请号：EP14000048.0

申请日：2014-01-08

Applicant: Gifas Beteiligungen GmbH

Inventor： Szabang, Katrin ,  Gedan-Smolka, Michaela ,  Jurk, René

IPC: C08G63/685 ,  C08G63/52 ,  C08J3/00 ,  C08G81/02 ,  C08L13/00 ,  C08L15/00

CPC classification number: C08G63/6858 ,  C08G63/52 ,  C08J3/005 ,  C08J2300/26 ,  C08J2409/00 ,  C08J2467/06 ,  C08J2487/00 ,  C08L13/00 ,  C08L15/00 ,  C08L2201/04 ,  C08L67/06

Abstract: Die Erfindung betrifft polymergebundene Additive zur permanent antistatischen Ausrüstung von Elastomeren, die damit permanent antistatisch ausgerüsteten Elastomere, Verfahren zur Herstellung der permanent antistatisch ausgerüsteten Elastomere sowie von Bauteilen daraus für elektrotechnische und elektronische Anwendungen sowohl im Niederspannungsbereich als auch im Hochleistungs- bzw. Hochspannungsbereich. Ein besonders wichtiger Anwendungsbereich ist der Explosionsschutz.

Abstract translation: 本发明涉及一种用于其用于电气和电子应用的弹性体从而永久抗静电弹性体，用于产生永久抗静电弹性体过程中，和组件的永久的抗静电性能聚合物结合的添加剂，无论是在低电压区域和高性能或高电压范围。 一个特别重要的应用是爆炸。

公开(公告)号：EP2690146A1

公开(公告)日：2014-01-29

申请号：EP12761389.1

申请日：2012-03-22

Applicant: Sumitomo Bakelite Co., Ltd.

Inventor： ISHIBA Akihiro ,  ISOBE Masatoshi

IPC: C09J7/02 ,  H01L21/301

CPC classification number: H01L21/6836 ,  C08L23/10 ,  C08L2201/04 ,  C09J7/241 ,  C09J2203/326 ,  C09J2421/006 ,  C09J2423/106 ,  C09J2453/006 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/2852 ,  Y10T428/2878 ,  C08L23/04 ,  C08L23/16

Abstract: An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) (100) for processing a semiconductor wafer or the like includes a base layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on the base layer (200). The adhesive layer (300) contains a curing component that cures the adhesive layer (300). The base layer (200) is composed mainly of a resin. A polymer-type antistatic agent is kneaded into the resin. The polymer-type antistatic agent has an MFR, measured under measurement conditions of 190°C and 21.18 N in accordance with JIS K7210, of at least 10.0 g/10 min and not more than 15.0 g/10 min.

Abstract translation: 本发明的目的是提供一种能够稳定地抑制充电的半导体晶片等的加工用胶带。 用于处理半导体晶片等的胶带（切割带）（100）包括基层（200）和粘合剂层（300）。 粘合剂层（300）形成在基底层（200）上。 粘合剂层（300）含有固化粘合剂层（300）的固化成分。 基层（200）主要由树脂构成。 将聚合物型抗静电剂捏合到树脂中。 聚合物型抗静电剂的MFR在根据JIS K7210的190℃，21.18N的测定条件下测定为10.0g / 10分钟以上15.0g / 10分钟以下。