摘要:
A fluoroelastomer comprising 2 to 8% by mole of tetrafluoroethylene, 14 to 25% by mole of perfluoro(alkyl vinyl ether) and 70 to 85% by mole of vinylidene fluoride, sum total being 100% by mole, obtained by copolymerization in the presence of a bromine-containing monomer compound and an iodine and bromine-containing compound, has distinguished low temperature characteristics, solvent resistance and chemical resistance by itself.
摘要:
A fluorine-containing elastomer composition comprising a fluorine-containing elastomer having a cyano group as a cross-linking agent and a bisamidoxime compound represented by the following general formula as a vulcanizing agent: where n is an integer of 1 to 10, gives vulcanization products having a satisfactory compression set without any problem of processability such as roll kneadability, etc. during the kneading or during the vulcanization of the fluorine-containing elastomer having a cyano group as a cross-linkable group.
摘要:
A copolymer comprising an alkyl acrylate and an unsaturated ester compound represented by the following general formula:
CH 2 =CRCOO(CH 2 )nPhOR', (1)
CH 2 =CRCOO(CH 2 )nOCO(CH 2 )mPhOR', (2)
CH 2 =CHOCO(CH 2 )nOCO(CH 2 )mPhOR', (3)
CH 2 =CHO(CH 2 )nOCO(CH 2 )mPhOR' or (4)
CH 2 =CHPh(CH 2 )nOCO(CH 2 )mPhOR' (5)
where R is a hydrogen atom or a methyl group; R' is a hydrogen atom, an acyl group or a trialkylsilyl group; and Ph is a phenylene group, forms a blend rubber having a good heat resistance and a good amine resistance with a fluorine-containing elastomer.
摘要:
A fluorine-containing elastomer composition comprising a fluorine-containing elastomer having a cyano group as a cross-linkable group and a bisamidrazone compound represented by the following general formula as a vulcanizing agent: wherein
Rf is one of the following groups: (CF 2 )n, CFX(OCF 2 CFX)mO(CF 2 )n and CFX(OCF 2 CFX)pO(CF 2 )nO(CFXCF 2 O)qCFX has considerably improved roll kneadability and processability during the vulcanization-molding, and gives vulcanization products having good heat resistance and solvent resistance.
摘要:
2,2-bis(4-aminophenyl)hexafluoropropane is allowed to react with potassium thiocyanate and bromine to obtain 2,2-bis (5-amino-4,6-benzothiazolyl)hexafluoropropane, which is allowed to further react successively with potassium hydroxide and hydrochloric acid to obtain 2,2-bis(4-amino-3-mercaptophenyl)hexafluoropropane, which is a novel compound applicable as a curing agent for a fluorine-containing elastomer having CN groups as cross-linkable groups.
摘要:
A fluorine-containing elastomer composition, which comprises a terpolymer of tetrafluoroethylene, perfluoro(lower alkyl vinyl ether) and cyano group-containing (perfluorovinylether) represented by the following general formula:
CF₂=CF[OCF₂CF(CF₃)]nCN
, wherein n is an integer of 1 to 5, and a bis(aminophenyl) compound represented by the following general formula as a cross-linking agent:
, wherein A is, for example, an alkylidene group, and X and Y are a hydroxyl group or an amino group, can produce vulcanized products having a good heat resistance and good physical properties, and the bis(aminophenyl) compound has no problem as to its safety.
摘要:
2,2-diphenylhexafluoropropanes are prepared by condensation reaction of benzene or benzenes substituted with a halogen atom or atoms, a lower alkyl group or groups or a hydroxyl group or groups with hexafluoroacetone in the presence of trifluoromethane sulfonic acid. Among the 2,2-diphenylhexafluoropropanes, 2,2-diphenylhexafluoropropane and 2,2-bis(p-chlorophenyl)hexafluoropropane are novel compounds.
摘要:
A flexible circuit board for mounting IC has conductor bumps on the rear surface, and they penetrate the flexible circuit board to connect a circuit wiring pattern. The surfaces of the bumps can be coated with a bonding metal depending on the structure of the bumps. Bare IC chips are easily connected to the bumps of the circuit board by a thermal or ultrasonic bonding method. When such bumps or protrusions for bonding to IC pads are provided on the flexible circuit board, tiny holes are preferably formed in the insulating substrate by excimer laser means. The bumps are formed by plating means such as soldering or by a suitable treatment for filling the holes with an electrically conductive material. Further, the bumps should desirably be formed in a semi-spherical shape by the reflow treatment.