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71.发明公开PROCESS FOR THE MANUFACTURE OF MULTI-LAYER CIRCUITS WITH DYNAMIC FLEXING REGIONS AND THE FLEXIBLE CIRCUITS MADE THEREFROM 失效具有动态复位区域的多层电路的制造工艺及其制造的柔性电路
公开(公告)号：EP0372043A4
公开(公告)日：1991-09-04
申请号：EP89905932
申请日：1989-04-28
申请人： ROGERS CORPORATION
IPC分类号： C25D7/00 , H05K1/00 , H05K1/02 , H05K3/00 , H05K3/02 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/28 , H05K3/38 , H05K3/40 , H05K3/42 , C25D5/02 , C25D5/56
CPC分类号： H05K3/4691 , H05K1/0393 , H05K3/0094 , H05K3/022 , H05K3/064 , H05K3/108 , H05K3/281 , H05K3/386 , H05K3/4076 , H05K3/426 , H05K3/427 , H05K2201/0154 , H05K2201/0352 , H05K2201/0355 , H05K2203/1394
摘要： A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented. The flexible circuit is made by providing through-holes (58) to a standard single sided laminate (50). Conductive material (60) is vacuum deposited into the through-holes and at the same time a conductive seed-layer is deposited on the polymer side of the standard laminate. Plating resist (62) is applied to both sides of the material and the seed-layer side of the material is patterned such that circuit traces, pads, and through-holes can be electroplated with additional copper (64). The plating resist (62) is stripped and the very thin layer of copper in the non-conductive areas is flash etched to produce semi-additive circuit features on the seed-layer side. Etch resist is then applied to both sides of the material and circuit patterns fabricated on the foil-side of the material. A cover film (66) and (68) coated with adhesive (70) and (72) is then provided over the exposed circuit patterns.
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72.发明公开Improved connector arrangement system and interconnect element 失效Verbessertes Steckverbindungssystem und Zwischenverbindungselement。
公开(公告)号：EP0433997A2
公开(公告)日：1991-06-26
申请号：EP90124614.0
申请日：1990-12-18
申请人： ROGERS CORPORATION
CPC分类号： H01R12/52 , H01R12/714 , H05K3/325 , H05K3/368
摘要： A circuit board electrical interconnection system, including improved, elongated, bodily-rotatable interconnect elements, is disclosed. Each element has tab portions projection angularly from the opposing ends of the element, which tab portions define a pair of pad engagement surfaces. The pad engagement surfaces engage corresponding contact pads on opposing surfaces of two circuit boards by means of elastic support member. The element is divided longitudinally, axially or laterally into a plurality of sectors. Some sectors are electrically conductive, while others have other electrically predetermined characteristics. The two types of sectors are arranged in an alternating patter. The non-conducting sectors may be comprised of insulative, resistive or capacitive materials.
摘要翻译： 公开了一种电路板电互连系统，包括改进的，细长的，可以旋转的互连元件。 每个元件具有从元件的相对端成角度地突出的突片部分，该突片部分限定一对垫接合表面。 焊盘接合表面通过弹性支撑构件接合两个电路板的相对表面上的对应接触焊盘。 该元件纵向，轴向或侧向划分为多个扇形。 一些扇区是导电的，而另一些扇区具有其它电预定特性。 两种类型的扇区以交替的方式排列。 非导电扇区可以由绝缘，电阻或电容材料组成。
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73.发明公开Glass fiber reinforced fluoropolymeric circuit laminate 失效Mit Glasfasernverstärktes氟聚合物 - Schaltungslaminat。
公开(公告)号：EP0313961A2
公开(公告)日：1989-05-03
申请号：EP88117300.9
申请日：1988-10-18
申请人： ROGERS CORPORATION
CPC分类号： B32B15/04 , B32B5/024 , B32B5/26 , B32B15/14 , B32B15/20 , B32B27/322 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2457/08 , H05K1/036 , H05K1/167 , H05K2201/015 , H05K2201/0251 , Y10S428/901 , Y10T428/24917 , Y10T428/252 , Y10T428/254 , Y10T428/26 , Y10T428/31544 , Y10T442/3439
摘要： A fluoropolymeric circuit laminate consisting of one or more layers of fluoropolymer impregnated woven glass cloth (18) sandwiched between one or more layers (14,16) of "random" microfiberglass reinforced fluoropolymer is presented. This composite of fluoropolymer, woven glass fabric and random glass microfibers may be clad on one or both outer surfaces with a suitable conductive material (20,22) such as copper or certain known resistive foils.
摘要翻译： 提供了由夹在“随机”微纤维增强的含氟聚合物的一层或多层（14,16）之间的一层或多层含氟聚合物浸渍的玻璃布（18）组成的含氟聚合物电路层叠体。 氟聚合物，玻璃织物和无规玻璃微纤维的这种复合材料可以用合适的导电材料（例如铜或某些已知的电阻箔）覆盖在一个或两个外表面上。
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公开(公告)号：EP0269679A1
公开(公告)日：1988-06-08
申请号：EP87903636.0
申请日：1987-05-19
申请人： ROGERS CORPORATION
CPC分类号： H05K7/1053 , H05K1/141 , H05K3/365
摘要： Un système connecteur électrique à haute fréquence pour l'interconnexion électrique de premier et second éléments de circuit correspondants comprend un premier réseau plan (14) de bornes de contact de type bloc disposées sur un substrat (11) et connectées à un premier circuit sur le substrat, conjointement avec une première structure de guidage (18) adjacente au premier réseau de bornes de contact. Un second réseau (40) de bornes de contact de type bloc est monté sur une structure de support de contact rigide non-conductrice (42) qui comprend un support de réseau de bornes de contact élastique (74), une structure de came (90) et une seconde structure de guidage (84, 86) coopérant avec la première structure de guidage. La structure de support de contact est couplée de manière élastique à une structure porteuse (44) qui comprend une structure de came (56) coopérant avec la première. Une structure d'interconnexion multiconducteur flexible (36) possède une extrémité connectée électriquement à un circuit électrique fixé sur la structure porteuse et son autre extrémité connectée à des bornes correspondantes du second réseau. Une structure d'attache (88) est adaptée pour fixer la structure porteuse et le substrat ensemble avec les structures de guidage par engagement. Lorsque la structure d'attache déplace la structure porteuse vers le substrat, les structures de came interagissent et déplacent la structure de support de contact latéralement (parallèlement au plan des réseau de contact) avec une action de came transversale, dirigée par les première et seconde structures de guidage engagées, pour enlever les débrits ou autres corps étrangers (tels que des films corrosifs) qui peuvent affecter le rendement du circuit électrique.
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75.发明公开
公开(公告)号：EP0148719A1
公开(公告)日：1985-07-17
申请号：EP84630172.9
申请日：1984-11-14
申请人： ROGERS CORPORATION
发明人： Frayer, Paul D.
CPC分类号： C08K5/3415 , C08L79/08
摘要： A high temperature processing aid for melt processing polyimide polymers and a method of doing same wherein a pyrrolidone based high boiling point solvent is added to a polyimide polymer in amounts sufficient to lower the glass transition temperature of said polyimide.
摘要翻译： 用于熔融加工聚酰亚胺聚合物的高温加工助剂及其制备方法，其中吡咯烷酮基高沸点溶剂以足以降低所述聚酰亚胺的玻璃化转变温度的量加入到聚酰亚胺聚合物中。
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公开(公告)号：EP4402747A1
公开(公告)日：2024-07-24
申请号：EP22783635.0
申请日：2022-09-14
申请人： Rogers Corporation
发明人： CLAVIJO, Sergio , SANFORD, John , SPRENTALL, Karl Edward , BAARS, Dirk , SPINK, Jared Kenneth , BHAT, Pramod Srinivas
CPC分类号： H01Q13/20 , H01Q1/2283 , H01P3/123 , H01P5/107
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公开(公告)号：EP4380793A1
公开(公告)日：2024-06-12
申请号：EP22812880.7
申请日：2022-10-21
申请人： Rogers Corporation
发明人： DECELLES, Loni , PUGLISI, Joseph
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公开(公告)号：EP4380792A1
公开(公告)日：2024-06-12
申请号：EP22812879.9
申请日：2022-10-21
申请人： Rogers Corporation
发明人： DECELLES, Loni , PUGLISI, Joseph
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公开(公告)号：EP4279278A2
公开(公告)日：2023-11-22
申请号：EP23200317.8
申请日：2020-05-29
申请人： Rogers Corporation
IPC分类号： B33Y80/00
摘要： A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22°C, determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23°C.
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公开(公告)号：EP3935677A1
公开(公告)日：2022-01-12
申请号：EP20727114.9
申请日：2020-05-04
申请人： Rogers Corporation
发明人： WANG, Wei , WEI, Ming , BAKER, David William
IPC分类号： H01M2/02
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