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    ALL REFLECTIVE WAFER DEFECT INSPECTION AND REVIEW SYSTEMS AND METHODS
    72.
    发明公开
    ALL REFLECTIVE WAFER DEFECT INSPECTION AND REVIEW SYSTEMS AND METHODS 审中-公开

    公开(公告)号：EP3213342A4

    公开(公告)日：2018-06-06

    申请号：EP16759622

    申请日：2016-03-04

    申请人： KLA TENCOR CORP

    发明人： ZHANG SHIYU ,  ZHAO WEI

    IPC分类号： H01L21/66 ,  G02B13/14 ,  G02B17/06

    CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8845 ,  G02B13/143 ,  G02B17/0652 ,  G03F1/84 ,  G03F7/7065

    摘要： Disclosed are methods and apparatus for reflecting, towards a sensor, an Infrared to vacuum ultra-violet (VUV) light that is reflected from a target substrate. The system includes a first mirror arranged to receive and reflect the Infrared to VUV light that is reflected from the target substrate and a second mirror arranged to receive and reflect Infrared to VUV light that is reflected by the first mirror. The first and second mirrors are arranged and shaped so as to reflect Infrared to VUV light from the target substrate towards an optical axis of the apparatus. In another embodiment, the apparatus can also include a third mirror arranged to receive and reflect the Infrared to VUV light that is reflected by the second mirror and a fourth mirror arranged to receive and reflect such illuminating light that is reflected by the third mirror towards the sensor. In one more embodiment, a reflecting or refracting optics is used to relay the image by above optics to the sensor; various magnification is achieved by adjusting the distance between the intermediate image and the relay optics.

    SYSTEM AND METHOD FOR DEFECT DETECTION AND PHOTOLUMINESCENCE MEASUREMENT OF A SAMPLE
    75.
    发明公开
    SYSTEM AND METHOD FOR DEFECT DETECTION AND PHOTOLUMINESCENCE MEASUREMENT OF A SAMPLE 审中-公开
    系统摄影师ZUR FEHLERERKENNUNG发光二极管

    公开(公告)号：EP3014654A1

    公开(公告)日：2016-05-04

    申请号：EP14818432.8

    申请日：2014-06-25

    申请人： KLA-Tencor Corporation

    发明人： SAPPEY, Romain

    IPC分类号： H01L21/66

    CPC分类号： G01N21/6489 ,  G01N21/8806 ,  G01N21/9501 ,  G01N2021/6495 ,  G01N2021/8845 ,  G01N2201/06113 ,  G01N2201/0662

    摘要： Defect detection and photoluminescence measurement of a sample directing a beam of oblique-illumination wavelength light onto a portion of the sample, directing a beam of normal-illumination wavelength light for causing one or more photoluminescing defects of the sample to emit photoluminescent light onto a portion of the sample, collecting defect scattered radiation or photoluminescence radiation from the sample, separating the radiation from the sample into a first portion of radiation in the visible spectrum, a second portion of radiation including the normal-illumination wavelength light, and at least a third portion of radiation including the oblique-illumination wavelength light, measuring one or more characteristics of the first portion, the second portion or the third portion of radiation; detecting one or more photoluminescence defects or one or more scattering defects based on the measured one or more characteristics of the first portion, the second portion or the third portion of radiation.

    摘要翻译： 样品的缺陷检测和光致发光测量将倾斜照明波长的光束引导到样品的一部分上，引导正常照明波长的光束，以引起样品的一个或多个光致发光缺陷将光致发光光发射到部分上 从样品收集缺陷散射辐射或光致发光辐射，将来自样品的辐射分离成可见光谱中的第一辐射部分，包括正常照明波长的光的第二部分辐射，以及至少第三个 测量包括倾斜照明波长光的辐射部分，测量第一部分，第二部分或第三部分辐射的一个或多个特性; 基于所测量的第一部分，第二部分或第三部分辐射的一个或多个特性来检测一个或多个光致发光缺陷或一个或多个散射缺陷。

    METHOD FOR INSPECTING FOR FOREIGN SUBSTANCE ON SUBSTRATE
    78.
    发明公开
    METHOD FOR INSPECTING FOR FOREIGN SUBSTANCE ON SUBSTRATE 审中-公开
    VERFAHREN ZUR INSPEKTION VON FREMDSUBSTANZEN AUF EINEM SUBSTRAT

    公开(公告)号：EP2982969A1

    公开(公告)日：2016-02-10

    申请号：EP14778804.6

    申请日：2014-04-01

    申请人： Kohyoung Technology Inc.

    发明人： LEE, Hyun-Seok ,  YANG, Jae-Sik ,  KIM, Ja-Geun ,  KIM, Hee-Tae ,  YOU, Hee-Wook

    IPC分类号： G01N21/88 ,  G01N21/94

    CPC分类号： G01N21/94 ,  G01N21/8806 ,  G01N2021/8845 ,  G01N2021/95638 ,  G01N2201/061 ,  G01N2201/13 ,  G06T7/001 ,  G06T11/60 ,  G06T2207/10004 ,  G06T2207/10024 ,  G06T2207/30141

    摘要： In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.

    摘要翻译： 为了检查基板，显示在施加焊料之前的基板的图像信息。 然后，对基板上的至少一个检查区域进行图像拍摄，以获得被图像捕获的检查区域的图像。 然后，更新要显示的图像信息，并显示更新的图像信息。 并且，为了检查异物，将检查区域的所得图像与基板的参考图像进行比较。 因此，操作者能够容易地捕捉与显示的图像的特定区域对应的区域，容易地检测基板上的异物。

    SYSTEMS AND METHODS FOR SAMPLE INSPECTION AND REVIEW
    79.
    发明公开
    SYSTEMS AND METHODS FOR SAMPLE INSPECTION AND REVIEW 审中-公开
    系统和方法样本分析与评价

    公开(公告)号：EP2836823A1

    公开(公告)日：2015-02-18

    申请号：EP13775290.3

    申请日：2013-04-08

    申请人： Kla-Tencor Corporation

    发明人： LEWIS, Isabella ,  BOBROV, Yakov

    IPC分类号： G01N21/88 ,  H01L21/66

    CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N2021/8845

    摘要： The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

    LARGE PARTICLE DETECTION FOR MULTI-SPOT SURFACE SCANNING INSPECTION SYSTEMS
    80.
    发明公开
    LARGE PARTICLE DETECTION FOR MULTI-SPOT SURFACE SCANNING INSPECTION SYSTEMS 审中-公开
    大颗粒的曲面多点抽样检验系统PROOF

    公开(公告)号：EP2745312A1

    公开(公告)日：2014-06-25

    申请号：EP12823532.2

    申请日：2012-08-03

    申请人： Kla-Tencor Corporation

    发明人： REICH, Juergen ,  AMSDEN, Charles ,  ZHANG, Jiayao ,  WOLTERS, Christian

    IPC分类号： H01L21/66

    CPC分类号： G01N21/9501 ,  G01N21/94 ,  G01N2021/555 ,  G01N2021/8835 ,  G01N2021/8845 ,  G01N2201/103 ,  H01L22/12

    摘要： The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.