公开(公告)号：EP3427288B1

公开(公告)日：2021-04-28

申请号：EP17764154.5

申请日：2017-03-09

发明人： YAMAMURA, Mayu Felicia ,  FUNG, Jason Garcheung ,  REDFIELD, Daniel ,  BAJAJ, Rajeev ,  NG, Hou T.

IPC分类号： H01L21/306 ,  H01L21/304 ,  H01L21/321 ,  B24D18/00 ,  B29C64/165 ,  G01B11/24 ,  B29C64/112 ,  B29C64/393 ,  B24B37/20 ,  B24B37/26

公开(公告)号：EP3608058B1

公开(公告)日：2021-04-21

申请号：EP19189472.4

申请日：2019-07-31

发明人： CAMPO, Antonino

IPC分类号： B24B37/04 ,  B24B49/10 ,  B24B49/14 ,  H01L21/67

公开(公告)号：EP3801983A1

公开(公告)日：2021-04-14

申请号：EP19737215.4

申请日：2019-05-21

申请人： PBMC SA

发明人： MUNIER, Denis ,  MOLLARD, Doniphan

IPC分类号： B24B37/28 ,  B24B37/30 ,  B24B37/34 ,  H01L21/673 ,  H01L21/677 ,  B24B7/17 ,  B24B41/06 ,  B24B7/16 ,  B24B41/00

公开(公告)号：EP3279142B1

公开(公告)日：2021-01-06

申请号：EP16773048.0

申请日：2016-03-30

发明人： TAWARAZAKO, Yuji ,  WAKAMIYA, Yoshinori ,  KASHIWADA, Shingo ,  INOUE, Kazuaki ,  NAKAYAMA, Kazuhiro ,  KOMATSU, Michio

IPC分类号： B24B37/00 ,  C09G1/02 ,  C01F17/32 ,  C01B33/12 ,  H01L21/304 ,  C09K3/14

公开(公告)号：EP3708631A1

公开(公告)日：2020-09-16

申请号：EP20167117.9

申请日：2010-03-12

申请人： Saint-Gobain Ceramics & Plastics Inc.

发明人： WANG, Jun ,  LACONTO, Ronald ,  HAERLE, Andrew

IPC分类号： C09K3/14 ,  B24B37/00 ,  C09G1/02 ,  H01L21/02 ,  H01L29/16 ,  C01B32/25

摘要： A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 Å/min to achieve a Ra of not greater than about 5.0 Å. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt% water.

公开(公告)号：EP3706954A1

公开(公告)日：2020-09-16

申请号：EP18873683.9

申请日：2018-10-29

申请人： Axus Technology, LLC

发明人： TROJAN, Daniel Ray

IPC分类号： B24B37/00 ,  C23G1/00 ,  H01J37/00 ,  H01L21/00

公开(公告)号：EP3124570B1

公开(公告)日：2020-09-09

申请号：EP15769785.5

申请日：2015-01-30

申请人： Fujimi Incorporated

发明人： YOKOTA, Shuugo ,  SUZUKI, Shota ,  AKATSUKA, Tomohiko ,  YAMATO, Yasuyuki ,  SAKABE, Koichi ,  IZAWA, Yoshihiro ,  YOSHIZAKI, Yukinobu ,  SAITO, Chiaki

IPC分类号： C09K3/14 ,  B24B37/00 ,  H01L21/304

公开(公告)号：EP2628567B1

公开(公告)日：2020-09-02

申请号：EP11832479.7

申请日：2011-10-06

申请人： Fujimi Incorporated

发明人： ASHITAKA, Keiji ,  MORINAGA, Hitoshi ,  YASUI, Akihito

IPC分类号： B24B37/00 ,  C09K3/14 ,  H01L21/304 ,  C09G1/02 ,  H01L21/3105

公开(公告)号：EP3611758A1

公开(公告)日：2020-02-19

申请号：EP18784515.1

申请日：2018-03-19

申请人： Mitsubishi Cable Industries, Ltd. ,  Akros Co., Ltd.

发明人： YASUDA Hiroaki ,  HAMAMURA Takehiro ,  MAKINO Shin ,  KUBOKURA Yuzuru

IPC分类号： H01L21/304 ,  B24B37/30 ,  H01L21/683

摘要： A wafer-retaining elastic film (10) of a CMP device includes: a film body (11) comprised of an elastic material; and a coating layer (12) formed so as to cover the surface on the wafer retaining side of the film body (11). The coating layer (12) contains a polymeric binder and nonmetallic particles dispersed in the polymeric binder.

公开(公告)号：EP3608058A1

公开(公告)日：2020-02-12

申请号：EP19189472.4

申请日：2019-07-31

申请人： Mole Abrasivi Ermoli S.r.l.

发明人： CAMPO, Antonino

IPC分类号： B24B37/04 ,  B24B49/10 ,  B24B49/14 ,  H01L21/67

摘要： The present invention concerns a grinding system, comprising a grinding wheel and a grinder. The grinder (30) comprising an actuating arm (30) adapted to receive an abrasive grinding wheel (1), an actuator (33) coupled to the actuating arm (31) to rotatably drive or translate it along a driving axis, and a transceiver unit (39) adapted to receive and transmit electromagnetic signals. The abrasive grinding wheel (1) is fixed to the actuating arm (31) of the grinding machine (30), the grinding wheel (1) comprising a body (10) which has at least one abrasive surface (13) intended to come into contact with a workpiece to be machined, and an electronic unit (20) coupled to the body (10). The transceiver unit (39) is located in the grinder (30) so as to be separated from the abrasive grinding wheel (1) and comprises at least one resonant circuit (391), while the electronic unit (20) of the grinding wheel (1) comprises a further resonant circuit (271) having a resonance frequency equal to or more or less 15% different from the resonance frequency of the at least one resonant circuit (391) of the transceiver unit (39). The grinder further comprises a movement means suitable for moving the transceiver unit (39) along an axis parallel to the driving axis of the actuating arm (31), so as to maintain the at least one resonance circuit (391) of the grinder and the further resonance circuit (271) of the grinding wheel (1) aligned during a translation of the actuating arm.