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    Silicone material for protecting electronic devices, circuit module using the same and manufacturing method of circuit module
    82.
    发明公开
    Silicone material for protecting electronic devices, circuit module using the same and manufacturing method of circuit module 审中-公开
    有机硅材料，以保护电子器件，电路模块和制造工艺，使得开关模块

    公开(公告)号：EP2876138A1

    公开(公告)日：2015-05-27

    申请号：EP14193750.8

    申请日：2014-11-18

    申请人： Samsung SDI Co., Ltd.

    发明人： Shin, Kyungjae ,  Kim, Kiwoong

    IPC分类号： C08L83/04

    CPC分类号： C09D5/00 ,  C08J3/243 ,  C08K5/0025 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/385 ,  C08L83/04 ,  H01L23/296 ,  H05K1/0259 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10181

    摘要： Silicone material for protecting electronic devices, which has conformally coating, damp-proofing, vibration absorbing, thermally conducting and electrostatic discharge (ESD) protecting functions, and is cured within 60 seconds, a circuit module using the same, and a manufacturing method of the circuit module. The silicone material includes a base resin, a thermal initiator, and a photoinitiator. In addition, the circuit module includes a printed circuit board having a plurality of circuit patterns formed on an insulating layer, a plurality of electronic devices electrically connected to the circuit patterns by solders, and the silicone material coated on at least one of the circuit patterns, the solders and the electronic devices. Further, the manufacturing method of the circuit module includes providing a printed circuit board having a plurality of circuit patterns formed on an insulating layer and electrically connecting a plurality of electronic devices to the circuit patterns by solders, coating silicone material on at least one of the circuit patterns, the solders and the electronic devices, and curing the silicone material using light and heat.

    摘要翻译： 硅树脂材料用于保护电子器件，其具有保形涂层，防潮，吸收振动，热传导和静电放电（ESD）保护功能，并在60秒内固化，使用其的电路模块，并且所述制造方法 电路模块。 硅酮材料包括基础树脂，热引发剂和光引发剂。 此外，该电路模块包括具有电路图案的多个印刷电路板形成在与绝缘层，电连接到通过焊料中的电路图案的电子设备的多个，并且涂覆在电路图案中的至少一种硅树脂材料 中，软钎料的电子器件。 此外，电路模块的制造方法包括提供具有电路图案的多个印刷电路板上形成上绝缘层和电连接电子装置通过焊料中的电路图案的复数，上的至少一个涂布硅酮材料 电路图案，所述软钎料的电子器件，以及使用光，热固化所述有机硅材料。

    HEAT INSULATION MATERIAL FOR AGRICULTURAL AND HORTICULTURAL FACILITY
    88.
    发明公开
    HEAT INSULATION MATERIAL FOR AGRICULTURAL AND HORTICULTURAL FACILITY 有权
    WÄRMEISOLIERMATERIALFÜREINE LANDWIRTSCHAFTS- UND GARTENBAUEINRICHTUNG

    公开(公告)号：EP1541012A1

    公开(公告)日：2005-06-15

    申请号：EP02760684.7

    申请日：2002-08-21

    申请人： SUMITOMO METAL MINING COMPANY LIMITED

    发明人： TAKEDA, Hiromitsu c/o Central Research Laboratory

    IPC分类号： A01G9/14 ,  A01G13/02

    CPC分类号： A01G9/22 ,  A01G9/1438 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2231 ,  Y02A40/252 ,  Y02A40/258 ,  Y10T428/25 ,  Y10T428/256

    摘要： A heat shielding material for use in an agricultural and horticultural facility according to the present invention includes a heat shielding layer containing a base resin, and a heat shielding filler in the form of microparticles dispersed in the base resin, wherein the heat shielding filler is at least one selected from lanthanum hexaboride and antimony-doped tin oxide. This heat shielding material for use in an agricultural and horticultural facility has a solar radiation transmittance of 10 to 80%, this transmittance being taken as a reference index for evaluating the level of a heat shielding property, a visible light transmittance of 30 to 90%, and a light transmittance of 5 to 80% at a 320 nm wavelength and a light transmittance of 0 to 70% at a 290 nm wavelength, respectively, in an ultraviolet region.

    摘要翻译： 根据本发明的用于农业和园艺设施的隔热材料包括含有基础树脂的隔热层和分散在基础树脂中的微粒形式的隔热填料，其中隔热填料在 选自六硼化镧和锑掺杂氧化锡中的至少一种。 用于农业园艺设备的隔热材料的太阳辐射透射率为10〜80％，该透射率作为评价遮光性能的参考指标，可见光透射率为30〜90％ ，紫外线区域的波长为290nm时的透光率为320nm，光透射率为0〜70％。