公开(公告)号：EP2635630A1

公开(公告)日：2013-09-11

申请号：EP11785850.6

申请日：2011-11-03

Applicant: Dow Global Technologies LLC

Inventor： EATON, Robert F. ,  GHOSH-DASTIDAR, Abhijit ,  CHAUDHARY, Bharat I. ,  COGEN, Jeffrey M. ,  LAUFER, Caroline H.

IPC: C08K5/1515

CPC classification number: C08K5/1515 ,  C08K2201/014 ,  H01B3/308 ,  C08L27/06

Abstract: The disclosure is directed to a plasticizer system with improved electrical properties. The plasticizer system includes (a) a primary plasticizer consisting of an epoxidized vegetable oil and (b) a secondary plasticizer consisting of an epoxidized fatty acid ester, where the primary plasticizer is present in an amount greater than 50% by weight of the total plasticizer system weight.

公开(公告)号：EP2632978A1

公开(公告)日：2013-09-04

申请号：EP11785793.8

申请日：2011-10-21

Applicant: SABIC Innovative Plastics IP B.V.

Inventor： JIANG, Siguang ,  MENG, Jiru ,  ZOU, David Xiangping

IPC: C08K3/22

CPC classification number: C08K3/22 ,  C08K3/26 ,  C08K3/30 ,  C08K2003/2237 ,  C08K2003/2296 ,  C08K2003/265 ,  C08K2003/3045 ,  C08K2201/014

Abstract: Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions of the present invention include a thermoplastic base resin, a laser direct structuring additive and a white pigment. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.

Abstract translation: 能够用于激光直接结构化工艺以提供增强的电镀性能和良好机械性能的热塑性组合物。 本发明的组合物包括热塑性基础树脂，激光直接结构化添加剂和白色颜料。 组合物可以用于各种应用，例如个人计算机，笔记本和便携式计算机，蜂窝电话天线和其它这样的通信设备，医疗应用，RFID应用和汽车应用。

公开(公告)号：EP2155823B1

公开(公告)日：2013-06-05

申请号：EP08756752.5

申请日：2008-06-06

Applicant: Dow Corning Corporation

Inventor： CHORVATH, Igor ,  DEGROOT, JR., Jon, Vierling ,  DIPINO, Michael ,  DRAKE, Robert, Andrew ,  LAWSON, David, W. ,  ROBSON, Steven ,  SHAWL, David ,  TONGE, Lauren, Marie

IPC: C08K3/04 ,  C08K3/22 ,  C08L83/08 ,  C08K3/00 ,  C08K3/26

CPC classification number: C08L83/08 ,  C08K3/04 ,  C08K3/22 ,  C08K3/26 ,  C08K2003/2265 ,  C08K2003/2296 ,  C08K2003/265 ,  C08K2201/014 ,  Y10T428/1393

公开(公告)号：EP1674447B1

公开(公告)日：2013-05-08

申请号：EP04792514.4

申请日：2004-10-08

Applicant: NEW JAPAN CHEMICAL CO., LTD.

Inventor： KITAGAWA, Hiroshi ,  ISHIKAWA, Masahide ,  UEOKA, Chiaki ,  NIGA, Sukehiro ,  UCHIYAMA, Yohei

IPC: C07C233/06 ,  C08K5/20 ,  C08L23/00

CPC classification number: C08K5/20 ,  C07C233/06 ,  C08K2201/014 ,  C08L23/02 ,  C08L2666/18 ,  C08K5/098 ,  C08L23/10 ,  C08K5/49

公开(公告)号：EP2450401B1

公开(公告)日：2013-04-17

申请号：EP12000150.8

申请日：2009-09-04

Applicant: THOR GmbH

Inventor： Butz, Volker, Dr.

IPC: C08K5/5317 ,  C08K5/5357 ,  C08K5/00 ,  C08K5/3492

CPC classification number: C08K5/5353 ,  C08K5/357 ,  C08K5/527 ,  C08K5/5317 ,  C08K2201/014

公开(公告)号：EP2468813B1

公开(公告)日：2013-03-27

申请号：EP10015974.8

申请日：2010-12-22

Applicant: Borealis AG

Inventor： Nylander, Perry

IPC: C08K5/00 ,  C08K5/14 ,  H01B9/00 ,  B32B27/32

CPC classification number: C08K5/0025 ,  C08K5/14 ,  C08K2201/014 ,  C08L23/04

公开(公告)号：EP2424918A4

公开(公告)日：2013-03-27

申请号：EP10770298

申请日：2010-04-29

Applicant: HENKEL CORP ,  LOCTITE R & D LTD

Inventor： MESSANA ANDREW ,  KLEMARCZYK PHILIP ,  JACOBINE ANTHONY F ,  BIRKETT DAVID P ,  WYER MARTIN

IPC: C08G61/12 ,  C07D209/08 ,  C07D215/04 ,  C08G73/06 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/34 ,  C08L33/06

CPC classification number: C08K5/34 ,  C07D209/08 ,  C07D215/04 ,  C08K5/1515 ,  C08K2201/014

公开(公告)号：EP2557117A1

公开(公告)日：2013-02-13

申请号：EP11177307.3

申请日：2011-08-11

Applicant: Borealis AG

Inventor： Grestenberger, Georg ,  Bernreitner, Klaus ,  Simon, Sybille ,  Reisecker, Michael

IPC: C08L23/10

CPC classification number: C08K5/20 ,  C08K3/34 ,  C08K2201/014 ,  C08L23/06 ,  C08L23/10 ,  C08L23/12 ,  C08L23/14 ,  C08L23/142 ,  C08L23/16 ,  C08L2207/02 ,  C08L2666/08 ,  C08L2666/06

Abstract: Composition comprising a heterophasic propylene copolymer and two different slip agents, namely
- a fatty acid amid derivative of formula (I)

wherein
R 1 is a C 5 to C 25 alkyl residue or C 5 to C 25 alkenyl residue,
R 2 is a long-chain organic residue containing at least 6 carbon atoms, and
- an unsaturated fatty acid amide.

Abstract translation: 组合物包含多相丙烯共聚物和两种不同的增滑剂，即 - 的式（I）worin的R 1的脂肪酸酰胺衍生物是C 5至C 25的烷基残基或C 5至C残基链烯基25，R 2是一个长 α-链有机残基含有至少6个碳原子，和 - 在不饱和脂肪酸酰胺。

公开(公告)号：EP2555599A1

公开(公告)日：2013-02-06

申请号：EP11765641.3

申请日：2011-03-30

Applicant: Fujikura Co., Ltd.

Inventor： KOSHIMIZU, Kazutoshi

IPC: H05K1/09 ,  H01L23/12 ,  H05K3/12 ,  H05K3/28

CPC classification number: H01L23/4985 ,  C08F2222/1026 ,  C08K3/08 ,  C08K7/00 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/014 ,  C08K2201/016 ,  C09D4/00 ,  C09D11/52 ,  H01B1/22 ,  H01L21/4867 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4664 ,  H05K2201/0245 ,  H05K2201/0272 ,  H01L2924/00

Abstract: The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more.

Abstract translation: 本发明是一种具有绝缘基板和至少一个电路部分的膜布线板，所述电路部分设置在所述绝缘基板上并且通过用绝缘涂层涂覆由包含导电粒子的导电浆料形成的电路层而获得， 其中电路层含有凝胶分数为90％或更高的树脂组分。

公开(公告)号：EP1354906B1

公开(公告)日：2012-12-05

申请号：EP03007520.4

申请日：2003-04-01

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Maruo, Kazunobu, Mitsubishi Gas Chemical Co. Inc., ,  Kanda, Tomomichi, Mitsubishi Gas Chemical Co. Inc. ,  Yamamoto, Koji, Mitsubishi Gas Chemical Co. Inc.,

IPC: C08G69/02 ,  C08G69/04 ,  C08G69/26 ,  C08G69/28 ,  C08K5/51

CPC classification number: C08G69/28 ,  C08G69/02 ,  C08G69/04 ,  C08G69/26 ,  C08G69/265 ,  C08K5/51 ,  C08K2201/014 ,  Y10T428/13 ,  Y10T428/139 ,  Y10T428/31725 ,  C08L77/00