公开(公告)号：EP3307805A1

公开(公告)日：2018-04-18

申请号：EP16728796.0

申请日：2016-05-26

申请人： Cytec Industries Inc.

发明人： DYERS, Leon ,  BONNEAU, Mark, Richard ,  GRIFFIN, James, Martin

IPC分类号： C08G59/24 ,  C08K5/357

CPC分类号： C08L79/02 ,  C08G59/24 ,  C08J5/042 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/02 ,  C08K5/357 ,  C08L63/00

摘要： A curable resin composition capable of providing good OHC performance at elevated temperatures when used in polymer matrix composites. This resin composition includes, as major components, one or more multifunctional benzoxazine compounds and cycloaliphatic epoxy resin.

公开(公告)号：EP3004070B1

公开(公告)日：2017-10-11

申请号：EP13885964.0

申请日：2013-05-28

申请人： Empire Technology Development LLC

发明人： ADAM, Georgius Abidal ,  NEEDHAM, Scott Andrew

IPC分类号： C07D265/38 ,  A23B7/154 ,  C08K5/00 ,  A61Q19/08 ,  C07D209/36 ,  C07D307/91 ,  C07C65/105

CPC分类号： C07D307/77 ,  A23L3/3463 ,  A23L3/3526 ,  A23L3/3544 ,  A61K8/368 ,  A61K8/49 ,  A61K8/492 ,  A61K8/4973 ,  A61K2800/28 ,  A61K2800/522 ,  A61Q1/04 ,  A61Q1/06 ,  A61Q1/08 ,  A61Q1/10 ,  A61Q1/14 ,  A61Q3/02 ,  A61Q5/006 ,  A61Q5/02 ,  A61Q5/06 ,  A61Q5/065 ,  A61Q5/12 ,  A61Q19/00 ,  A61Q19/001 ,  A61Q19/04 ,  A61Q19/08 ,  A61Q19/10 ,  C07C65/105 ,  C07D209/36 ,  C07D265/38 ,  C07D307/91 ,  C07D413/14 ,  C08K5/1535 ,  C08K5/3417 ,  C08K5/357

摘要： Disclosed are antioxidative, natural compounds, their salts, chelates and cleavage derivatives that exhibit a superior combination of properties. The compounds can be used for a variety of purposes, including stabilizing foods, cosmetics, beverages and nutritional supplement. The compounds can be prepared by substantially cleaving a humic acid of formula I to provide at least one antioxidant compounds of formula II, formula III, formula IV, formula V, formula VI, salts, or chelates thereof.

公开(公告)号：EP3040358B1

公开(公告)日：2017-10-04

申请号：EP15163407.8

申请日：2015-04-13

申请人： Shengyi Technology Co., Ltd.

发明人： You, Jiang ,  Huang, Tianhui ,  Yang, Zhongqiang

IPC分类号： C08G59/40 ,  C08K5/35

CPC分类号： C08K5/357 ,  C08G59/4071 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K5/35 ,  C08L63/00

公开(公告)号：EP3083760B1

公开(公告)日：2017-09-13

申请号：EP14816039.3

申请日：2014-12-02

申请人： Cytec Industries Inc.

发明人： WARD, Steven Richard ,  CROSS, Paul Mark

IPC分类号： C08G73/06 ,  C07D265/16 ,  C08K5/357

CPC分类号： C08G73/0233 ,  C07D265/16 ,  C08K5/357 ,  D06M15/61 ,  Y10T428/249921

公开(公告)号：EP3004069B1

公开(公告)日：2017-04-19

申请号：EP13885836.0

申请日：2013-05-28

申请人： Empire Technology Development LLC

发明人： ADAM, Georgius Abidal ,  NEEDHAM, Anita

IPC分类号： C07D265/38 ,  C07D413/14 ,  C07D307/77 ,  C07D307/91

CPC分类号： C07D265/38 ,  C07D307/77 ,  C07D307/91 ,  C07D413/14 ,  C08K5/1535 ,  C08K5/357 ,  C09K15/06 ,  C09K15/30

摘要： Disclosed are antioxidative natural compounds, their salts, chelates and cleavage derivatives that exhibit a superior combination of properties. The compounds can be used for a variety of purposes, including the stabilization of polymers. The compounds can be prepared by substantially cleaving a humic acid of formula I followed by esterification to provide at least one antioxidant compounds of formula V, formula VI, formula VII, formula VIII, salts thereof, or chelates thereof.

公开(公告)号：EP2537898B1

公开(公告)日：2016-12-21

申请号：EP11744780.5

申请日：2011-02-14

申请人： Teijin Chemicals, Ltd.

发明人： TOGASHI Fumihiro ,  KOGA Takashi

IPC分类号： C08L69/00 ,  C08K3/24 ,  C08K5/357

CPC分类号： G02B1/04 ,  C08K5/357 ,  C08L69/00

公开(公告)号：EP2933293A4

公开(公告)日：2016-07-27

申请号：EP13863595

申请日：2013-02-07

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： HE YUESHAN ,  SU SHIGUO

IPC分类号： C08L63/00 ,  B32B15/092 ,  B32B27/06 ,  B32B27/38 ,  C08G59/50 ,  C08G59/62 ,  C08K5/357 ,  C08K5/5399 ,  C08K13/02 ,  C08L61/06 ,  C08L63/02 ,  H05K1/03

CPC分类号： C08L63/00 ,  B32B15/092 ,  B32B15/16 ,  B32B27/20 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2361/06 ,  C08J2363/00 ,  C08K5/357 ,  C08K5/5399 ,  C08L61/06 ,  C08L71/00 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L79/04 ,  C08L85/02

摘要： The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises:(A) a mixture of phenoxyphosphazene compound (A 1 ) and compound (A 2 ) having dihydrobenzoxazine ring: 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A 1 ) and the compound(A 2 ) having dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500 -2000: 10-45 parts by weight; (C) a phenolic resin: 10-25 parts by weight, and (D) an amine curing agent: 0.5-10 parts by weight. The prepreg, laminate, metal-clad laminate for printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low water absorption as well as low C.T.E.

公开(公告)号：EP2902847A4

公开(公告)日：2016-04-27

申请号：EP13840268

申请日：2013-09-11

申请人： TORAY INDUSTRIES

发明人： ONISHI HIROYUKI ,  MASUDA YUKI ,  TOMIKAWA MASAO

IPC分类号： G03F7/023 ,  C08G73/10 ,  C08L79/08 ,  G03F7/004

CPC分类号： G03F7/0233 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1075 ,  C08G73/1082 ,  C08G73/14 ,  C09D179/08 ,  G03F7/0226 ,  G03F7/40 ,  C08K5/22 ,  C08K5/357

摘要： The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250°C or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X 1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X 2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

公开(公告)号：EP2493966A4

公开(公告)日：2015-12-30

申请号：EP10827424

申请日：2010-10-27

申请人： AGENCY SCIENCE TECH & RES

发明人： CHOW EDWIN PEI YONG ,  YING JACKIE Y ,  PEK YURI SHONA

IPC分类号： C08J5/02 ,  C08F2/32 ,  C08F251/00 ,  C08K5/357 ,  C09K9/02 ,  G02C7/04

CPC分类号： G02B1/043 ,  B82Y20/00 ,  C08F299/065 ,  C08J9/283 ,  C08J2207/10 ,  C08J2333/10 ,  C08K5/0041 ,  C08K5/3412 ,  C08K5/357 ,  C09K9/02 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C08L71/02 ,  C08L33/10

公开(公告)号：EP2841500A4

公开(公告)日：2015-11-25

申请号：EP13780799

申请日：2013-04-18

申请人： HENKEL AG & CO KGAA ,  NAT UNIV CORP YOKOHAMA NAT UNI

发明人： HIRAO KOHEI ,  TAKAHASHI AKIO ,  OYAMA TOSHIYUKI ,  SCHOENFELD RAINER

IPC分类号： C08L63/00 ,  C08G59/40 ,  C08K5/357 ,  C08L25/00 ,  C08L33/04

CPC分类号： C08L79/02 ,  C08G59/4064 ,  C08G59/506 ,  C08K5/357 ,  C08L63/00 ,  C08L2205/03