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216 条记录 (耗时 0.012 秒)

    Dual wafer load lock
    83.
    发明公开
    Dual wafer load lock 审中-公开
    双晶片负载锁定

    公开(公告)号：EP1278230A3

    公开(公告)日：2004-02-18

    申请号：EP02254961.2

    申请日：2002-07-15

    申请人： Applied Materials, Inc.

    发明人： Kraus, Joseph Arthur ,  Strassner, James David

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67167 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67745 ,  Y10T29/413

    摘要： The disclosure relates to method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body (202) having a first port (238) disposed in a first wall (208) and a second port (239) disposed in a second wall that seals the chamber from the first and second environments. A cooling plate (280), a first substrate holder (204) and a second substrate holder (206) are disposed within the chamber body. The cooling plate is disposed at the bottom (216) of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window (250) is disposed in the top of the chamber body that allows a metrology device (428) to view the chamber volume.

    Semiconductor manufacturing equipment and maintenance method
    84.
    发明公开
    Semiconductor manufacturing equipment and maintenance method 审中-公开
    半导体制造装置和维护程序

    公开(公告)号：EP1345253A2

    公开(公告)日：2003-09-17

    申请号：EP03250994.5

    申请日：2003-02-18

    申请人： ASM JAPAN K.K.

    发明人： Yamagishi, Takayuki ,  Watanabe, Takeshi ,  Suwada, Masaei

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67196 ,  Y10S414/135

    摘要： The equipment comprises a semiconductor-processing device in which a load-lock chamber, a transfer chamber and a reaction chamber are modularized into, a main frame, a stand-alone chamber frame on which the semiconductor-processing device is placed, a sliding mechanism for enabling attaching/removing of the chamber frame to/from the main frame smoothly, and a positioning mechanism for fixing a position of the chamber frame. This enables the processing device to be attached and removed at will. The method comprises pulling out from the main frame the chamber frame, on which the modularized semiconductor-processing device is placed; forming a maintenance space inside the main frame; maintaining the semiconductor-processing device and peripherals attached in the vicinity of the main frame, and putting the chamber frame with the processing device back into the main frame.

    Substrate cleaning system
    86.
    发明公开
    Substrate cleaning system 有权
    Substratreinigungssystem

    公开(公告)号：EP1263022A1

    公开(公告)日：2002-12-04

    申请号：EP01113291.7

    申请日：2001-05-31

    申请人： S.E.S. Company Limited

    发明人： Ohkura, Ryoichi ,  Ono, Yuji ,  Yamaguchi, Hiroshi ,  Takaishi, Miyuki ,  Kamikochi, Hideo

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67196 ,  H01L21/67017 ,  H01L21/67766 ,  H01L21/67781 ,  Y10S134/902

    摘要： There is provided a substrate cleaning system which is capable of cleaning wafers W in a high cleanliness atmosphere with high accuracy taking an advantage of a sheet-type wet cleaning treatment, and which is simple and compact in construction, and is excellent in cost performance. The system comprises a system body 1 capable of being sealed, a loading/unloading booth A comprising a substrate carry-in section Aa in which a plurality of substrates are stocked and standby to be carried in before cleaning treatment is applied to them and a substrate carry-out section Ab in which a plurality of substrates are stocked and standby to be carried out after cleaning treatment is applied to them, a processing booth C provided with at least one sheet-type substrate cleaning chamber 10 in the cleaning treatment can be applied to a plurality of substrates by a plurality of cleaning solutions, and a robot booth B provided with a transport robot for transporting the substrates one by one between the processing booth C and the loading/unloading booth A, wherein the respective booths are partitioned by partition walls each having a required minimum cross sectional area.

    摘要翻译： 本发明提供一种基板清洗系统，其能够利用片式湿式清洗处理，以高精度清洁高洁净度的气氛中的晶片W，其结构简单，结构紧凑，成本性能优异。 该系统包括能够被密封的系统主体1，装载/卸载舱A包括基板搬入部分Aa，其中多个基板被备存并备用以在其施加清洁处理之前被携带，并且基板 在清洁处理之后，多个基板被放置待机待机的执行部分Ab被施加到清洁处理中的设置有至少一个片状基板清洁室10的处理室C可以被应用 通过多个清洁溶液到多个基板，以及设置有运送机器人的机器人展位B，用于在处理室C和装载/卸载间A之间逐一运送基板，其中相应的间隔被分隔开 墙壁各自具有所需的最小横截面面积。

    WAFER PROCESSING SYSTEM
    87.
    发明公开
    WAFER PROCESSING SYSTEM 审中-公开
    晶片处理系统

    公开(公告)号：EP1258028A2

    公开(公告)日：2002-11-20

    申请号：EP01912775.2

    申请日：2001-02-16

    申请人： Wafermasters, Incorporated

    发明人： YOO, Woo, Sik

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67748

    摘要： A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a 'single' chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

    Vacuum apparatus and method
    88.
    发明公开
    Vacuum apparatus and method 有权
    Vakuumvorrichtung und -Verfahren

    公开(公告)号：EP1195795A2

    公开(公告)日：2002-04-10

    申请号：EP01308428.0

    申请日：2001-10-02

    申请人： THE BOC GROUP, INC.

    发明人： Ramsay, Bruce Gordon

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67751 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67757 ,  H01L21/67766 ,  H01L21/68707 ,  Y02A50/412 ,  Y10S414/139 ,  Y10S414/14 ,  Y10S414/141

    摘要： A vacuum chamber used for processing articles, such as integrated circuit wafers, display panels, and the like, has a small load lock chamber formed at an opening in a wall of the chamber by a moveable article supporting surface within the chamber and a cover outside of the chamber. The supporting surface and cover are sealed to the chamber wall when urged against it. Articles placed into the load lock chamber, when the cover is opened, are moved into the vacuum chamber for processing by moving the supporting surface away from the wall after the cover has been closed and a vacuum established in the load lock chamber. Articles are removed from the vacuum chamber in a reverse manner. Various mechanisms are described for moving the articles, including a particular robotic device that simultaneously swaps the positions of two articles between the supporting surface and a processing location within the vacuum chamber by first pulling the articles together and then rotating them in a half-circle. Integrated circuit wafers are preferably carried on a domed surface formed of wedge shaped pieces fit together on a frame, where the wedge shaped pieces and their wafers are individually removable from the frame for transfer to another frame at a different location.

    摘要翻译： 用于处理诸如集成电路晶片，显示面板等的制品的真空室具有通过室内的可移动物品支撑表面形成在室的壁的开口处的小的负载锁定室， 的房间。 支撑表面和盖子在被推压时密封到室壁。 当盖子被打开时，通过在盖子被关闭并且在装载锁定室中建立真空物之后将支撑表面从墙壁移开而将盖子打开时放置到装载锁定室中的物品移动到真空室中以进行处理。 物品以相反的方式从真空室中取出。 描述了用于移动物品的各种机构，包括特定的机器人装置，其通过首先将物品拉在一起，然后以半圆形的方式旋转，同时在支撑表面和真空室内的处理位置之间交换两个物品的位置。 集成电路晶片优选地承载在由楔形块形成的圆顶表面上，所述楔形块在框架上装配在一起，其中楔形片和其晶片可从框架单独移除，以在不同位置转移到另一框架。

    VACUUM PROCESSING SYSTEM
    90.
    发明公开
    VACUUM PROCESSING SYSTEM 审中-公开
    VAKUUMPROZESSSYSTEM

    公开(公告)号：EP1146548A1

    公开(公告)日：2001-10-17

    申请号：EP99972368.7

    申请日：1999-11-17

    申请人： TOKYO ELECTRON LIMITED

    发明人： OZAWA, Jun ,  HIROSE, Jun ,  NARUSHIMA, Masaki;

    IPC分类号： H01L21/00 ,  H01L21/68

    CPC分类号： H01L21/67161 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67745 ,  Y10S414/139

    摘要： A vacuum process system comprises: a load port on which an object to be processed is set; a common transfer chamber disposed adjacent to the load port, having an internal space set at an atmospheric pressure level, and including a first transfer device that is movable and transfers the object into/from the load port, the first transfer device being disposed within the internal space; and a process unit having one process chamber for subjecting the object to a predetermined process, and a vacuum transfer chamber connected to the process chamber, having an internal space set at a vacuum pressure level, and including a second transfer device for transferring the object into/from the process chamber, the second transfer device being disposed within the internal space. The process units are individually connected to the common transfer chamber such that the process units are substantially parallel to each other. The vacuum chamber of each process unit is connected to the common transfer chamber. Each process unit extends linearly in a direction substantially perpendicular to the common transfer chamber. The object is transferred into/from the vacuum transfer chamber by means of the first transfer device.

    摘要翻译： 真空处理系统包括：设置有待处理物体的装载口; 设置在负载端口附近的公共传送室，其具有设定在大气压力水平的内部空间，并且包括第一传送装置，其可移动并将物体传送到/从装载端口传送，第一传送装置设置在 内部空间; 以及处理单元，其具有用于使物体进行预定处理的一个处理室和连接到处理室的真空传送室，其具有设置在真空压力水平的内部空间，并且包括用于将物体转移到第二传送装置 /从处理室，第二传送装置设置在内部空间内。 处理单元分别连接到公共传送室，使得处理单元基本上彼此平行。 每个处理单元的真空室连接到公共传送室。 每个处理单元在基本上垂直于公共传送室的方向上线性地延伸。 物体通过第一传送装置传送到/从真空传送室传送。